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FZ400R12KS4PHOSA1

Infineon Technologies

FZ400R12KS4PHOSA1 by Infineon Technologies

FZ400R12KS4PHOSA1 by Infineon Technologies is an N-CHANNEL IGBT with a max voltage of 1200V and current of 510A. It has a turn-off time of 590ns and turn-on time of 180ns, making it suitable for high-power applications like motor drives and renewable energy systems. The package style is flange mount with isolated case connection.

Median Price

$131.520

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 176 parts In-Stock

1+ parts

$120.940

100+ parts

$113.680

1k+ parts

$106.430

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176

$120.940

$113.680

$106.430

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DigiKey

USA . 176 parts In-Stock

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176

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Verical

USA . 174 parts In-Stock

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$142.100

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$133.037

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174

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$142.100

$133.037

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 951 parts In-Stock

1+ parts

$126.939

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951

$126.939

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Nova Conductors

Japan . 100 parts In-Stock

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$165.173

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100

$165.173

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Vyrian

USA . 3,108 parts In-Stock

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3,108

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Distributors (Availability)

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AZTECH Wire

Italy . 271 parts In-Stock

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$10.744

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271

$10.744

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Corphita

USA . 516 parts In-Stock

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$120.258

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516

$120.258

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$165.173

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2,000

$165.173

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Continental Prestige Electronics

USA . 1,976 parts In-Stock

1+ parts

$165.173

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$161.870

1,976

$165.173

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$161.870

Modulus Dynamics

Lithuania . 14,236 parts In-Stock

1+ parts

$189.784

100+ parts

$182.193

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$174.601

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14,236

$189.784

$182.193

$174.601

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Ampacity Inc.

Singapore . 134 parts In-Stock

1+ parts

$260.960

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134

$260.960

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Microchip USA

USA . 9,250 parts In-Stock

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9,250

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QUARKTWIN TECHNOLOGY LTD

USA . 9,083 parts In-Stock

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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Argo Parts USA

USA . 1,343 parts In-Stock

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1,343

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Overview

Unleash the power of the FZ400R12KS4PHOSA1 by Infineon Technologies, a cutting-edge Insulated Gate Bipolar Transistor (IGBT) that guarantees top-notch quality and performance. With its N-CHANNEL polarity and SINGLE configuration with built-in diode, this product is perfect for a wide range of applications. From industrial drives to renewable energy systems, this IGBT offers unrivaled reliability and efficiency. Trust in Infineon Technologies to deliver unmatched value and benefits with the FZ400R12KS4PHOSA1, providing customers with the advantage they need to stay ahead in today's competitive market.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their high efficiency and fast switching speeds, making this product suitable for high power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse voltage spikes, adding convenience and reliability to the application.

Nominal Turn Off Time (toff): 590 ns

The relatively fast turn-off time helps in reducing power losses and improving overall efficiency in high frequency switching applications.

Maximum Collector-Emitter Voltage: 1200 V

The high voltage rating allows for operation in high voltage circuits, making this product suitable for industrial applications and power electronics.

Maximum Collector Current (IC): 510 A

With a high collector current rating, this IGBT can handle large amounts of current, making it suitable for high power applications that require high current handling capability.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FZ400R12KS4PHOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

JESD-30 Code:

R-XUFM-X5

No. of Elements:

1

No. of Terminals:

5

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

590 ns

Nominal Turn On Time (ton):

180 ns

Trade Compliance

FZ400R12KS4PHOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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