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CY7C1019CV33-12ZXCT

Cypress Semiconductor

CY7C1019CV33-12ZXCT by Cypress Semiconductor

CY7C1019CV33-12ZXCT by Cypress: 128KX8 SRAM with 3.3V, 12ns access time, and 1.27mm terminal pitch. Ideal for commercial applications requiring fast, asynchronous memory operations in a small outline package.

Median Price

$1.600

Lifecycle Status

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1k+

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Flip Electronics (Authorized)

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Rochester

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Nova Conductors

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Vyrian

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Right Parts Inc.

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Ampacity Inc.

Singapore . 9,033 parts In-Stock

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AZTECH Wire

Italy . 841 parts In-Stock

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Netroflash

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Microchip USA

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Overview

Unlock the power of reliable and high-performance memory with the CY7C1019CV33-12ZXCT by Cypress Semiconductor. As a leading manufacturer in the industry, Cypress delivers top-notch SRAM technology that guarantees seamless operation in various applications. With its compact design, low power consumption, and fast access time, this memory module is the perfect solution for maximizing efficiency and productivity in your projects. Trust Cypress to provide you with cutting-edge technology that exceeds expectations and unlocks endless possibilities. Upgrade to the CY7C1019CV33-12ZXCT today and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material for longevity and reliability.

Surface Mount: YES

Allows for easy installation on PCBs.

Package Shape: RECTANGULAR

Saves space and fits easily on circuit boards.

Operating Mode: ASYNCHRONOUS

Enables efficient data transfer without clock synchronization.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with standard voltage requirements.

No. of Terminals: 32

Provides ample connectivity options for interfacing with other components.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

Ideal for space-constrained designs.

Maximum Operating Temperature: 70 °C

Ensures stable performance in varying environmental conditions.

Organization: 128KX8

Offers a large memory capacity for data storage needs.

Minimum Operating Temperature: 0 °C

Suitable for a wide range of operating environments.

Terminal Finish: MATTE TIN

Enhances conductivity and reliability of connections.

Terminal Position: DUAL

Offers flexibility in PCB layout and design.

Maximum Seated Height: 1.2 mm

Low profile for compact and slim designs.

Width: 10.16 mm

Compact size for easy integration into circuit boards.

Minimum Supply Voltage (Vsup): 2.97 V

Ensures reliable operation even at low voltage levels.

Maximum Time At Peak Reflow Temperature (s): 20

Withstands reflow processes for manufacturing without damage.

Peak Reflow Temperature °C: 260

Handles high-temperature soldering processes effectively.

Length: 20.95 mm

Compact form factor for space-efficient designs.

Temperature Grade: COMMERCIAL

Suitable for standard commercial applications.

Technology: CMOS

Offers low power consumption and high-speed operation.

Parallel or Serial: PARALLEL

Enables efficient parallel data processing.

Terminal Form: GULL WING

Facilitates easy soldering and secure connections.

No. of Words: 131072 words

Large memory capacity for storing significant amounts of data.

Memory Width: 8

Supports efficient data transfer with 8-bit width.

Terminal Pitch: 1.27 mm

Standard pitch for compatibility with various PCB designs.

No. of Words Code: 128K

Indicates high memory capacity for data storage.

Moisture Sensitivity Level (MSL): 3

Suitable for standard PCB manufacturing processes.

Maximum Supply Voltage (Vsup): 3.63 V

Ensures stable operation within voltage limits.

Memory Density: 1048576 bit

Offers high-density memory storage capabilities.

Memory IC Type: STANDARD SRAM

Reliable and standard memory integrated circuit type.

Maximum Access Time: 12 ns

Fast access speed for quick data retrieval.

Technical Specifications

SRAM CY7C1019CV33-12ZXCT attributes and parameters. Explore more SRAM devices from Cypress Semiconductor

Specs

Maximum Access Time:

12 ns

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e3

Length:

20.95 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

128KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.63 V

Minimum Supply Voltage (Vsup):

2.97 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

10.16 mm

Trade Compliance

CY7C1019CV33-12ZXCT Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.B

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

PCN

Manufacturer Highlights

Cypress Semiconductor

Cypress Semiconductor was an American semiconductor design and manufacturing company. It offered NOR flash memories, F-RAM and SRAM Traveo microcontrollers, PSoC programmable system-on-chip solutions, analog and PMIC Power Management ICs, CapSense capacitive touch-sensing controllers, Wireless BLE Bluetooth Low-Energy and USB connectivity solutions. Its headquarters were in San Jose, California, with operations in the United States, Ireland, India and the Philippines. In April 2016, Cypress Semiconductors announced the acquisition of Broadcom’s Wireless Internet of Things Business. The deal was closed in July 2016. In June 2019, Infineon Technologies announced it would acquire Cypress for $9.4 billion.The deal closed in April 2020, making Infineon one of the world's top 10 semiconductor manufacturers. Some of its main competitors included Microchip Technology, NXP Semiconductors, Renesas Electronics and Micron Technology.

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