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SAFXC167CI32F40FBBATR

Infineon Technologies

SAFXC167CI32F40FBBATR by Infineon Technologies

SAFXC167CI32F40FBBATR by Infineon: 16-bit microcontroller with 144 terminals, 262144 ROM words, and 12288 RAM bytes. Ideal for industrial applications requiring ADC channels, PWM channels, and connectivity via ASC, CAN, I2C, and SPI interfaces at a max clock frequency of 16 MHz.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 1,477 parts In-Stock

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Digiode

USA . 802 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Ampacity Inc.

Singapore . 760 parts In-Stock

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$9.000

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760

$9.000

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AZTECH Wire

Italy . 262 parts In-Stock

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$10.784

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262

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Semicontronic

India . 703 parts In-Stock

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$12.000

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$11.700

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$11.640

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703

$12.000

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Modulus Dynamics

Lithuania . 4,667 parts In-Stock

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$35.064

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$33.661

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$32.259

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Corohmni

South Africa . 346 parts In-Stock

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$76.518

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Aztec Data Supply Inc.

USA . 287 parts In-Stock

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$84.950

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Bastille Electronics

Australia . 4,813 parts In-Stock

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Argo Parts USA

USA . 861 parts In-Stock

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Continental Prestige Electronics

USA . 833 parts In-Stock

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Corphita

USA . 647 parts In-Stock

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Advanced Electronics

New Zealand . 300 parts In-Stock

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Overview

Experience the seamless performance and reliability of the SAFXC167CI32F40FBBATR microcontroller by Infineon Technologies. Crafted with precision using top-quality materials, this product offers a wide range of applications in various industries. From automotive to industrial automation, this microcontroller provides unparalleled value with its advanced features and cutting-edge technology. Unlock endless possibilities and streamline your projects with the SAFXC167CI32F40FBBATR, where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for various applications.

Maximum Supply Voltage: 2.7 V

Allows for flexibility in power supply options and compatibility with different voltage sources.

Bit Size: 16

Offers a good balance between performance and efficiency for various computing tasks.

ADC Channels: YES

Enables the microcontroller to interface with analog sensors and inputs, broadening its range of applications.

ROM Words: 262144

Provides ample space for program storage, allowing for complex and large programs to be executed efficiently.

Maximum Clock Frequency: 16 MHz

Offers high processing speed, suitable for real-time applications and tasks that require quick computation.

RAM Bytes: 12288

Offers sufficient memory for data storage and manipulation, enabling the microcontroller to handle complex tasks effectively.

Analog To Digital Convertors: 16-Ch 10-Bit

Provides multiple channels for analog signal conversion with high precision, enabling accurate measurements and sensor readings.

PWM Channels: YES

Enables pulse-width modulation output, useful for controlling motors, LEDs, and other devices that require variable output signals.

Connectivity: ASC(2), CAN(2), I2C, SPI(2)

Provides versatile communication options for connecting to other devices, networks, and peripherals, enhancing the microcontroller's capabilities.

Technical Specifications

Microcontrollers SAFXC167CI32F40FBBATR attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

103

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

12288

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.35 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ASC(2), CAN(2), I2C, SPI(2)

Peripherals:

RTC, TIMER(11), WDT

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

SAFXC167CI32F40FBBATR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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