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IPB65R225C7ATMA2

Infineon Technologies

IPB65R225C7ATMA2 by Infineon Technologies

Infineon's IPB65R225C7ATMA2 is a N-CHANNEL FET with 650V DS breakdown voltage and 41A IDM. Ideal for switching applications, it operates in enhancement mode with 0.225 ohm RDS(on) and 63W power dissipation. Suitable for high-power systems requiring efficient performance in a compact package.

Median Price

$1.375

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 858 parts In-Stock

1+ parts

$3.180

100+ parts

$1.437

1k+ parts

$1.080

10k+ parts

$1.033

858

$3.180

$1.437

$1.080

$1.033

Rochester

USA . 13,000 parts In-Stock

1+ parts

-

100+ parts

$1.330

1k+ parts

$1.100

10k+ parts

$0.984

13,000

-

$1.330

$1.100

$0.984

Verical

USA . 13,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.375

10k+ parts

$1.230

13,000

-

-

$1.375

$1.230

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 516 parts In-Stock

1+ parts

$1.036

100+ parts

-

1k+ parts

-

10k+ parts

-

516

$1.036

-

-

-

Vyrian

USA . 5,829 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,829

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 565 parts In-Stock

1+ parts

$0.981

100+ parts

-

1k+ parts

-

10k+ parts

-

565

$0.981

-

-

-

Modulus Dynamics

Lithuania . 5,070 parts In-Stock

1+ parts

$1.943

100+ parts

$1.865

1k+ parts

$1.788

10k+ parts

-

5,070

$1.943

$1.865

$1.788

-

Microchip USA

USA . 6,682 parts In-Stock

1+ parts

$10.371

100+ parts

-

1k+ parts

-

10k+ parts

-

6,682

$10.371

-

-

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iodParts Technologies Inc.

India . 1,562 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,562

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Overview

Unleash the power of innovation with the IPB65R225C7ATMA2 from Infineon Technologies. Designed with precision and expertise, this N-channel Power FET offers unmatched reliability and performance for switching applications. With a maximum pulsed drain current of 41A and a minimum DS breakdown voltage of 650V, this transistor is a game-changer in the industry. Its built-in diode and small outline package make it a versatile choice for various projects. Trust in Infineon's reputation for quality and experience the benefits of superior technology with the IPB65R225C7ATMA2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product more portable and long-lasting.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher electron mobility, allowing for faster switching speeds and improved efficiency.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps protect the circuit from reverse current flow, enhancing the reliability of the product.

Transistor Application: SWITCHING

Designed for switching applications, this FET can quickly turn on and off, making it suitable for power control and modulation.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, saving space and simplifying assembly.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage, this FET can handle high voltage applications without damage or failure.

Maximum Pulsed Drain Current (IDM): 41 A

With a high current rating, this FET is capable of handling peak current pulses, suitable for demanding applications.

Maximum Power Dissipation (Abs): 63 W

The high power dissipation rating ensures that the FET can operate efficiently without overheating.

Maximum Drain-Source On Resistance: 0.225 ohm

Low on-resistance means less power loss and heat generation, improving the overall efficiency of the FET.

Technical Specifications

Power Field Effect Transistors (FET) IPB65R225C7ATMA2 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

48 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

11 A

Maximum Drain-Source On Resistance:

.225 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

41 A

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPB65R225C7ATMA2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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