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SAF-XC164CS-16F40FBBTR

Infineon Technologies

SAF-XC164CS-16F40FBBTR by Infineon Technologies

SAF-XC164CS-16F40FBBTR by Infineon: 16-bit microcontroller with 131072 ROM words, 8192 RAM bytes, and 14-Ch 10-Bit ADC channels. Ideal for industrial applications requiring CAN, SPI, USART connectivity and operating at a max clock frequency of 16 MHz.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,000 parts In-Stock

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Vyrian

USA . 531 parts In-Stock

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Nova Conductors

Japan . 97 parts In-Stock

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AZTECH Wire

Italy . 531 parts In-Stock

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$6.378

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Ampacity Inc.

Singapore . 231 parts In-Stock

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$21.000

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Aztec Data Supply Inc.

USA . 4,896 parts In-Stock

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$35.260

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Corohmni

South Africa . 763 parts In-Stock

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Modulus Dynamics

Lithuania . 2,701 parts In-Stock

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$82.445

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$79.147

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$75.849

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$75.849

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Continental Prestige Electronics

USA . 4,542 parts In-Stock

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Bastille Electronics

Australia . 3,466 parts In-Stock

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Argo Parts USA

USA . 2,970 parts In-Stock

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Perfect Parts

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Corphita

USA . 20 parts In-Stock

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Overview

Unlock the power of innovation with the SAF-XC164CS-16F40FBBTR by Infineon Technologies. Known for their commitment to excellence, Infineon delivers top-quality microcontrollers that are versatile and reliable. This cutting-edge product is ideal for a wide range of applications, offering customers unmatched value and performance. Experience seamless connectivity, advanced peripherals, and efficient operation with this state-of-the-art microcontroller. Elevate your projects with the SAF-XC164CS-16F40FBBTR and witness the difference that superior technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Being made of plastic/epoxy makes the package lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 2.7 V

Operates within a safe voltage range and can be powered by common sources.

Address Bus Width: 24

Wide address bus width allows for efficient memory addressing and data transfer.

Package Shape: SQUARE

Square package shape facilitates easier PCB layout and integration.

Bit Size: 16

16-bit architecture enables processing of larger data sets and complex algorithms.

No. of Terminals: 100

Sufficient number of terminals for connecting peripherals and external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Compact and low profile package design for space-constrained applications.

Minimum Supply Voltage: 2.35 V

Can operate at low supply voltages, providing flexibility in power sources.

Maximum Operating Temperature: 85 °C

High operating temperature range suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for use in extreme conditions.

ADC Channels: YES

Integrated analog to digital converters for sensor interfacing and data acquisition.

Terminal Position: QUAD

Quad terminal position for easy soldering and connectivity.

ROM Words: 131072

Large ROM capacity for storing program code and data.

Maximum Seated Height: 1.6 mm

Low profile design for space-saving installations.

Width: 14 mm

Compact width for integration into small form factor devices.

External Data Bus Width: 16

16-bit external data bus for high-speed data transfer.

Peripherals: RTC, TIMER(11), WDT

Integrated RTC, multiple timers, and watchdog timer for added functionality.

Maximum Clock Frequency: 16 MHz

High clock frequency for fast processing and real-time applications.

Length: 14 mm

Compact length for space-efficient designs.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges.

Peripheral IC Type: MICROCONTROLLER

Microcontroller with integrated peripherals for standalone operation.

RAM Bytes: 8192

Sufficient RAM capacity for data storage and manipulation.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form for easy PCB mounting and reliability.

Analog To Digital Convertors: 14-Ch 10-Bit

Multiple 10-bit ADC channels for accurate analog signal conversion.

Nominal Supply Voltage: 2.5 V

Nominal voltage level for stable operation and power efficiency.

PWM Channels: YES

Pulse width modulation channels for precise control of digital signals.

Connectivity: CAN(2), SPI(2), USART(2)

Multiple communication interfaces for connecting to external devices.

ROM Programmability: FLASH

Flash programmable ROM for easy and flexible code updates.

Terminal Pitch: 0.5 mm

Fine pitch terminals for high-density PCB layouts.

Speed: 40 rpm

Operates at a speed of 40 rotations per minute for efficient data processing.

On Chip Program ROM Width: 8

8-bit on-chip program ROM width for storing instructions.

No. of I/O Lines: 79

Sufficient number of input/output lines for interfacing with external peripherals.

Technical Specifications

Microcontrollers SAF-XC164CS-16F40FBBTR attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

79

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.35 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), SPI(2), USART(2)

Peripherals:

RTC, TIMER(11), WDT

Analog To Digital Convertors:

14-Ch 10-Bit

Trade Compliance

SAF-XC164CS-16F40FBBTR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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