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SAF-XE167FH-200F100LAB

Infineon Technologies

SAF-XE167FH-200F100LAB by Infineon Technologies

Infineon's SAF-XE167FH-200F100LAB microcontroller features 16-bit CPU, 24-bit address bus, and 40 MHz clock frequency. Ideal for industrial applications requiring a high-speed RISC microcontroller with 115 I/O lines and PWM channels. Operates b/w -40 to 85 °C temperature range in a compact square package.

Median Price

$20.990

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$20.990

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10

$20.990

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Vyrian

USA . 1,347 parts In-Stock

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1,347

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Chip Stock

USA . 994 parts In-Stock

1+ parts

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994

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Digiode

USA . 636 parts In-Stock

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636

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,573 parts In-Stock

1+ parts

$6.000

100+ parts

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1,573

$6.000

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AZTECH Wire

Italy . 755 parts In-Stock

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$8.412

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755

$8.412

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Semicontronic

India . 1,246 parts In-Stock

1+ parts

$17.000

100+ parts

$16.575

1k+ parts

$16.490

10k+ parts

-

1,246

$17.000

$16.575

$16.490

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$20.570

100+ parts

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1k+ parts

$19.747

10k+ parts

-

100

$20.570

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$19.747

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Continental Prestige Electronics

USA . 6,159 parts In-Stock

1+ parts

$20.990

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$20.570

6,159

$20.990

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$20.570

Aztec Data Supply Inc.

USA . 162 parts In-Stock

1+ parts

$65.290

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162

$65.290

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Corohmni

South Africa . 49 parts In-Stock

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$77.580

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49

$77.580

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Modulus Dynamics

Lithuania . 2,754 parts In-Stock

1+ parts

$85.121

100+ parts

$81.716

1k+ parts

$78.311

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2,754

$85.121

$81.716

$78.311

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Argo Parts USA

USA . 4,253 parts In-Stock

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4,253

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Microchip USA

USA . 1,688 parts In-Stock

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1,688

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Robosynatics

Brazil . 1,145 parts In-Stock

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100+ parts

$59.391

1k+ parts

$58.179

10k+ parts

$58.179

1,145

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$59.391

$58.179

$58.179

Perfect Parts

USA . 560 parts In-Stock

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560

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Corphita

USA . 440 parts In-Stock

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440

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Overview

Unlock the power of innovation with the SAF-XE167FH-200F100LAB by Infineon Technologies. Designed with cutting-edge technology and superior quality, this microcontroller offers unmatched performance and reliability for a wide range of applications. From automotive to industrial automation, this product provides customers with the value, benefits, and advantages they need to stay ahead in today's competitive market. Trust in Infineon Technologies to deliver excellence in every aspect, driving your projects towards success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material contributes to a compact and reliable design.

Surface Mount: YES

Easier and more efficient assembly process during production.

Maximum Supply Voltage: 5.5 V

Allows for a wide range of acceptable input voltages for flexibility in different applications.

Address Bus Width: 24

Allows for access to a large memory address space.

Bit Size: 16

Balances between performance and power efficiency.

Power Supplies (V): 1.5,3.3/5

Supports various voltage requirements for different components or peripherals.

No. of Terminals: 144

Provides a high level of connectivity for interfacing with other devices.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Offers versatility in mounting options for different applications.

Minimum Supply Voltage: 3 V

Can operate efficiently at lower voltages, saving power.

Maximum Operating Temperature: 85 °C

Tolerates higher temperatures for reliability in various environments.

CPU Family: C166SV2

Part of a well-established and reliable CPU family for proven performance.

Minimum Operating Temperature: -40 °C

Capable of functioning in cold environments without issues.

Terminal Finish: TIN

Durable finish for reliable electrical connections.

ADC Channels: YES

Enables analog-to-digital conversion for sensing and control applications.

Terminal Position: QUAD

Optimal layout for efficient routing of connections.

ROM Words: 1638400

Large memory capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low profile design for compact and space-saving applications.

Width: 20 mm

Compact size for integration into various devices or systems.

External Data Bus Width: 16

Efficient data transfer capabilities for improved performance.

Maximum Clock Frequency: 40 MHz

High operating frequency for fast processing speeds.

Length: 20 mm

Compact dimensions for versatile placement in different designs.

Temperature Grade: INDUSTRIAL

Suitable for demanding industrial environments with wide temperature ranges.

Peripheral IC Type: MICROCONTROLLER, RISC

Features optimized for embedded control applications with efficient RISC architecture.

RAM Bytes: 14132

Adequate random access memory for processing data and instructions.

Technology: CMOS

Low power consumption and high noise immunity for reliable operation.

Terminal Form: GULL WING

Secure terminal layout for stable connections during operation.

Nominal Supply Voltage: 5 V

Standard voltage requirement for compatibility with common power sources.

PWM Channels: YES

Supports pulse-width modulation for precise control of connected devices.

ROM Programmability: FLASH

Easily reprogrammable memory for flexibility in updating software.

Terminal Pitch: 0.5 mm

Fine pitch for high-density terminal layout in a compact package.

Moisture Sensitivity Level (MSL): 3

Resistant to moisture ingress for reliability in various environmental conditions.

Speed: 100 rpm

Capable of processing data and instructions at a high rotational speed.

No. of I/O Lines: 115

Ample input and output lines for interfacing with external devices.

Technical Specifications

Microcontrollers SAF-XE167FH-200F100LAB attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

CPU Family:

C166SV2

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

115

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.5,3.3/5

Qualification:

Not Qualified

RAM Bytes:

14132

ROM Words:

1638400

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

100 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

SAF-XE167FH-200F100LAB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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