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ACFM-7107-BLK

Broadcom

ACFM-7107-BLK by Broadcom

RF FRONT END CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 5; Package Shape: RECTANGULAR; Width: 4 mm;

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

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Vyrian

USA . 369 parts In-Stock

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369

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Digiode

USA . 128 parts In-Stock

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128

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Distributors (Availability)

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Native Components

USA . 452 parts In-Stock

1+ parts

$0.702

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452

$0.702

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Northwest PG Solutions

USA . 810 parts In-Stock

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$0.772

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810

$0.772

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Decca Corp

Germany . 585 parts In-Stock

1+ parts

$13.000

100+ parts

$12.740

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$12.613

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585

$13.000

$12.740

$12.613

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Supply Digital

USA . 2,211 parts In-Stock

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2,211

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Corphita

USA . 229 parts In-Stock

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229

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Technical Specifications

Cellphone ICs ACFM-7107-BLK attributes and parameters. Explore more Cellphone ICs devices from Broadcom

Specs

JESD-30 Code:

R-XDMA-N5

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Maximum Seated Height:

1.1 mm

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Finish:

GOLD

Terminal Form:

Terminal Pitch:

2.15 mm

Terminal Position:

DUAL

Width:

4 mm

Trade Compliance

ACFM-7107-BLK Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Broadcom

Broadcom Inc, a Delaware corporation headquartered in San Jose, CA, is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom’s category-leading product portfolio serves critical markets including data center, networking, software, broadband, wireless, storage and industrial. Our solutions include data center networking and storage, enterprise and mainframe software focused on automation, monitoring and security, smartphone components, telecoms and factory automation.

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