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SAF-XC167CI-16F40FBBTR

Infineon Technologies

SAF-XC167CI-16F40FBBTR by Infineon Technologies

Infineon's SAF-XC167CI-16F40FBBTR is a 16-bit microcontroller with 24-bit address bus width, operating at up to 16 MHz. Ideal for industrial applications, it features 16 ADC channels, 11 timers, and CAN, I2C, SPI, and USART connectivity options. With 131072 ROM words and 8192 RAM bytes, this low-profile chip offers versatile performance in a compact package.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,433 parts In-Stock

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1,433

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Digiode

USA . 875 parts In-Stock

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875

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Nova Conductors

Japan . 750 parts In-Stock

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750

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,527 parts In-Stock

1+ parts

$6.000

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1,527

$6.000

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AZTECH Wire

Italy . 651 parts In-Stock

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$9.067

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651

$9.067

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Modulus Dynamics

Lithuania . 70 parts In-Stock

1+ parts

$26.978

100+ parts

$25.899

1k+ parts

$24.820

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70

$26.978

$25.899

$24.820

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Continental Prestige Electronics

USA . 6,942 parts In-Stock

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6,942

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Argo Parts USA

USA . 1,434 parts In-Stock

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1,434

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Corphita

USA . 899 parts In-Stock

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899

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Overview

Discover the cutting-edge SAF-XC167CI-16F40FBBTR microcontroller by Infineon Technologies, a leader in semiconductor technology. Perfect for industrial applications, this high-quality device offers unparalleled performance and reliability. With features like 16-bit processing, 16 MHz clock frequency, and 16 ADC channels, this microcontroller provides endless possibilities for your projects. Experience seamless connectivity with CAN, I2C, SPI, and USART interfaces, as well as 103 I/O lines for enhanced flexibility. Trust Infineon Technologies to deliver innovative solutions that exceed expectations. Upgrade your designs today with the SAF-XC167CI-16F40FBBTR microcontroller!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy installation on PCBs, saving time and effort in assembly processes.

Maximum Supply Voltage: 2.7 V

Allows for low power operation, making it suitable for battery-powered applications.

Address Bus Width: 24

Provides a wide address range, allowing for flexibility in memory mapping and data access.

Package Shape: SQUARE

Space-efficient design that helps in compact PCB layouts and integration into small devices.

Bit Size: 16

Offers sufficient computational capabilities for a wide range of applications while being power-efficient.

No. of Terminals: 144

Provides ample I/O connections for interfacing with external devices and peripherals.

Minimum Supply Voltage: 2.35 V

Ensures stable operation even at lower supply voltages, enhancing reliability in varying conditions.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments where temperature fluctuations are common.

Minimum Operating Temperature: -40 °C

Can withstand extreme cold conditions, making it versatile for different use cases.

ADC Channels: YES

Allows for analog sensor interfacing, enabling the microcontroller to gather real-world data.

Terminal Position: QUAD

Facilitates easier soldering and PCB mounting, improving the manufacturability of the product.

ROM Words: 131072

Offers ample storage for program code and data, enabling complex applications to be run smoothly.

Maximum Seated Height: 1.6 mm

Low profile design enables slim and compact device designs, essential for portable electronics.

Width: 20 mm

Compact form factor for space-constrained applications, allowing for versatile placement on PCBs.

External Data Bus Width: 16

Efficient data transfer between the microcontroller and external memory or devices, enhancing overall performance.

Peripherals: RTC, TIMER(11), WDT

Integrated peripherals provide additional functionality for timekeeping, timers, and watchdog operation.

Maximum Clock Frequency: 16 MHz

Offers high processing speed for rapid execution of tasks, suitable for time-sensitive applications.

Length: 20 mm

Compact form factor for space-constrained applications, enabling versatile placement on PCBs.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges, ensuring consistent performance in harsh environments.

Peripheral IC Type: MICROCONTROLLER

Integrated microcontroller functionality reduces the need for additional components, simplifying the overall design.

RAM Bytes: 8192

Adequate RAM size for storing temporary data during program execution, enabling efficient multitasking capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminals provide secure solder joints for reliable connections, enhancing the durability of the product.

Analog To Digital Convertors: 16-Ch 10-Bit

Enables precise analog signal conversion for accurate sensor data interpretation and control applications.

Nominal Supply Voltage: 2.5 V

Stable supply voltage for consistent performance, ensuring reliable operation in various voltage conditions.

PWM Channels: YES

Pulse width modulation capability for precise control of analog outputs, essential for motor control and power management.

Connectivity: CAN(2), I2C, SPI(2), USART(2)

Versatile connectivity options for interfacing with a wide range of external devices and communication protocols.

ROM Programmability: FLASH

Flash memory allows for easy reprogrammability of the microcontroller, facilitating firmware updates and enhancements.

Terminal Pitch: 0.5 mm

Fine pitch terminals enable compact PCB layouts and high-density interconnections, optimizing space utilization.

Speed: 40 rpm

High-speed processing capability for rapid data handling and computation, suitable for real-time applications.

On Chip Program ROM Width: 8

Sufficient ROM width for storing program code, enabling the execution of complex algorithms and tasks.

No. of I/O Lines: 103

Abundant I/O lines for interfacing with external devices and peripherals, enhancing connectivity and control capabilities.

Technical Specifications

Microcontrollers SAF-XC167CI-16F40FBBTR attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

103

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.35 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C, SPI(2), USART(2)

Peripherals:

RTC, TIMER(11), WDT

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

SAF-XC167CI-16F40FBBTR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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