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FZ400R17KE3

Infineon Technologies

FZ400R17KE3 by Infineon Technologies

FZ400R17KE3 by Infineon Technologies is an N-CHANNEL IGBT with a max VCEsat of 2.45V and 1700V max collector-emitter voltage. It has a nominal turn off time of 1230ns, making it suitable for high-power applications like industrial motor drives and renewable energy systems.

Median Price

$179.660

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 112 parts In-Stock

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$179.660

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Digiode

USA . 964 parts In-Stock

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$142.452

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Vyrian

USA . 432 parts In-Stock

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$149.950

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ACDS - Activité Composants Distribution Service

France . 70 parts In-Stock

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Tech-Mark Corp

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Modulus Dynamics

Lithuania . 5,836 parts In-Stock

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$1.502

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$1.442

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$1.382

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Andel Nordic

Denmark . 1,000 parts In-Stock

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$55.030

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$38.519

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$38.519

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$55.030

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$38.519

Corphita

USA . 323 parts In-Stock

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$134.955

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Perfect Parts

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Native Components

USA . 937 parts In-Stock

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Northwest PG Solutions

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Metaverse IC Inc.

Canada . 321 parts In-Stock

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Authorized Procurement Solutions

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Overview

Unleash the power of cutting-edge technology with the FZ400R17KE3 by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies sets the standard for excellence in Insulated Gate Bipolar Transistors (IGBT). With a single configuration and built-in diode, this product offers unparalleled performance and reliability. Whether you're in the automotive, industrial, or renewable energy sector, the FZ400R17KE3 delivers maximum power dissipation and optimal efficiency. Elevate your projects with the quality and value that only Infineon Technologies can provide.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs have lower conduction losses and higher switching speeds, making them ideal for high power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier circuit design and helps protect the IGBT from voltage spikes during switching.

Maximum VCEsat: 2.45 V

Low VCEsat reduces power dissipation and improves efficiency in the IGBT, making it suitable for high power applications.

Package Shape: RECTANGULAR

Rectangular packages are easier to mount and provide better thermal conductivity, improving overall reliability and performance.

Nominal Turn Off Time (toff): 1230 ns

Fast turn-off time helps reduce switching losses and improves efficiency in the IGBT, making it suitable for high frequency applications.

No. of Terminals: 4

Having 4 terminals allows for easier connection and control of the IGBT in a circuit, enhancing overall usability and reliability.

Maximum Power Dissipation (Abs): 2270 W

High power dissipation capability makes this IGBT suitable for high power applications where heat dissipation is crucial.

Package Style (Meter): FLANGE MOUNT

Flange mount packages provide secure mounting and better thermal management, enhancing overall reliability and performance of the IGBT.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this IGBT can withstand harsh environments and high temperature conditions, improving its durability.

Maximum Collector-Emitter Voltage: 1700 V

High maximum collector-emitter voltage capability makes this IGBT suitable for high voltage applications, providing versatility and reliability.

Transistor Element Material: SILICON

Silicon-based IGBTs have good thermal characteristics and high switching speeds, making them ideal for various power electronics applications.

Maximum Gate-Emitter Voltage: 20 V

Low maximum gate-emitter voltage reduces the risk of damage due to overvoltage and enhances the reliability of the IGBT in a circuit.

Maximum Collector Current (IC): 780 A

High maximum collector current capability allows this IGBT to handle large currents, making it suitable for high power applications.

Terminal Position: UPPER

Upper terminal position simplifies circuit design and connection, improving overall usability and reliability of the IGBT.

Case Connection: ISOLATED

Isolated case connection helps prevent electrical interference and enhances the safety and reliability of the IGBT in a circuit.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for reliable soldering and mounting of the IGBT, ensuring long-term performance and durability.

Nominal Turn On Time (ton): 400 ns

Fast turn-on time allows for quick switching and high efficiency in the IGBT, making it suitable for high frequency applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FZ400R17KE3 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1700 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

1230 ns

Nominal Turn On Time (ton):

400 ns

Maximum VCEsat:

2.45 V

Trade Compliance

FZ400R17KE3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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