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FP15R12W1T4PB11BPSA1

Infineon Technologies

FP15R12W1T4PB11BPSA1 by Infineon Technologies

Infineon's FP15R12W1T4PB11BPSA1 is an N-CHANNEL IGBT with 1200V VCEsat, 510ns toff, and 130ns ton. Ideal for POWER CONTROL applications due to its complex configuration and SILICON material. Operating temperature ranges from -40°C to 150°C making it suitable for various industrial uses.

Median Price

$39.650

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 15 parts In-Stock

1+ parts

$43.420

100+ parts

-

1k+ parts

$32.390

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15

$43.420

-

$32.390

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Rochester

USA . 22 parts In-Stock

1+ parts

-

100+ parts

$26.740

1k+ parts

$23.930

10k+ parts

$22.520

22

-

$26.740

$23.930

$22.520

DigiKey

USA . 22 parts In-Stock

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22

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Verical

USA . 22 parts In-Stock

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$39.650

1k+ parts

$35.850

10k+ parts

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22

-

$39.650

$35.850

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 331 parts In-Stock

1+ parts

$32.053

100+ parts

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331

$32.053

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Vyrian

USA . 8,980 parts In-Stock

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8,980

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Distributors (Availability)

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Native Components

USA . 604 parts In-Stock

1+ parts

$7.920

100+ parts

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604

$7.920

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Northwest PG Solutions

USA . 705 parts In-Stock

1+ parts

$8.712

100+ parts

$7.840

1k+ parts

-

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705

$8.712

$7.840

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Ampacity Inc.

Singapore . 20 parts In-Stock

1+ parts

$28.680

100+ parts

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20

$28.680

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Corphita

USA . 914 parts In-Stock

1+ parts

$30.366

100+ parts

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914

$30.366

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Modulus Dynamics

Lithuania . 13,935 parts In-Stock

1+ parts

$34.087

100+ parts

$32.724

1k+ parts

$31.360

10k+ parts

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13,935

$34.087

$32.724

$31.360

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Component Stockers USA

USA . 48 parts In-Stock

1+ parts

$38.680

100+ parts

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48

$38.680

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Microchip USA

USA . 7,014 parts In-Stock

1+ parts

$111.890

100+ parts

$109.950

1k+ parts

$108.980

10k+ parts

$108.000

7,014

$111.890

$109.950

$108.980

$108.000

QUARKTWIN TECHNOLOGY LTD

USA . 28,035 parts In-Stock

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28,035

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Overview

Experience the power of the FP15R12W1T4PB11BPSA1 by Infineon Technologies, a top-tier manufacturer known for delivering high-quality products. This Insulated Gate Bipolar Transistor (IGBT) is designed for power control applications, offering customers unparalleled performance and reliability. With a maximum VCEsat of 2.25V and a nominal turn off time of 510ns, this complex N-CHANNEL transistor provides exceptional value and efficiency. Trust in Infineon Technologies to deliver cutting-edge solutions for your power management needs.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs offer better efficiency and faster switching speeds compared to P-channel IGBTs, making them ideal for power control applications.

Configuration: COMPLEX

The complex configuration allows for enhanced performance and versatility in power control applications.

Maximum VCEsat: 2.25 V

Low VCEsat value indicates minimal voltage drop across the collector-emitter junction, leading to improved power efficiency.

Nominal Turn Off Time (toff): 510 ns

Fast turn off time allows for precise control and efficient switching in power control applications.

Maximum Collector-Emitter Voltage: 1200 V

High maximum voltage rating ensures the IGBT can handle high power applications without breakdown.

Maximum Operating Temperature: 150 °C

High operating temperature range provides reliability in demanding environments.

Maximum Gate-Emitter Voltage: 20 V

The 20V gate-emitter voltage rating allows for efficient gate control and optimal performance.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures the IGBT can operate in extreme cold conditions without loss of performance.

Nominal Turn On Time (ton): 130 ns

Fast turn on time ensures quick response and high efficiency in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FP15R12W1T4PB11BPSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

6.4 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X23

No. of Elements:

7

No. of Terminals:

23

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

510 ns

Nominal Turn On Time (ton):

130 ns

Maximum VCEsat:

2.25 V

Trade Compliance

FP15R12W1T4PB11BPSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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