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SAF-XE167F-96F66LAC/TR

Infineon Technologies

SAF-XE167F-96F66LAC/TR by Infineon Technologies

Infineon's SAF-XE167F-96F66LAC/TR microcontroller features 16-bit size, 40 MHz clock frequency, and 24-bit address bus width. Ideal for applications requiring a max supply voltage of 1.6 V, with ADC channels and PWM support. Terminal pitch at 0.5 mm in a square package style with gull wing terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 910 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Digiode

USA . 164 parts In-Stock

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Semicontronic

India . 1,142 parts In-Stock

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$2.000

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$1.950

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$1.940

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$2.000

$1.950

$1.940

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Ampacity Inc.

Singapore . 173 parts In-Stock

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$11.000

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AZTECH Wire

Italy . 533 parts In-Stock

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$12.037

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533

$12.037

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Modulus Dynamics

Lithuania . 1,206 parts In-Stock

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$41.135

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$39.490

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$37.844

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1,206

$41.135

$39.490

$37.844

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Corohmni

South Africa . 13 parts In-Stock

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$78.498

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Continental Prestige Electronics

USA . 6,797 parts In-Stock

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Argo Parts USA

USA . 1,184 parts In-Stock

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Corphita

USA . 85 parts In-Stock

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Bastille Electronics

Australia . 82 parts In-Stock

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Overview

Unlock a world of possibilities with the SAF-XE167F-96F66LAC/TR microcontroller by Infineon Technologies. Designed for high-performance applications, this cutting-edge device offers unparalleled quality and reliability. From automotive to industrial automation, the SAF-XE167F-96F66LAC/TR delivers exceptional value with its advanced features and seamless integration. Experience the benefits of Infineon's expertise in microcontrollers and elevate your projects to new heights with this innovative solution.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and reducing production costs.

Maximum Supply Voltage: 1.6 V

Provides a suitable voltage range for the microcontroller to operate within, ensuring optimal performance and reliability.

Address Bus Width: 24

Enables the microcontroller to access a large memory space and handle complex data processing tasks efficiently.

Package Shape: SQUARE

Square shape package allows for compact and space-saving integration into electronic devices.

Bit Size: 16

Suitable for handling moderate complexity tasks while balancing performance and power consumption.

No. of Terminals: 144

Provides ample connectivity options for interfacing with external components and peripherals.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Offers flexibility in choosing the appropriate package style based on specific design requirements for heat dissipation, size constraints, and ease of manufacturing.

Minimum Supply Voltage: 1.4 V

Ensures the microcontroller can operate reliably even under lower power supply conditions, making it suitable for battery-operated devices.

ADC Channels: YES

Allows the microcontroller to interface with analog sensors and devices, enabling the conversion of analog signals into digital data for processing.

Terminal Position: QUAD

Quad terminal position facilitates easy placement and soldering onto the PCB, enhancing the overall manufacturing process efficiency.

Width: 20 mm

Compact width dimension makes it suitable for integration into space-constrained electronic devices and PCB layouts.

External Data Bus Width: 16

Provides a balance between data transfer speed and pin count, making it suitable for a wide range of applications requiring moderate data processing capabilities.

Maximum Clock Frequency: 40 MHz

Offers high-speed processing capabilities, suitable for applications requiring real-time data processing and control.

Length: 20 mm

Compact length dimension complements the width dimension, allowing for a space-efficient overall footprint on the PCB.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC-based architecture offers efficient and high-performance operation, making it suitable for various embedded system applications.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and ensures a reliable electrical connection, contributing to better overall product quality.

Nominal Supply Voltage: 1.5 V

Optimal voltage level for stable and consistent microcontroller operation, contributing to enhanced reliability and power efficiency.

PWM Channels: YES

Supports Pulse Width Modulation (PWM) output capabilities, essential for applications requiring precise control over analog signals and motor speed.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for higher density PCB designs, enabling the integration of more functionality within limited space constraints.

Speed: 66 rpm

Operating speed of 66 rpm ensures efficient data processing and task execution, suitable for a wide range of real-time applications.

No. of I/O Lines: 115

Abundance of I/O lines provides flexibility in connecting and communicating with external peripherals and devices, enhancing the overall functionality and versatility of the microcontroller.

Technical Specifications

Microcontrollers SAF-XE167F-96F66LAC/TR attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

Length:

20 mm

No. of I/O Lines:

115

No. of Terminals:

144

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Speed:

66 rpm

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

SAF-XE167F-96F66LAC/TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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