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COMMERCIAL Other Function Telecom Interface ICs 79

Other Function Telecom Interface ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Companding Law Data Rate Filter Maximum Gain Tolerance Input Code Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Resolution (um) Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
LA72914V-MPB-H by Onsemi

LA72914V-MPB-H

Onsemi

LA72914V-MPB-H by Onsemi is a 16-terminal IC with 5V supply, operating from -20 to 70 °C. It features Gull Wing terminals, shrink pitch style, and commercial temperature grade. Ideal for telecom interfaces, it has a max supply current of 0.04mA and terminal pitch of 0.635mm.

R-PDSO-G16

e6

3

16

70 Cel

-20 Cel

PLASTIC/EPOXY

SSOP

SSOP16,.25

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

260

5

Not Qualified

Other Telecom ICs

.04 mA

5 V

YES

BIPOLAR

COMMERCIAL

TIN BISMUTH

GULL WING

.635 mm

DUAL

30

XR2211ACD-F by Exar

XR2211ACD-F

Exar

Exar's XR2211ACD-F is a 14-terminal telecom IC with a 12V supply, operating from 0 to 70°C. It features bipolar technology, matte tin finish, and small outline package suitable for telecom circuits. The IC is surface-mountable, with dual terminals and low supply current of 0.009 mA.

R-PDSO-G14

e3

8.65 mm

2

1

14

70 Cel

0 Cel

PLASTIC/EPOXY

SOP

SOP14,.25

RECTANGULAR

SMALL OUTLINE

12

Not Qualified

1.75 mm

Other Telecom ICs

.009 mA

12 V

YES

BIPOLAR

TELECOM CIRCUIT

COMMERCIAL

MATTE TIN

GULL WING

1.27 mm

DUAL

3.9 mm

XR2211ACDTR-F by Exar

XR2211ACDTR-F

Exar

Exar's XR2211ACDTR-F is a 14-terminal telecom IC with a 12V supply voltage, operating b/w 0-70°C. It features bipolar technology, matte tin finish, and Gull Wing terminals. Ideal for telecom circuits, this small outline package is surface-mountable and has a rectangular shape.

R-PDSO-G14

e3

8.65 mm

2

1

14

70 Cel

0 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

Not Qualified

1.75 mm

12 V

YES

BIPOLAR

TELECOM CIRCUIT

COMMERCIAL

MATTE TIN

GULL WING

1.27 mm

DUAL

3.9 mm

XR2211ACP-F by Exar

XR2211ACP-F

Exar

Exar's XR2211ACP-F is a 14-terminal telecom IC with 12V power supply, operating from 0 to 70°C. It features matte tin finish, through-hole terminals, and nominal voltage of 12V. Ideal for telecom circuits, this bipolar technology IC has a rectangular package style measuring 7.62mm in width and 19.305mm in length.

R-PDIP-T14

e3

19.305 mm

1

14

70 Cel

0 Cel

PLASTIC/EPOXY

DIP

DIP14,.3

RECTANGULAR

IN-LINE

12

Not Qualified

5.33 mm

Other Telecom ICs

.009 mA

12 V

NO

BIPOLAR

TELECOM CIRCUIT

COMMERCIAL

MATTE TIN

THROUGH-HOLE

2.54 mm

DUAL

7.62 mm

ADV7619KSVZ-P by Analog Devices

ADV7619KSVZ-P

Analog Devices

ADV7619KSVZ-P by Analog Devices is a 128-terminal telecom IC with CMOS technology. It operates b/w 0-70°C, with a supply voltage of 1.8V and matte tin terminal finish. This square-shaped IC in flatpack style is ideal for telecom circuit applications.

S-PQFP-G128

e3

14 mm

3

1

128

70 Cel

0 Cel

PLASTIC/EPOXY

HTFQFP

SQUARE

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

260

1.2 mm

1.8 V

YES

CMOS

TELECOM CIRCUIT

COMMERCIAL

Matte Tin (Sn) - annealed

GULL WING

.4 mm

QUAD

14 mm

AFE4300PN by Texas Instruments

AFE4300PN

Texas Instruments

AFE4300PN by Texas Instruments is a telecom interface IC with 2 channels and 80 terminals. It operates at temperatures from 0 to 70°C, with a supply voltage of 3.3V. The package style is flatpack, low profile, fine pitch, making it suitable for voltage output applications in telecommunications circuits.

3.4 V

DIFFERENTIAL

S-PQFP-G80

e4

12 mm

3

2

1

80

70 Cel

0 Cel

VOLTAGE

BINARY/TWOS COMP

PLASTIC/EPOXY

LFQFP

QFP80,.55SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

3

Not Qualified

16

1.6 mm

Codecs

.00097 mA

3.3 V

YES

TELECOM CIRCUIT

COMMERCIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

12 mm

LM96551SQ/NOPB by Texas Instruments

LM96551SQ/NOPB

Texas Instruments

LM96551SQ/NOPB by Texas Instruments is a telecom interface IC with 80 terminals in a square chip carrier package. Operating b/w 0-70°C, it has a terminal pitch of 0.5mm and MSL level of 3. Ideal for telecom circuits, its compact design with no lead terminals suits applications requiring very thin profiles.

S-XQCC-N80

12 mm

3

1

80

70 Cel

0 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

YES

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

.5 mm

QUAD

30

12 mm

LM96551SQE/NOPB by Texas Instruments

LM96551SQE/NOPB

Texas Instruments

Texas Instruments LM96551SQE/NOPB is a 80-terminal square chip carrier with matte tin finish. Operating b/w 0-70°C, it's a telecom circuit IC suitable for telecom interfaces. With 0.8mm seated height and 12x12mm dimensions, it offers quad terminals at 0.5mm pitch for commercial-grade applications.

S-XQCC-N80

e3

12 mm

3

1

80

70 Cel

0 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

YES

TELECOM CIRCUIT

COMMERCIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

12 mm

LM96551SQX/NOPB by Texas Instruments

LM96551SQX/NOPB

Texas Instruments

LM96551SQX/NOPB by Texas Instruments is a telecom interface IC with 80 terminals in a square chip carrier package. Operating temperature range of 0-70°C, peak reflow temp of 260°C. Ideal for telecom circuits due to its thin profile and no lead terminal form.

S-XQCC-N80

12 mm

3

1

80

70 Cel

0 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

YES

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

.5 mm

QUAD

30

12 mm

LM96550SQX/NOPB by Texas Instruments

LM96550SQX/NOPB

Texas Instruments

LM96550SQX/NOPB by Texas Instruments is a 80-terminal CMOS telecom IC with -10V to 10V supply voltage range. It operates b/w 0-70°C, featuring matte tin finish and quad terminal position. Ideal for telecom circuits, this chip carrier has a very thin profile and measures 12mm x 12mm in size.

S-XQCC-N80

e3

12 mm

3

-10 V

1

80

70 Cel

0 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

10 V

YES

CMOS

TELECOM CIRCUIT

COMMERCIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

12 mm

RF430CL330HTB by Texas Instruments

RF430CL330HTB

Texas Instruments

Texas Instruments RF430CL330HTB is a CMOS telecom IC with 14 terminals, operating at 0-70°C. It has a supply voltage of 3.3V and is surface mountable in a small outline package. Ideal for telecom circuits, it offers dual terminal position and commercial temperature grade suitability.

R-PDSO-G14

1

14

70 Cel

0 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

3.3 V

YES

CMOS

TELECOM CIRCUIT

COMMERCIAL

GULL WING

DUAL

MLX90109CDC-AAA-000-RE by Melexis N V

MLX90109CDC-AAA-000-RE

Melexis N V

MLX90109CDC-AAA-000-RE by Melexis N V is a telecom IC with 8 terminals, operating at -40 to 70°C. It has a small outline package style, matte tin finish, and gull wing terminal form. Ideal for telecom circuits, it requires a nominal 5V supply voltage and features a rectangular shape measuring 4.9mm x 3.9mm.

R-PDSO-G8

e3

4.9 mm

1

1

8

70 Cel

0 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

260

1.72 mm

5 V

YES

TELECOM CIRCUIT

COMMERCIAL

MATTE TIN

GULL WING

1.27 mm

DUAL

3.9 mm

WL1801MODGBMOCR by Texas Instruments

WL1801MODGBMOCR

Texas Instruments

WL1801MODGBMOCR by Texas Instruments is a telecom IC with 100 terminals, operating at 3.7V. It offers a data rate of 100 Mbps and can withstand temperatures from -20 to 70°C. Ideal for telecom applications requiring high-speed data transmission in commercial-grade environments.

100 Mbps

R-PBGA-B100

e4

13.4 mm

3

1

100

70 Cel

-20 Cel

PLASTIC/EPOXY

LGA

LGA100(UNSPEC)

RECTANGULAR

GRID ARRAY

260

2.9/4.8

Not Qualified

2 mm

Other Telecom ICs

3.7 V

YES

TELECOM CIRCUIT

COMMERCIAL

NICKEL PALLADIUM GOLD

BUTT

.7 mm

BOTTOM

30

13.3 mm

WL1805MODGBMOCR by Texas Instruments

WL1805MODGBMOCR

Texas Instruments

Texas Instruments' WL1805MODGBMOCR is a Telecom Interface IC with 100 terminals in a grid array package. Operating at -20 to 70°C, it supports data rates up to 100 Mbps at 3.7V supply voltage. Ideal for telecom circuits, this surface-mount IC has a compact rectangular shape and nickel palladium gold finish.

100 Mbps

R-PBGA-B100

e4

13.4 mm

3

1

100

70 Cel

-20 Cel

PLASTIC/EPOXY

LGA

LGA100(UNSPEC)

RECTANGULAR

GRID ARRAY

260

2.9/4.8

Not Qualified

2 mm

Other Telecom ICs

3.7 V

YES

TELECOM CIRCUIT

COMMERCIAL

NICKEL PALLADIUM GOLD

BUTT

.7 mm

BOTTOM

30

13.3 mm

WL1805MODGBMOCT by Texas Instruments

WL1805MODGBMOCT

Texas Instruments

WL1805MODGBMOCT by Texas Instruments is a telecom interface IC with 100 terminals in a rectangular grid array package. Operating at -20 to 70°C, it supports data rates up to 100 Mbps at 3.7V supply voltage. Ideal for commercial applications requiring high-speed telecommunications functionality.

100 Mbps

R-PBGA-B100

e4

13.4 mm

3

1

100

70 Cel

-20 Cel

PLASTIC/EPOXY

LGA

LGA100(UNSPEC)

RECTANGULAR

GRID ARRAY

260

2.9/4.8

Not Qualified

2 mm

Other Telecom ICs

3.7 V

YES

TELECOM CIRCUIT

COMMERCIAL

NICKEL PALLADIUM GOLD

BUTT

.7 mm

BOTTOM

30

13.3 mm

WL1831MODGBMOCT by Texas Instruments

WL1831MODGBMOCT

Texas Instruments

WL1831MODGBMOCT by Texas Instruments is a telecom IC with 100 terminals in a grid array package. It operates at -20 to 70°C, with a data rate of 100 Mbps and nominal voltage of 3.7V. Ideal for telecom circuits, it features surface mount capability and measures 13.4mm x 13.3mm in size.

100 Mbps

R-PBGA-B100

e4

13.4 mm

3

1

100

70 Cel

-20 Cel

PLASTIC/EPOXY

LGA

LGA100(UNSPEC)

RECTANGULAR

GRID ARRAY

260

2.9/4.8

Not Qualified

2 mm

Other Telecom ICs

3.7 V

YES

TELECOM CIRCUIT

COMMERCIAL

NICKEL PALLADIUM GOLD

BUTT

.7 mm

BOTTOM

30

13.3 mm

MAX5935CAX by Maxim Integrated

MAX5935CAX

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: SSOP; Package Shape: RECTANGULAR;

R-PDSO-G36

15.375 mm

1

36

70 Cel

0 Cel

PLASTIC/EPOXY

SSOP

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

NOT SPECIFIED

2.65 mm

YES

BICMOS

TELECOM CIRCUIT

COMMERCIAL

GULL WING

.8 mm

DUAL

NOT SPECIFIED

7.5 mm

MAX2105CWI by Maxim Integrated

MAX2105CWI

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR;

R-PDSO-G28

e0

17.9 mm

1

1

28

70 Cel

0 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

245

Not Qualified

2.65 mm

5 V

YES

BIPOLAR

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

GULL WING

1.27 mm

DUAL

7.5 mm

MAX3267CSA by Maxim Integrated

MAX3267CSA

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

R-PDSO-G8

e0

4.9 mm

1

1

8

70 Cel

0 Cel

PLASTIC/EPOXY

SOP

SOP8,.25

RECTANGULAR

SMALL OUTLINE

3/5

Not Qualified

1.75 mm

Other Telecom ICs

.05 mA

3.3 V

YES

BIPOLAR

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

GULL WING

1.27 mm

DUAL

3.9 mm

SN75FC1000PJD by Texas Instruments

SN75FC1000PJD

Texas Instruments

SN75FC1000PJD by Texas Instruments is a telecom interface IC with 64 terminals, operating at 3.3V. It features BICMOS technology, GULL WING terminal form, and 0.5mm pitch. Ideal for telecom circuits, it has a temperature range of 0-70°C and low supply current of 0.25mA.

S-PQFP-G64

10 mm

1

64

70 Cel

0 Cel

PLASTIC/EPOXY

HTFQFP

TQFP64,.47SQ

SQUARE

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

NOT SPECIFIED

3.3

Not Qualified

1.2 mm

Other Telecom ICs

.25 mA

3.3 V

YES

BICMOS

TELECOM CIRCUIT

COMMERCIAL

GULL WING

.5 mm

QUAD

NOT SPECIFIED

10 mm

CY7B923-SC by Cypress Semiconductor

CY7B923-SC

Cypress Semiconductor

CY7B923-SC by Cypress Semiconductor is a BICMOS technology Telecom IC with 28 terminals, operating at 5V. It has a small outline package style and can withstand temperatures from 0 to 70°C. Ideal for telecom circuits, it features GULL WING terminal form and tin/lead finish.

R-PDSO-G28

e0

17.905 mm

1

1

28

70 Cel

0 Cel

PLASTIC/EPOXY

SOP

SOP28,.4

RECTANGULAR

SMALL OUTLINE

225

5

Not Qualified

2.67 mm

Other Telecom ICs

85 mA

5 V

YES

BICMOS

TELECOM CIRCUIT

COMMERCIAL

Tin/Lead (Sn/Pb)

GULL WING

1.27 mm

DUAL

30

7.5 mm

CY7B923-JC by Cypress Semiconductor

CY7B923-JC

Cypress Semiconductor

CY7B923-JC by Cypress Semiconductor is a 28-terminal BICMOS chip carrier with 5V supply, suitable for telecom circuits. It operates b/w 0-70°C, has a terminal pitch of 1.27mm, and consumes up to 85mA current.

S-PQCC-J28

e0

11.53 mm

3

1

28

70 Cel

0 Cel

PLASTIC/EPOXY

QCCJ

LDCC28,.5SQ

SQUARE

CHIP CARRIER

5

Not Qualified

4.57 mm

Other Telecom ICs

85 mA

5 V

YES

BICMOS

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

J BEND

1.27 mm

QUAD

11.53 mm

MAX3120CSA by Maxim Integrated

MAX3120CSA

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

R-PDSO-G8

e0

4.9 mm

1

1

8

70 Cel

0 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

Not Qualified

1.75 mm

3.3 V

YES

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

GULL WING

1.27 mm

DUAL

3.9 mm

MAX3120CUA by Maxim Integrated

MAX3120CUA

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;

S-PDSO-G8

e0

3 mm

1

1

8

70 Cel

0 Cel

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.1 mm

3.3 V

YES

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

GULL WING

.65 mm

DUAL

3 mm

MAX3750CEE by Maxim Integrated

MAX3750CEE

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: HSSOP; Package Shape: RECTANGULAR;

R-PDSO-G16

e0

4.9 mm

1

1

16

70 Cel

0 Cel

PLASTIC/EPOXY

HSSOP

SSOP16,.25

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

3.3

Not Qualified

1.75 mm

Other Telecom ICs

.084 mA

3.3 V

YES

BIPOLAR

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

GULL WING

.635 mm

DUAL

3.9 mm

MAX3751CEE by Maxim Integrated

MAX3751CEE

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: HSSOP; Package Shape: RECTANGULAR;

R-PDSO-G16

e0

4.89 mm

1

1

16

70 Cel

0 Cel

PLASTIC/EPOXY

HSSOP

SSOP16,.25

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

3.3

Not Qualified

1.75 mm

Other Telecom ICs

.078 mA

3.3 V

YES

BIPOLAR

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

GULL WING

.635 mm

DUAL

3.9 mm

AD9816JSRL by Analog Devices

AD9816JSRL

Analog Devices

AD9816JSRL by Analog Devices is a 44-terminal IC with CMOS technology, operating at 0-70°C. It features a 5V supply voltage, GULL WING terminals, and is ideal for TELECOM CIRCUIT applications. The package is SQUARE in shape, made of PLASTIC/EPOXY material, and has a FLATPACK style with 0.8mm terminal pitch.

S-PQFP-G44

e0

10 mm

1

44

70 Cel

0 Cel

PLASTIC/EPOXY

QFP

SQUARE

FLATPACK

Not Qualified

2.45 mm

5 V

YES

CMOS

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

GULL WING

.8 mm

QUAD

10 mm

MAX3265CUB by Maxim Integrated

MAX3265CUB

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: HTSSOP; Package Shape: SQUARE;

S-PDSO-G10

e0

3 mm

1

1

10

70 Cel

0 Cel

PLASTIC/EPOXY

HTSSOP

TSSOP10,.19,20

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

240

3.3/5

Not Qualified

1.1 mm

ATM/SONET/SDH ICs

.076 mA

3.3 V

YES

BIPOLAR

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

GULL WING

.5 mm

DUAL

20

3 mm

MAX3265CUE by Maxim Integrated

MAX3265CUE

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: HTSSOP; Package Shape: RECTANGULAR;

R-PDSO-G16

e0

5 mm

1

1

16

70 Cel

0 Cel

PLASTIC/EPOXY

HTSSOP

TSSOP16,.25

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

3.3/5

Not Qualified

1.1 mm

ATM/SONET/SDH ICs

.076 mA

3.3 V

YES

BIPOLAR

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

GULL WING

.65 mm

DUAL

4.4 mm

MAX3268CUB by Maxim Integrated

MAX3268CUB

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: HTSSOP; Package Shape: SQUARE;

S-PDSO-G10

e0

3 mm

1

1

10

70 Cel

0 Cel

PLASTIC/EPOXY

HTSSOP

TSSOP10,.19,20

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

240

3.3/5

Not Qualified

1.1 mm

ATM/SONET/SDH ICs

.062 mA

3.3 V

YES

BIPOLAR

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

GULL WING

.5 mm

DUAL

20

3 mm

MAX3269CUB by Maxim Integrated

MAX3269CUB

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: HTSSOP; Package Shape: SQUARE;

S-PDSO-G10

e0

3 mm

1

1

10

70 Cel

0 Cel

PLASTIC/EPOXY

HTSSOP

TSSOP10,.19,20

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

240

3.3/5

Not Qualified

1.1 mm

ATM/SONET/SDH ICs

.078 mA

3.3 V

YES

BIPOLAR

TELECOM CIRCUIT

COMMERCIAL

Tin/Lead (Sn85Pb15)

GULL WING

.5 mm

DUAL

20

3 mm

MAX3750CEE-T by Maxim Integrated

MAX3750CEE-T

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: HSSOP; Package Shape: RECTANGULAR;

R-PDSO-G16

e0

4.9 mm

1

1

16

70 Cel

0 Cel

PLASTIC/EPOXY

HSSOP

SSOP16,.25

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

3.3

Not Qualified

1.75 mm

Other Telecom ICs

.084 mA

3.3 V

YES

BIPOLAR

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

GULL WING

.635 mm

DUAL

3.9 mm

CYRF7936-40LFXC by Cypress Semiconductor

CYRF7936-40LFXC

Cypress Semiconductor

CYRF7936-40LFXC by Cypress: Telecom IC with 2.5/3.3V supplies, 40 terminals in square package. Operates b/w 0-70°C, ideal for telecom circuits due to low profile and matte tin finish. Supports 2.4V nominal voltage with 0.5mm terminal pitch for commercial applications.

S-XQCC-N40

e3

6 mm

3

1

40

70 Cel

0 Cel

UNSPECIFIED

HVQCCN

LCC40,.24SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

2.5/3.3

Not Qualified

1 mm

Other Telecom ICs

2.4 V

YES

TELECOM CIRCUIT

COMMERCIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

20

6 mm

HFBR-5320Z by Broadcom

HFBR-5320Z

Broadcom

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: UNSPECIFIED; Package Shape: RECTANGULAR; Nominal Supply Voltage: 5 V; JESD-609 Code: e3;

R-XXFO-X

e3

1

70 Cel

0 Cel

UNSPECIFIED

RECTANGULAR

FIBER OPTIC

260

Not Qualified

5 V

NO

TELECOM CIRCUIT

COMMERCIAL

MATTE TIN

UNSPECIFIED

UNSPECIFIED

TLK3138ZDU by Texas Instruments

TLK3138ZDU

Texas Instruments

TLK3138ZDU by Texas Instruments is a telecom IC with 2 transceivers, operating at 3125 Mbps data rate. It has a package style of grid array, with 484 terminals and power supplies ranging from 1.2V to 2.5V. Ideal for telecom circuit applications due to its CMOS technology and commercial temperature grade suitability.

3125 Mbps

S-PBGA-B484

e1

23 mm

4

2

484

2

70 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

GRID ARRAY

260

1.2,1.5,2.5

Not Qualified

2.42 mm

Network Interfaces

1.2 V

YES

CMOS

TELECOM CIRCUIT

COMMERCIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

23 mm

CY7B9234-270JXCT by Cypress Semiconductor

CY7B9234-270JXCT

Cypress Semiconductor

CY7B9234-270JXCT by Cypress Semiconductor is a BICMOS technology chip carrier with 28 terminals. It operates b/w 0-70°C, has matte tin finish, and supports 5V supply voltage. Ideal for telecom circuits, it is a square-shaped, surface-mountable IC for various telecom interface applications.

S-PQCC-J28

e3

11.5316 mm

3

1

28

70 Cel

0 Cel

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

260

Not Qualified

4.572 mm

5 V

YES

BICMOS

TELECOM CIRCUIT

COMMERCIAL

MATTE TIN

J BEND

1.27 mm

QUAD

20

11.5316 mm

CY7B9334-270JXC by Cypress Semiconductor

CY7B9334-270JXC

Cypress Semiconductor

CY7B9334-270JXC by Cypress Semiconductor is a BICMOS technology telecom IC with 28 terminals in a square chip carrier package. It operates b/w 0°C to 70°C, suitable for telecom circuits requiring a nominal voltage of 5V. The PLASTIC/EPOXY body material and J BEND terminal form make it ideal for surface mount applications.

S-PQCC-J28

11.5316 mm

1

28

70 Cel

0 Cel

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

NOT SPECIFIED

Not Qualified

4.572 mm

5 V

YES

BICMOS

TELECOM CIRCUIT

COMMERCIAL

J BEND

1.27 mm

QUAD

NOT SPECIFIED

11.5316 mm

DS31256B by Maxim Integrated

DS31256B

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

S-PBGA-B256

e0

27 mm

1

256

70 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

Not Qualified

2.54 mm

3.3 V

YES

CMOS

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

BALL

1.27 mm

BOTTOM

27 mm

TLK3138GDU by Texas Instruments

TLK3138GDU

Texas Instruments

TLK3138GDU by Texas Instruments is a telecom IC with 2 transceivers, operating at 3125 Mbps data rate. It has a package style of grid array, suitable for commercial temperature grade applications. The IC supports power supplies of 1.2V, 1.5V, and 2.5V in a square package shape with 484 terminals.

3125 Mbps

S-PBGA-B484

e0

4

2

484

2

70 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

GRID ARRAY

220

1.2,1.5,2.5

Not Qualified

Network Interfaces

1.2 V

YES

CMOS

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

BALL

1 mm

BOTTOM

20

DS2291/87-22291-000 by Maxim Integrated

DS2291/87-22291-000

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 30; Package Shape: RECTANGULAR; Package Style (Meter): MICROELECTRONIC ASSEMBLY;

R-XSMA-N30

e0

1

30

70 Cel

0 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

Not Qualified

5 V

NO

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

NO LEAD

SINGLE

MRF24WB0MA/RM by Microchip Technology

MRF24WB0MA/RM

Microchip Technology

MRF24WB0MA/RM by Microchip: 3.3V supply, 36 terminals, telecom IC for commercial use. Rectangular package, surface mountable. Ideal for telecom circuit applications in temperatures from 0 to 70°C.

R-XUUC-N36

e3

1

36

70 Cel

0 Cel

UNSPECIFIED

DIE

MODULE,36LEAD,.8

RECTANGULAR

UNCASED CHIP

3.3

Not Qualified

Other Telecom ICs

3.3 V

YES

TELECOM CIRCUIT

COMMERCIAL

MATTE TIN

NO LEAD

UPPER

MRF24WB0MB/RM by Microchip Technology

MRF24WB0MB/RM

Microchip Technology

MRF24WB0MB/RM by Microchip Tech is a 36-terminal IC with telecom circuit type. Operating temp range: 0-70°C, supply voltage: 3.3V. Ideal for telecom interfaces due to its surface mount capability and commercial temperature grade suitability.

R-XUUC-N36

e3

1

36

70 Cel

0 Cel

UNSPECIFIED

DIE

RECTANGULAR

UNCASED CHIP

Not Qualified

3.3 V

YES

TELECOM CIRCUIT

COMMERCIAL

MATTE TIN

NO LEAD

UPPER

TLK2711AJRZQE by Texas Instruments

TLK2711AJRZQE

Texas Instruments

TLK2711AJRZQE by Texas Instruments is a telecom interface IC with 80 terminals in a square grid array package. Operating at 2.5V, it has a temperature range of 0-70°C and terminal finish of Tin Silver Copper. Ideal for telecom circuits, this IC features a very thin profile and fine pitch design for commercial applications.

S-PBGA-B80

e1

5 mm

3

1

80

70 Cel

0 Cel

PLASTIC/EPOXY

VFBGA

BGA80,9X9,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

2.5

Not Qualified

1 mm

Other Telecom ICs

2.5 V

YES

TELECOM CIRCUIT

COMMERCIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

5 mm

AD1803JRU by Analog Devices

AD1803JRU

Analog Devices

AD1803JRU by Analog Devices is a Telecom Interface IC with 24 terminals, operating at 3.3/5V. Its CMOS technology and GULL WING terminal form make it ideal for telecom circuits in commercial-grade applications. The small outline package with a rectangular shape and dual terminal position offers versatility for surface mount installations.

R-PDSO-G24

e0

7.8 mm

1

24

70 Cel

0 Cel

PLASTIC/EPOXY

TSSOP

TSSOP24,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

3.3/5

Not Qualified

1.1 mm

Modems

3.3 V

YES

CMOS

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

GULL WING

.65 mm

DUAL

4.4 mm

DS2174Q by Maxim Integrated

DS2174Q

Maxim Integrated

DS2174Q by Maxim Integrated is a 44-terminal telecom IC with 3.3V supply voltage, suitable for telecom circuit applications. It features a square chip carrier package style, operates b/w 0-70°C temperature range, and has a low supply current of 0.06mA. Ideal for telecommunications interfaces requiring surface mount technology in commercial-grade environments.

S-PQCC-J44

e0

16.585 mm

3

1

44

70 Cel

0 Cel

PLASTIC/EPOXY

QCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

3.3

Not Qualified

4.57 mm

Other Telecom ICs

.06 mA

3.3 V

YES

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

J BEND

1.27 mm

QUAD

16.585 mm

MAX3268CUB-T by Maxim Integrated

MAX3268CUB-T

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: HTSSOP; Package Shape: SQUARE;

S-PDSO-G10

e0

3 mm

1

1

10

70 Cel

0 Cel

PLASTIC/EPOXY

HTSSOP

TSSOP10,.19,20

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

240

3.3/5

Not Qualified

1.1 mm

ATM/SONET/SDH ICs

.062 mA

3.3 V

YES

BIPOLAR

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

GULL WING

.5 mm

DUAL

20

3 mm

MAX3768CUB by Maxim Integrated

MAX3768CUB

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: HTSSOP; Package Shape: SQUARE;

S-PDSO-G10

e0

3 mm

1

1

10

70 Cel

0 Cel

PLASTIC/EPOXY

HTSSOP

TSSOP10,.19,20

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

240

3.3/5

Not Qualified

1.1 mm

ATM/SONET/SDH ICs

.062 mA

3.3 V

YES

BIPOLAR

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

GULL WING

.5 mm

DUAL

20

3 mm

MAX3768CUB-T by Maxim Integrated

MAX3768CUB-T

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: HTSSOP; Package Shape: SQUARE;

S-PDSO-G10

e0

3 mm

1

1

10

70 Cel

0 Cel

PLASTIC/EPOXY

HTSSOP

TSSOP10,.19,20

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

240

3.3/5

Not Qualified

1.1 mm

ATM/SONET/SDH ICs

.062 mA

3.3 V

YES

BIPOLAR

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

GULL WING

.5 mm

DUAL

20

3 mm