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SAF-XE164FM-72F80LAA

Infineon Technologies

SAF-XE164FM-72F80LAA by Infineon Technologies

Infineon's SAF-XE164FM-72F80LAA microcontroller features 16-bit CPU, 40 MHz clock frequency, and 51200 bytes of RAM. Ideal for industrial applications requiring high-speed processing, with a wide temperature range from -40 to 85°C. Offers advanced ADC and PWM channels for precise control in various systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

< 1k

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Chip Stock

USA . 225 parts In-Stock

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Vyrian

USA . 209 parts In-Stock

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209

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Digiode

USA . 132 parts In-Stock

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132

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Ampacity Inc.

Singapore . 622 parts In-Stock

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$2.000

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622

$2.000

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AZTECH Wire

Italy . 429 parts In-Stock

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$10.630

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429

$10.630

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Semicontronic

India . 1,426 parts In-Stock

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$20.000

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$19.500

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$19.400

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Aztec Data Supply Inc.

USA . 4,708 parts In-Stock

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$25.270

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$25.270

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Advanced Electronics

New Zealand . 74 parts In-Stock

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$29.678

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$27.007

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$24.336

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74

$29.678

$27.007

$24.336

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Modulus Dynamics

Lithuania . 570 parts In-Stock

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$42.925

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$41.208

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$39.491

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570

$42.925

$41.208

$39.491

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Argo Parts USA

USA . 3,620 parts In-Stock

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A-Z Elektronik GmbH

Germany . 3,466 parts In-Stock

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Microchip USA

USA . 2,330 parts In-Stock

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Continental Prestige Electronics

USA . 2,217 parts In-Stock

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Bastille Electronics

Australia . 1,930 parts In-Stock

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Corphita

USA . 306 parts In-Stock

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306

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Overview

Discover the power and versatility of the SAF-XE164FM-72F80LAA microcontroller by Infineon Technologies. With a reputation for top-quality manufacturing, this device is perfect for a wide range of applications. From automotive to industrial automation, this microcontroller provides reliable performance and seamless integration. Unlock the potential of your projects with the unmatched value, benefits, and advantages that this product offers. Trust Infineon Technologies to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and improving reliability.

Maximum Supply Voltage: 1.6 V

With a maximum supply voltage of 1.6V, this microcontroller is energy-efficient and suitable for low-power applications.

Package Shape: SQUARE

The square package shape offers uniformity and ease of mounting on PCBs, improving assembly efficiency.

Bit Size: 16

The 16-bit processing capability provides enhanced performance and processing power for applications requiring higher computational abilities.

Power Supplies (V): 1.5,3.3/5

Support for multiple power supply voltages allows flexibility in design and compatibility with different power sources.

No. of Terminals: 100

Having 100 terminals provides ample I/O capabilities for interfacing with external components and peripherals.

Minimum Supply Voltage: 1.4 V

The low minimum supply voltage of 1.4V enables the microcontroller to operate efficiently in low-power scenarios, extending battery life.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance in a wide range of environmental conditions.

CPU Family: C166SV2

Being part of the C166SV2 family indicates compatibility with existing hardware and software ecosystems, simplifying integration.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, this product combines processing capabilities with integrated peripherals, reducing component count and overall system complexity.

Technical Specifications

Microcontrollers SAF-XE164FM-72F80LAA attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Bit Size:

16

CPU Family:

C166SV2

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

74

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,3.3/5

Qualification:

Not Qualified

RAM Bytes:

51200

ROM Words:

589824

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SAF-XE164FM-72F80LAA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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