Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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TDA5210XUMA1
Infineon Technologies
TDA5210XUMA1 by Infineon is a telecom IC with 28 terminals, operating from -40 to 105°C. It features a small outline package style, tin terminal finish, and 5V supply voltage. Ideal for telecom circuits, it has a rectangular shape and thin profile suitable for industrial applications.
R-PDSO-G28
e3
9.7 mm
3
1
28
105 Cel
-40 Cel
PLASTIC/EPOXY
TSSOP
RECTANGULAR
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Not Qualified
1.2 mm
5 V
YES
TELECOM CIRCUIT
INDUSTRIAL
TIN
GULL WING
.65 mm
DUAL
4.4 mm
TDA5102XUMA1
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
R-PDSO-G16
5 mm
16
85 Cel
-25 Cel
3 V
OTHER
TDA5100XUMA1
TDA5101XUMA1
TDA5103AHTMA1
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: TSSOP; Package Shape: SQUARE;
S-PDSO-G10
3 mm
10
TSSOP10,.19,20
SQUARE
1.1 mm
Other Telecom ICs
.0095 mA
BIPOLAR
.5 mm
TDK5111XUMA1
TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
125 Cel
TSSOP16,.25
2.1/4
.0195 mA
AUTOMOTIVE
TDA5250XUMA1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 38; Package Code: TSSOP; Package Shape: RECTANGULAR;
R-PDSO-G38
38
TDK5110XUMA1
Infineon's TDK5110XUMA1 is a telecom IC with 16 terminals, operating from -40 to 125°C. It has a small outline package, 0.65mm terminal pitch, and Gull Wing terminals. Ideal for automotive applications requiring a 3V supply voltage in a compact design.
TDK5101XUMA1
TDK5110FHTMA1
Infineon's TDK5110FHTMA1 is a telecom IC with 10 terminals, operating at -40 to 125°C. It has a supply voltage of 3V and consumes 0.021mA current. This small outline IC in plastic package is ideal for automotive telecom applications.
.021 mA
MATTE TIN
TDK5116FHTMA1
TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: TSSOP; Package Shape: SQUARE;
TDA5212XUMA1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: TSSOP; Package Shape: RECTANGULAR;
TDA7100HTMA1
TDA7100HTMA1 by Infineon Technologies is a telecom interface IC with 10 terminals in a small outline package. Operating temperature range from -20 to 70°C, suitable for telecom circuits with a nominal voltage of 3V. Features matte tin finish, gull wing terminal form, and shrink pitch package style.
70 Cel
-20 Cel
TDK5111FHTMA1
TDK5100FHTMA1
Infineon's TDK5100FHTMA1 is a telecom IC with 10 terminals, operating from -40 to 125°C. Its small outline package is surface-mountable and has a matte tin finish. Ideal for automotive applications, this IC operates at 3V and features a square shape with a 3x3mm footprint.
TDK5101FHTMA1
Infineon's TDK5101FHTMA1 is a telecom IC with 10 terminals in a small outline, thin profile package. Operating b/w -40°C to 125°C, it has matte tin finish and dual terminal position suitable for automotive applications. With a nominal voltage of 3V, it is designed for telecom circuits requiring precise temperature control.
TDA5220XUMA1
TDA5150HTMA1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: TSSOP; Package Shape: SQUARE;
1.05 mm
TDA7116FHTMA1
TDA7116FHTMA1 by Infineon is a telecom IC with 10 terminals, operating from -40 to 85°C. It has a small outline package style, matte tin finish, and dual terminal position. This IC is suitable for telecom circuits requiring a nominal voltage of 3V in industrial temperature environments.
TDA5200XUMA1
TDA5200XUMA1 by Infineon is a telecom IC with 28 terminals, operating from -40 to 85°C. It has a small outline package style, Gull Wing terminal form, and 5V supply voltage. Ideal for telecom circuits, it is surface mountable and has a moisture sensitivity level of 3.
TDA5201XUMA1
TDA5201XUMA1 by Infineon is a telecom IC with 28 terminals, operating from -40 to 85°C. It has a small outline package style, Gull Wing terminals, and 5V supply voltage. Ideal for telecom circuits in industrial applications due to its compact size and high temperature range.
TDK5100XUMA1
Infineon's TDK5100XUMA1 is a telecom IC with 16 terminals, operating at -40 to 125°C. It has a supply voltage of 3V and low current draw of 0.0095mA. This small outline package is ideal for automotive applications due to its bipolar technology and moisture sensitivity level of 3.
BGA711N7E6327XTSA1
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 6; Package Code: HVSON; Package Shape: RECTANGULAR;
R-PDSO-N6
2 mm
6
-30 Cel
HVSON
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
.4 mm
2.8 V
NO LEAD
1.3 mm
BGM1034N7E6327XUSA1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 7; Package Code: HVSON; Package Shape: RECTANGULAR;
R-PDSO-N7
2.3 mm
7
NOT SPECIFIED
.77 mm
1.8 V
.54 mm
1.7 mm
BGS15AN16E6327XTSA1
BGS15AN16E6327XTSA1 by Infineon is a telecom interface IC with 16 terminals in a square chip carrier package. Operating temperature ranges from -30 to 85°C, with a nominal voltage of 3.5V. This IC is designed for telecom circuits, featuring a very thin profile and tin terminal finish for surface mount applications.
S-PQCC-N16
HVQCCN
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
3.5 V
QUAD
TDA5252XUMA1
TDA5251XUMA1
TDA5255XUMA1
BGM1032N7E6327XUSA1
BGM1032N7E6327XUSA1 by Infineon is a telecom IC with 6 terminals, operating from -40 to 85°C. It has a small outline package style and nominal voltage of 2.7V, suitable for industrial applications requiring a very thin profile and surface mount capability.
2.7 V
BGM1043N7E6327XUSA1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 6; Package Code: HVSON; Package Shape: RECTANGULAR;
BGS12AL74E6327XTSA1
Infineon's BGS12AL74E6327XTSA1 is a telecom IC with 6 terminals in a rectangular chip carrier package. Operating b/w -30°C to 85°C, it has a nominal voltage of 2.8V. Ideal for telecom interfaces, this surface-mount IC features gold terminal finish and 0.55mm pitch.
R-XBCC-B6
e4
UNSPECIFIED
BCC
CHIP CARRIER
GOLD
BUTT
.55 mm
BOTTOM
1.5 mm
BGS12AL76E6327XTMA1
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BUTT; No. of Terminals: 6; Package Code: BCC; Package Shape: RECTANGULAR;
1.26 mm
.48 mm
1.4 mm
BGS12SL6E6327XTSA1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 6; Package Code: BCC; Package Shape: RECTANGULAR;
.32 mm
.7 mm
V23814-U1306-M130
TELECOM CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 72; Package Shape: RECTANGULAR; No. of Functions: 1; Nominal Supply Voltage: 3.3 V;
R-XXFO-G72
72
FIBER OPTIC
3.3 V
V23815-U1306-M130
TELECOM CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 72; Package Shape: RECTANGULAR; Terminal Position: UNSPECIFIED; Package Body Material: UNSPECIFIED;
TDA7255V
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: VQCCN; Package Shape: RECTANGULAR;
R-PQCC-N40
6.5 mm
40
VQCCN
LCC40,.22X.26,20
CHIP CARRIER, VERY THIN PROFILE
2.5/5
.9 mm
BICMOS
5.5 mm
TDA5101
260
TDA5204
TSSOP28,.25
235
5
.0064 mA
BGS13SL9E6327XTSA1
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BUTT; No. of Terminals: 9; Package Code: BCC; Package Shape: SQUARE;
S-XBCC-B9
1.15 mm
9
BGM781N11E6327XUSA1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 11; Package Code: VSON; Package Shape: SQUARE;
S-PDSO-N11
2.5 mm
11
VSON
SMALL OUTLINE, VERY THIN PROFILE
BGS16MN14E6327XTSA1
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 14; Package Code: HVQCCN; Package Shape: SQUARE;
S-PQCC-N14
14
CMOS
Tin (Sn)
TLE8457ASJXUMA1
TLE8457ASJXUMA1 by Infineon is a BICMOS technology Telecom IC with 8 terminals in a small outline package. It operates at 8V, AEC-Q100 screening level, suitable for telecom circuit applications. The Gull Wing terminal form and compact size make it ideal for space-constrained designs.
R-PDSO-G8
8
SOP
SMALL OUTLINE
AEC-Q100
1.75 mm
8 V
1.27 mm
4 mm
TLE8457BSJXUMA1
TLE8457BSJXUMA1 by Infineon is a BICMOS technology telecom IC with 8 terminals in a small outline package. It operates at a nominal voltage of 8V and has a terminal pitch of 1.27mm. This AEC-Q100 screened IC is ideal for telecom circuit applications due to its compact size and gull wing terminal form.
BGS13PN10E6327XTSA1
BGS13PN10E6327XTSA1 by Infineon is a Telecom Interface IC with 10 terminals in a rectangular chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial applications. Features CMOS technology, nominal voltage of 2.85V, and terminal pitch of 0.4mm for telecom circuits.
R-XBCC-B10
2.85 V
BGS18GA14E6327XTSA1
BGS18GA14E6327XTSA1 by Infineon Technologies is a telecom interface IC with 14 terminals in a square package. Operating temperature ranges from -30°C to 85°C, suitable for telecom circuits requiring a nominal voltage of 3V. With surface mount capability and compact dimensions of 2x2mm, it is ideal for microelectronic assembly applications.
S-XQMA-B14
MICROELECTRONIC ASSEMBLY
BGM1033N7E6327XUSA1
BGM15HA12E6327XTSA1
BGM15HA12E6327XTSA1 by Infineon is a telecom interface IC with 12 terminals in a chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. With a nominal voltage of 2.8V, it's ideal for telecom circuit applications requiring surface mount technology.
R-PBCC-N12
1.9 mm
12
GOLD NICKEL
BGM15MA12E6327XTSA1
BGM15MA12E6327XTSA1 by Infineon is a telecom IC with 12 terminals, operating temperature range of -40 to 85°C. It features a chip carrier package style, very thin profile, and no-lead terminal form. Ideal for telecom circuit applications with a nominal voltage of 2.8V and compact dimensions of 1.9mm x 1.1mm x 0.65mm.
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