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FZ1500R33HE3BPSA1

Infineon Technologies

FZ1500R33HE3BPSA1 by Infineon Technologies

Infineon's FZ1500R33HE3BPSA1 is an N-CHANNEL IGBT with 3300V max. collector-emitter voltage, 1150ns turn on time, and 3550ns turn off time. Ideal for power control applications due to its complex configuration and isolated case connection in a rectangular package style.

Median Price

$1,643.962

Lifecycle Status

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8

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1k+

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Chip1Stop

Japan . 1 parts In-Stock

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$1,200.000

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$1,200.000

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Rochester

USA . 57 parts In-Stock

1+ parts

$1,461.300

100+ parts

$1,373.620

1k+ parts

$1,285.940

10k+ parts

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57

$1,461.300

$1,373.620

$1,285.940

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Verical

USA . 54 parts In-Stock

1+ parts

$1,826.625

100+ parts

$1,717.025

1k+ parts

$1,607.425

10k+ parts

-

54

$1,826.625

$1,717.025

$1,607.425

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DigiKey

USA . 57 parts In-Stock

1+ parts

$1,826.630

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57

$1,826.630

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Digiode

USA . 967 parts In-Stock

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$1,140.000

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967

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DigiKey Marketplace

USA . 82 parts In-Stock

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$2,073.230

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Vyrian

USA . 2,186 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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Corohmni

South Africa . 86 parts In-Stock

1+ parts

$0.353

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86

$0.353

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Modulus Dynamics

Lithuania . 14,518 parts In-Stock

1+ parts

$1.007

100+ parts

$0.967

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$0.926

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14,518

$1.007

$0.967

$0.926

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Ampacity Inc.

Singapore . 49 parts In-Stock

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$1,020.000

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$1,020.000

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Corphita

USA . 660 parts In-Stock

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$1,080.000

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Microchip USA

USA . 2,618 parts In-Stock

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$1,909.320

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2,618

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QUARKTWIN TECHNOLOGY LTD

USA . 16,290 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Argo Parts USA

USA . 1,565 parts In-Stock

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Continental Prestige Electronics

USA . 1,312 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Overview

Experience the unparalleled quality and superior performance of the FZ1500R33HE3BPSA1 by Infineon Technologies, a leading manufacturer in the industry. This Insulated Gate Bipolar Transistor (IGBT) offers exceptional power control capabilities, making it ideal for a wide range of applications. With its N-CHANNEL polarity and COMPLEX configuration, this transistor delivers reliable and efficient operation. Whether used in industrial machinery or renewable energy systems, this product provides value, benefits, and advantages that will exceed your expectations. Trust Infineon Technologies to deliver innovative solutions for your power control needs.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for high-speed switching capabilities and low on-state voltage drop, making them ideal for power control applications.

Configuration: COMPLEX

Complex IGBT configurations provide enhanced performance and efficiency in power control applications, making this product a suitable choice for demanding tasks.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT is optimized for efficient and reliable operation in controlling high power loads.

No. of Elements: 3

Having multiple elements allows for parallel operation, enhancing overall power handling capacity and reliability of the device.

Nominal Turn Off Time (toff): 3550 ns

The relatively fast turn-off time of 3550 ns enables quick switching transitions, reducing power losses and improving efficiency in power control applications.

No. of Terminals: 5

Having 5 terminals provides greater flexibility in circuit connections and control options, allowing for versatile implementation in various power control setups.

Package Style (Meter): FLANGE MOUNT

The flange mount package style offers easy installation and secure mounting for reliable operation in industrial environments.

Maximum Collector-Emitter Voltage: 3300 V

With a high maximum collector-emitter voltage rating of 3300 V, this IGBT can handle high voltage levels, making it suitable for high-power applications.

Transistor Element Material: SILICON

Silicon IGBTs are known for their high switching speeds, low on-state voltages, and reliability, making them a popular choice for power control applications.

Terminal Position: UPPER

The upper terminal position simplifies the connection layout and heat dissipation design, enhancing the overall efficiency and reliability of the device.

Case Connection: ISOLATED

The isolated case connection helps prevent electrical shorts and improves safety in high-voltage applications, ensuring stable and reliable performance.

Nominal Turn On Time (ton): 1150 ns

The fast turn-on time of 1150 ns allows for quick response in switching operations, increasing efficiency and reducing power losses in power control circuits.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FZ1500R33HE3BPSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector-Emitter Voltage:

3300 V

Configuration:

JESD-30 Code:

R-XUFM-X5

No. of Elements:

3

No. of Terminals:

5

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

3550 ns

Nominal Turn On Time (ton):

1150 ns

Trade Compliance

FZ1500R33HE3BPSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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