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SAF-XC164CS-32F40FBB-ATR

Infineon Technologies

SAF-XC164CS-32F40FBB-ATR by Infineon Technologies

SAF-XC164CS-32F40FBB-ATR by Infineon Technologies is a 16-bit microcontroller with a max clock frequency of 40 MHz. It has 14 ADC channels and offers connectivity options such as CAN, SPI, and USART. This microcontroller is commonly used in industrial applications due to its temperature grade and low profile package design.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,567 parts In-Stock

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Digiode

USA . 383 parts In-Stock

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Nova Conductors

Japan . 30 parts In-Stock

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AZTECH Wire

Italy . 348 parts In-Stock

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$16.074

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Ampacity Inc.

Singapore . 1,267 parts In-Stock

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$28.000

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Aztec Data Supply Inc.

USA . 1,704 parts In-Stock

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Modulus Dynamics

Lithuania . 1,839 parts In-Stock

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$61.593

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$59.129

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$56.666

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Corohmni

South Africa . 252 parts In-Stock

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$77.955

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Continental Prestige Electronics

USA . 5,823 parts In-Stock

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Bastille Electronics

Australia . 4,941 parts In-Stock

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Argo Parts USA

USA . 3,225 parts In-Stock

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Corphita

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Overview

Looking for a high-quality microcontroller? Look no further than the SAF-XC164CS-32F40FBB-ATR by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies is known for delivering top-notch products. This microcontroller offers a wide range of applications and is perfect for your next project. With its advanced features and reliable performance, it provides exceptional value to customers. Whether you need to control motors, monitor sensors, or manage communication protocols, this microcontroller has got you covered. Don't miss out on the benefits and advantages that the SAF-XC164CS-32F40FBB-ATR can offer to take your project to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material ensures durability and reliability for the microcontroller.

Surface Mount: YES

Surface mount capability allows for easy integration into PCB designs, saving space and simplifying assembly.

Maximum Supply Voltage: 2.7 V

Low maximum supply voltage ensures compatibility with a wide range of power sources.

Address Bus Width: 24

Wide address bus width allows for efficient memory addressing, improving overall performance.

Package Shape: SQUARE

Square package shape makes it easy to mount and align the microcontroller on a PCB.

Bit Size: 16

16-bit architecture allows for more complex operations and calculations compared to 8-bit microcontrollers.

No. of Terminals: 100

Ample number of terminals provide flexibility for connecting peripherals and external components.

Minimum Supply Voltage: 2.35 V

Low minimum supply voltage ensures efficient power consumption and extends battery life.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable operation in a variety of environments.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures functionality in extreme cold conditions.

ADC Channels: YES

Built-in Analog to Digital Converters provide the ability to interface with analog sensors and signals.

Terminal Position: QUAD

Quad terminal position simplifies PCB layout and soldering process.

ROM Words: 262144

Large ROM capacity allows for storing complex program instructions and data.

Maximum Seated Height: 1.6 mm

Low height profile allows for slim and compact design of electronic products.

Width: 14 mm

Compact width dimension enables efficient space utilization on a PCB.

External Data Bus Width: 16

16-bit external data bus width enables faster data transfer between the microcontroller and external devices.

Peripherals: RTC, TIMER(11), WDT

Rich set of peripherals including Real-Time Clock, Timers, and Watchdog Timer enhance the functionality of the microcontroller.

Maximum Clock Frequency: 40 MHz

High maximum clock frequency allows for fast processing and real-time responsiveness.

Length: 14 mm

Compact length dimension enables efficient space utilization on a PCB.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability and performance in harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller architecture with Reduced Instruction Set Computing (RISC) provides efficient processing and performance.

RAM Bytes: 12288

Generous RAM capacity allows for efficient data storage and manipulation during program execution.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable operation.

Terminal Form: GULL WING

Gull wing terminal form simplifies soldering process and enhances mechanical stability.

Analog to Digital Convertors: 14-Ch 10-Bit

Fourteen Analog to Digital Converters with 10-bit resolution provide precise analog signal conversion.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent performance and reliability of the microcontroller.

PWM Channels: YES

Pulse Width Modulation (PWM) channels enable precise control of analog outputs for motor control and power management.

Connectivity: CAN(2), SPI(2), USART(2)

Multiple connectivity options including CAN, SPI, and USART facilitate communication with external devices and networks.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and flexible updating of firmware and program code.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting and space-saving design on a PCB.

Speed: 40 rpm

High processing speed of 40 rpm enables rapid execution of program instructions and real-time data processing.

On Chip Program ROM Width: 8

On-chip program ROM with 8-bit width provides efficient code storage and execution.

No. of I/O Lines: 79

Abundance of Input/Output lines offer flexibility for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers SAF-XC164CS-32F40FBB-ATR attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

79

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

12288

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.35 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), SPI(2), USART(2)

Peripherals:

RTC, TIMER(11), WDT

Analog To Digital Convertors:

14-Ch 10-Bit

Trade Compliance

SAF-XC164CS-32F40FBB-ATR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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