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IPB009N03LGATMA1

Infineon Technologies

IPB009N03LGATMA1 by Infineon Technologies

Infineon's IPB009N03LGATMA1 is a N-CHANNEL FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. Featuring 1260A IDM and 0.0013 ohm RDS(on), it operates in ENHANCEMENT MODE at up to 175°C. This PLASTIC/EPOXY transistor with BUILT-IN DIODE is designed for high-power, surface-mount circuits.

Median Price

$1.560

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 13 parts In-Stock

1+ parts

-

100+ parts

$1.560

1k+ parts

$1.390

10k+ parts

$1.310

13

-

$1.560

$1.390

$1.310

Distributors (In-Stock)

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Digiode

USA . 851 parts In-Stock

1+ parts

$1.653

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851

$1.653

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Vyrian

USA . 7,183 parts In-Stock

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7,183

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Chip Stock

USA . 6,270 parts In-Stock

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Nova Conductors

Japan . 88 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 20,630 parts In-Stock

1+ parts

$0.674

100+ parts

$0.647

1k+ parts

$0.620

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-

20,630

$0.674

$0.647

$0.620

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Aztec Data Supply Inc.

USA . 3,434 parts In-Stock

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$1.090

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3,434

$1.090

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Ampacity Inc.

Singapore . 13 parts In-Stock

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$1.480

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13

$1.480

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Semicontronic

India . 13 parts In-Stock

1+ parts

$1.480

100+ parts

$1.443

1k+ parts

$1.436

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-

13

$1.480

$1.443

$1.436

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Corphita

USA . 593 parts In-Stock

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$1.566

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593

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Corohmni

South Africa . 1,008 parts In-Stock

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$1.670

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$1.670

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AZTECH Wire

Italy . 693 parts In-Stock

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$14.301

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693

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RC Electronics

USA . 46,711 parts In-Stock

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$2.380

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$2.180

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$2.110

46,711

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$2.180

$2.110

Microchip USA

USA . 5,319 parts In-Stock

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Argo Parts USA

USA . 4,727 parts In-Stock

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Perfect Parts

USA . 2,246 parts In-Stock

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Continental Prestige Electronics

USA . 567 parts In-Stock

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567

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Overview

Upgrade your power system with the IPB009N03LGATMA1 from Infineon Technologies, a top-tier manufacturer known for its superior quality and reliability. This N-CHANNEL Power FET is ideal for switching applications, offering a maximum drain current of 180 A and a minimum DS breakdown voltage of 30 V. With a built-in diode and an operating temperature of up to 175°C, this transistor ensures optimal performance in any environment. Trust Infineon's cutting-edge technology to enhance your system's efficiency and power capabilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have faster switching speeds and lower on-resistance compared to P-channel FETs, making them suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for protection against reverse voltage spikes, enhancing the overall reliability of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers efficient performance in controlling the flow of current.

Surface Mount: YES

Surface mount technology allows for easy and compact integration onto PCBs, saving valuable space in electronic designs.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this FET can handle higher voltage levels without breakdown, ensuring reliable operation in various circuit configurations.

Maximum Pulsed Drain Current (IDM): 1260 A

The high pulsed drain current rating of 1260A allows for handling of momentary high current loads, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 610 mJ

The high avalanche energy rating of 610mJ indicates the FET's ability to withstand transient energy pulses, enhancing its ruggedness in harsh operating conditions.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175°C, this FET can handle high-temperature environments effectively, ensuring stable performance under heat stress.

Maximum Drain Current (ID): 180 A

The high drain current rating of 180A enables the FET to handle significant current levels, making it suitable for power-intensive applications.

Maximum Drain-Source On Resistance: 0.0013 ohm

The low on-resistance of 0.0013 ohm reduces power losses and improves efficiency in switching applications, enhancing overall performance.

Technical Specifications

Power Field Effect Transistors (FET) IPB009N03LGATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE, ULTRA-LOW RESISTANCE

Avalanche Energy Rating (EAS):

610 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

180 A

Maximum Drain-Source On Resistance:

.0013 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AA

JESD-30 Code:

R-PSSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

1260 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPB009N03LGATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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