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CYRF7936-40LFXC

Cypress Semiconductor

CYRF7936-40LFXC by Cypress Semiconductor

CYRF7936-40LFXC by Cypress: Telecom IC with 2.5/3.3V supplies, 40 terminals in square package. Operates b/w 0-70°C, ideal for telecom circuits due to low profile and matte tin finish. Supports 2.4V nominal voltage with 0.5mm terminal pitch for commercial applications.

Median Price

$1.480

Lifecycle Status

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5

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5 parts In-Stock

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$1.480

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$1.330

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$1.250

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Avnet

USA . 5 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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$1.480

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Vyrian

USA . 4,888 parts In-Stock

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Prism Electronics

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Ampacity Inc.

Singapore . 5 parts In-Stock

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Argo Parts USA

USA . 4,571 parts In-Stock

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Continental Prestige Electronics

USA . 2,854 parts In-Stock

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$1.450

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AZTECH Wire

Italy . 459 parts In-Stock

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$10.567

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Netroflash

USA . 1,000 parts In-Stock

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$1.406

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$1.376

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Overview

Discover the CYRF7936-40LFXC from Cypress Semiconductor, a cutting-edge telecom interface IC that delivers unmatched quality and reliability. With a sleek square package shape and 40 terminals, this chip carrier boasts a very thin profile for seamless integration. Ideal for various applications, this innovative product operates at a wide temperature range and offers a nominal supply voltage of 2.4V. Experience the value and benefits of Cypress Semiconductor's expertise in delivering top-notch telecom ICs with the CYRF7936-40LFXC. Elevate your projects with superior performance and unmatched efficiency today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly, making this product suitable for high volume production.

Package Shape: SQUARE

Square package shape provides better stability and heat dissipation compared to other shapes, ensuring reliability in operation.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages allows for versatility in different application scenarios.

No. of Terminals: 40

40 terminals provide ample connectivity options for interfacing with other components in a telecom system.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile packaging offers efficient thermal management and space-saving design.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for operation in cold environments without compromising functionality.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance for long-term reliability.

Terminal Position: QUAD

Quad terminal position simplifies board layout and allows for efficient routing of signal connections.

Maximum Seated Height: 1 mm

Low maximum seated height enables compact design and saves space in tight layouts.

Width: 6 mm

Compact width dimensions make it suitable for applications with limited board space.

Maximum Time At Peak Reflow Temperature (s): 20

Short time at peak reflow temperature ensures safe assembly without damage to the component.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance allows for robust soldering processes.

Length: 6 mm

Small length dimensions contribute to the overall compact form factor of the product.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures compatibility with standard operating environments.

Terminal Form: NO LEAD

No-lead terminal form is environmentally friendly and complies with regulations restricting the use of lead.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimized performance in communication systems.

Nominal Supply Voltage: 2.4 V

Stable nominal supply voltage of 2.4V ensures proper functionality within the specified operating range.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density mounting and efficient use of board space.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling procedures during assembly and storage.

Technical Specifications

Other Function Telecom Interface ICs CYRF7936-40LFXC attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Cypress Semiconductor

Specs

JESD-30 Code:

S-XQCC-N40

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

2.4 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

20

Width:

6 mm

Trade Compliance

CYRF7936-40LFXC Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Cypress Semiconductor

Cypress Semiconductor was an American semiconductor design and manufacturing company. It offered NOR flash memories, F-RAM and SRAM Traveo microcontrollers, PSoC programmable system-on-chip solutions, analog and PMIC Power Management ICs, CapSense capacitive touch-sensing controllers, Wireless BLE Bluetooth Low-Energy and USB connectivity solutions. Its headquarters were in San Jose, California, with operations in the United States, Ireland, India and the Philippines. In April 2016, Cypress Semiconductors announced the acquisition of Broadcom’s Wireless Internet of Things Business. The deal was closed in July 2016. In June 2019, Infineon Technologies announced it would acquire Cypress for $9.4 billion.The deal closed in April 2020, making Infineon one of the world's top 10 semiconductor manufacturers. Some of its main competitors included Microchip Technology, NXP Semiconductors, Renesas Electronics and Micron Technology.

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