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Infineon Technologies Other Function Telecom Interface ICs 56

Other Function Telecom Interface ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Companding Law Data Rate Filter Maximum Gain Tolerance Input Code Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Resolution (um) Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
BGS16GA14E6327XTSA1 by Infineon Technologies

BGS16GA14E6327XTSA1

Infineon Technologies

BGS16GA14E6327XTSA1 by Infineon is a telecom interface IC with 14 terminals in a square chip carrier package. Operating temperature ranges from -30 to 85°C, suitable for telecom circuits with a nominal voltage of 3V. Its compact size of 2x2mm and 0.65mm height make it ideal for space-constrained applications.

S-PBCC-N14

2 mm

1

1

14

85 Cel

-30 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

3 V

YES

TELECOM CIRCUIT

OTHER

NO LEAD

.4 mm

BOTTOM

2 mm

BGT24AR2E6433XUMA1 by Infineon Technologies

BGT24AR2E6433XUMA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: RECTANGULAR;

R-PQCC-N32

e3

5.5 mm

3

1

32

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

AEC-Q100

.9 mm

3.3 V

YES

BIPOLAR

TELECOM CIRCUIT

AUTOMOTIVE

TIN

NO LEAD

.5 mm

QUAD

4.5 mm

BGT24AT2E6433XUMA1 by Infineon Technologies

BGT24AT2E6433XUMA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: RECTANGULAR;

R-PQCC-N32

e3

5.5 mm

3

1

32

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

AEC-Q100

.9 mm

3.3 V

YES

BIPOLAR

TELECOM CIRCUIT

AUTOMOTIVE

TIN

NO LEAD

.5 mm

QUAD

4.5 mm

BGT24ATR12E6433XUMA1 by Infineon Technologies

BGT24ATR12E6433XUMA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: RECTANGULAR;

R-PQCC-N32

e3

5.5 mm

3

1

32

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

AEC-Q100

.9 mm

3.3 V

YES

BIPOLAR

TELECOM CIRCUIT

AUTOMOTIVE

TIN

NO LEAD

.5 mm

QUAD

4.5 mm

BGS110MN20E6327XTSA1 by Infineon Technologies

BGS110MN20E6327XTSA1

Infineon Technologies

BGS110MN20E6327XTSA1 by Infineon is a 20-terminal telecom IC with a nominal voltage of 3.5V. It operates b/w -30°C to 85°C, in a square chip carrier package style. With terminals at the bottom and 0.4mm pitch, it's ideal for telecom interface applications.

S-XBCC-B20

2.3 mm

1

1

20

85 Cel

-30 Cel

UNSPECIFIED

BCC

SQUARE

CHIP CARRIER

.77 mm

3.5 V

YES

TELECOM CIRCUIT

OTHER

BUTT

.4 mm

BOTTOM

2.3 mm

BGA5M1BN6E6327XTSA1 by Infineon Technologies

BGA5M1BN6E6327XTSA1

Infineon Technologies

Infineon's BGA5M1BN6E6327XTSA1 is a RECTANGULAR CHIP CARRIER with 6 terminals, operating from -40 to 85°C. It is an INDUSTRIAL-grade TELECOM CIRCUIT IC with a supply voltage of 1.8V, suitable for telecom interface applications due to its compact size and surface-mount capability.

R-XBCC-B6

1.1 mm

1

1

6

85 Cel

-40 Cel

UNSPECIFIED

BCC

RECTANGULAR

CHIP CARRIER

.4 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BUTT

.4 mm

BOTTOM

.7 mm

BGSF110GN26E6327XTSA1 by Infineon Technologies

BGSF110GN26E6327XTSA1

Infineon Technologies

BGSF110GN26E6327XTSA1 by Infineon is a Telecom IC with 26 terminals in a rectangular chip carrier package. Operating temperature range from -30 to 85°C, suitable for telecom circuits. Utilizes CMOS technology with a nominal voltage of 3V, ideal for surface mount applications.

R-PQCC-N26

e4

3.4 mm

1

1

26

85 Cel

-30 Cel

PLASTIC/EPOXY

HQCCN

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG

.77 mm

3 V

YES

CMOS

TELECOM CIRCUIT

OTHER

NICKEL PALLADIUM GOLD SILVER

NO LEAD

QUAD

2.6 mm

BGAU1A10E6327XTSA1 by Infineon Technologies

BGAU1A10E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BUTT; No. of Terminals: 10; Package Code: BCC; Package Shape: RECTANGULAR;

R-XBCC-B10

1.5 mm

1

1

10

85 Cel

-30 Cel

UNSPECIFIED

BCC

RECTANGULAR

CHIP CARRIER

.65 mm

1.8 V

YES

TELECOM CIRCUIT

OTHER

BUTT

.4 mm

BOTTOM

1.1 mm