Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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TDA5102XUMA1
Infineon Technologies
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
R-PDSO-G16
5 mm
3
1
16
85 Cel
-25 Cel
PLASTIC/EPOXY
TSSOP
RECTANGULAR
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Not Qualified
1.2 mm
3 V
YES
TELECOM CIRCUIT
OTHER
GULL WING
.65 mm
DUAL
4.4 mm
TDA5100XUMA1
TDA5101XUMA1
TDK5111XUMA1
TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
125 Cel
-40 Cel
TSSOP16,.25
2.1/4
Other Telecom ICs
.0195 mA
BIPOLAR
AUTOMOTIVE
TDA5250XUMA1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 38; Package Code: TSSOP; Package Shape: RECTANGULAR;
R-PDSO-G38
9.7 mm
38
INDUSTRIAL
.5 mm
TDK5110XUMA1
Infineon's TDK5110XUMA1 is a telecom IC with 16 terminals, operating from -40 to 125°C. It has a small outline package, 0.65mm terminal pitch, and Gull Wing terminals. Ideal for automotive applications requiring a 3V supply voltage in a compact design.
TDK5101XUMA1
TDA5212XUMA1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: TSSOP; Package Shape: RECTANGULAR;
R-PDSO-G28
28
5 V
TDA5220XUMA1
105 Cel
TDA5200XUMA1
TDA5200XUMA1 by Infineon is a telecom IC with 28 terminals, operating from -40 to 85°C. It has a small outline package style, Gull Wing terminal form, and 5V supply voltage. Ideal for telecom circuits, it is surface mountable and has a moisture sensitivity level of 3.
e3
TIN
TDA5201XUMA1
TDA5201XUMA1 by Infineon is a telecom IC with 28 terminals, operating from -40 to 85°C. It has a small outline package style, Gull Wing terminals, and 5V supply voltage. Ideal for telecom circuits in industrial applications due to its compact size and high temperature range.
TDK5100XUMA1
Infineon's TDK5100XUMA1 is a telecom IC with 16 terminals, operating at -40 to 125°C. It has a supply voltage of 3V and low current draw of 0.0095mA. This small outline package is ideal for automotive applications due to its bipolar technology and moisture sensitivity level of 3.
.0095 mA
MLX90109CDC-AAA-000-RE
Melexis N V
MLX90109CDC-AAA-000-RE by Melexis N V is a telecom IC with 8 terminals, operating at -40 to 70°C. It has a small outline package style, matte tin finish, and gull wing terminal form. Ideal for telecom circuits, it requires a nominal 5V supply voltage and features a rectangular shape measuring 4.9mm x 3.9mm.
R-PDSO-G8
4.9 mm
8
70 Cel
0 Cel
SOP
SMALL OUTLINE
260
1.72 mm
COMMERCIAL
MATTE TIN
1.27 mm
3.9 mm
MLX90109EDC-AAA-000-TU
MLX90109EDC-AAA-000-TU by Melexis N V is an 8-terminal telecom IC with a supply voltage of 5V. It operates in industrial temperature range (-40 to 85°C) and has a small outline package style. Ideal for telecom circuits, it features matte tin terminal finish and gull wing terminal form.
ENW89829A2KF
Panasonic
The Panasonic ENW89829A2KF is a telecom interface IC with 24 terminals, operating b/w -40°C to 85°C. It has a data rate of 2.178 Mbps and operates at a nominal voltage of 3.3V. This surface-mount IC is ideal for industrial applications requiring high-speed telecom circuit functionality in compact microelectronic assemblies.
2.178 Mbps
R-XXMA-N24
9.5 mm
24
UNSPECIFIED
XMA
MICROELECTRONIC ASSEMBLY
250
2 mm
3.3 V
NO LEAD
50
9 mm
CC2564NSYFVR
Texas Instruments
The Texas Instruments CC2564NSYFVR is a telecom IC with 54 terminals in a grid array package. It operates b/w -40°C to 85°C, with peak reflow temperature of 260°C. Suitable for industrial applications, it has a nominal voltage of 3.6V and features tin silver copper terminal finish.
R-PBGA-B54
e1
54
BGA
GRID ARRAY
3.6 V
TIN SILVER COPPER
BALL
BOTTOM
30
CC2564NYFVR
Texas Instruments CC2564NYFVR is a 54-terminal IC with industrial temperature grade. It operates at -40 to 85°C, with a peak reflow temp of 260°C. Ideal for telecom circuits, it has a nominal voltage of 3.6V and features surface mount packaging in plastic/epoxy material.
CC2564YFVR
Texas Instruments CC2564YFVR is a telecom IC with 54 terminals, operating b/w -40 to 85°C. It has a supply voltage of 3.6V and peak reflow temperature of 260°C. Ideal for industrial applications requiring reliable telecom circuit interfaces in a surface-mount grid array package.
CC2564YFVT
The Texas Instruments CC2564YFVT is a telecom IC with 54 terminals, operating from -40 to 85°C. It has a supply voltage of 3.6V and peak reflow temperature of 260°C. This rectangular grid array package is ideal for industrial telecom applications.
ALM-GP002-TR1G
Broadcom
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 12; Package Code: QCCN; Package Shape: RECTANGULAR;
R-XQCC-N12
4.5 mm
12
QCCN
CHIP CARRIER
1.05 mm
1.8 V
QUAD
2.2 mm
WL1801MODGBMOCR
WL1801MODGBMOCR by Texas Instruments is a telecom IC with 100 terminals, operating at 3.7V. It offers a data rate of 100 Mbps and can withstand temperatures from -20 to 70°C. Ideal for telecom applications requiring high-speed data transmission in commercial-grade environments.
100 Mbps
R-PBGA-B100
e4
13.4 mm
100
-20 Cel
LGA
LGA100(UNSPEC)
2.9/4.8
3.7 V
NICKEL PALLADIUM GOLD
BUTT
.7 mm
13.3 mm
WL1805MODGBMOCR
Texas Instruments' WL1805MODGBMOCR is a Telecom Interface IC with 100 terminals in a grid array package. Operating at -20 to 70°C, it supports data rates up to 100 Mbps at 3.7V supply voltage. Ideal for telecom circuits, this surface-mount IC has a compact rectangular shape and nickel palladium gold finish.
WL1805MODGBMOCT
WL1805MODGBMOCT by Texas Instruments is a telecom interface IC with 100 terminals in a rectangular grid array package. Operating at -20 to 70°C, it supports data rates up to 100 Mbps at 3.7V supply voltage. Ideal for commercial applications requiring high-speed telecommunications functionality.
WL1831MODGBMOCT
WL1831MODGBMOCT by Texas Instruments is a telecom IC with 100 terminals in a grid array package. It operates at -20 to 70°C, with a data rate of 100 Mbps and nominal voltage of 3.7V. Ideal for telecom circuits, it features surface mount capability and measures 13.4mm x 13.3mm in size.
XWL1801MODGAMOCT
XWL1801MODGAMOCT by Texas Instruments is a telecom IC with 100 terminals in a rectangular grid array package. It operates b/w -20°C to 70°C, with a compact size of 13.3mm x 13.4mm and terminal pitch of 0.7mm. Ideal for telecom interface applications requiring surface mount technology.
R-PBGA-N100
XWL1805MODGAMOCT
XWL1805MODGAMOCT by Texas Instruments is a telecom interface IC with 100 terminals in a rectangular grid array package. It operates b/w -20°C to 70°C, with a compact size of 13.3mm width and 13.4mm length. Ideal for telecom circuits, this IC is surface mountable and has a terminal pitch of 0.7mm for various applications.
XWL1831MODGAMOCT
XWL1831MODGAMOCT by Texas Instruments is a telecom interface IC with 100 terminals in a grid array package. It operates b/w -20°C to 70°C, making it suitable for various telecom circuit applications. The compact rectangular design with bottom terminals and no-lead form factor ensures easy surface mount installation.
XWL1835MODGAMOCT
XWL1835MODGAMOCT by Texas Instruments is a telecom IC with 100 terminals in a rectangular grid array package. It operates b/w -20°C to 70°C, with a nominal voltage of 3.7V. This IC is designed for telecom circuit applications requiring surface mount installation and has a compact size of 13.3mm x 13.4mm x 2mm.
CC2560BRVMR
CC2560BRVMR by Texas Instruments is a telecom IC with 76 terminals, operating at -40 to 85°C. It has a data rate of 4 Mbps and nominal voltage of 3.6V, suitable for telecom circuit applications. The package style is chip carrier with matte tin finish, measuring 7.73mm in width and 8mm in length.
4 Mbps
R-PQCC-N76
8 mm
76
HVQCCN
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
.9 mm
.6 mm
7.73 mm
CC2564BRVMT
Texas Instruments CC2564BRVMT is a 76-terminal telecom IC with a 3.6V supply voltage, operating b/w -40 to 85°C. It features matte tin finish, quad terminal position, and chip carrier package style for industrial applications requiring thin profile and surface mount compatibility.
TCC-106A-RT
Onsemi
TCC-106A-RT by Onsemi is a Telecom Circuit IC with 20 terminals in a very thin profile grid array package. Operating temperature ranges from -30 to 85 °C, suitable for telecom interface applications. It has a nominal voltage of 3.3V and terminal pitch of 0.4mm, making it ideal for compact electronic devices.
R-PBGA-B20
2.58 mm
20
-30 Cel
VFBGA
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
.4 mm
2.23 mm
TCP-3027N-QT
TCP-3027N-QT by Onsemi is a RECTANGULAR CHIP CARRIER with 6 terminals, suitable for TELECOM CIRCUIT applications. It operates b/w -30 °C to 85°C, with a compact size of 1.2mm width and 1.6mm length. Ideal for surface mount installations due to its very thin profile design.
R-XQCC-N6
1.6 mm
6
VQCCN
CHIP CARRIER, VERY THIN PROFILE
1 mm
SA606DK/03,118
NXP Semiconductors
SA606DK/03,118 by NXP Semiconductors is a telecom interface IC designed for industrial applications. It features a dual terminal configuration with a max operating temp of 85 °C and operates at a nominal voltage of 3V. Its compact size (4.4mm x 6.5mm) ensures efficient integration in various devices.
R-PDSO-G20
6.5 mm
LSSOP
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
1.5 mm
BGA711N7E6327XTSA1
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 6; Package Code: HVSON; Package Shape: RECTANGULAR;
R-PDSO-N6
HVSON
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
2.8 V
1.3 mm
BGM1034N7E6327XUSA1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 7; Package Code: HVSON; Package Shape: RECTANGULAR;
R-PDSO-N7
2.3 mm
7
NOT SPECIFIED
.77 mm
.54 mm
1.7 mm
TDA5252XUMA1
TDA5251XUMA1
TDA5255XUMA1
HTMS1101FTB/AF,115
HTMS1101FTB/AF,115 by NXP Semiconductors is a compact telecom interface IC designed for industrial applications. It features a dual terminal design with a max operating temp of 85 °C and operates in extreme conditions from -40 °C. Its small outline and no-lead form factor make it ideal for space-constrained environments.
R-PDSO-N3
1.45 mm
VSON
LCC3(UNSPEC)
SMALL OUTLINE, VERY THIN PROFILE
CMOS
HTMS1201FTB/AF,115
HTMS1201FTB/AF,115 by NXP Semiconductors is a compact telecom interface IC designed for industrial applications. It features a dual terminal design with a max operating temp of 85 °C and operates in extreme conditions from -40 °C. Its small outline and no-lead form factor make it ideal for space-constrained environments.
BGM1032N7E6327XUSA1
BGM1032N7E6327XUSA1 by Infineon is a telecom IC with 6 terminals, operating from -40 to 85°C. It has a small outline package style and nominal voltage of 2.7V, suitable for industrial applications requiring a very thin profile and surface mount capability.
2.7 V
BGM1043N7E6327XUSA1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 6; Package Code: HVSON; Package Shape: RECTANGULAR;
BGS12AL74E6327XTSA1
Infineon's BGS12AL74E6327XTSA1 is a telecom IC with 6 terminals in a rectangular chip carrier package. Operating b/w -30°C to 85°C, it has a nominal voltage of 2.8V. Ideal for telecom interfaces, this surface-mount IC features gold terminal finish and 0.55mm pitch.
R-XBCC-B6
BCC
GOLD
.55 mm
BGS12AL76E6327XTMA1
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BUTT; No. of Terminals: 6; Package Code: BCC; Package Shape: RECTANGULAR;
1.26 mm
.48 mm
1.4 mm
RI-STU-MRD1-30
RI-STU-MRD1-30 by Texas Instruments is a 30-terminal RECTANGULAR package MICROELECTRONIC ASSEMBLY with -20 to 50 °C operating temp range. It features DUAL terminals, TELECOM CIRCUIT type, and 5V supply voltage. Ideal for telecom interface applications requiring reliable performance in various temperature conditions.
R-XDMA-T30
50 Cel
NO
THROUGH-HOLE
MAX5935CAX
Maxim Integrated
TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 36; Package Code: SSOP; Package Shape: RECTANGULAR;
R-PDSO-G36
15.375 mm
36
SSOP
SMALL OUTLINE, SHRINK PITCH
2.65 mm
BICMOS
.8 mm
7.5 mm
AD8015AR
Analog Devices
AD8015AR by Analog Devices is a telecom interface IC with 8 terminals, operating b/w -40 to 85°C. It has a supply voltage of 5V and max current of 26mA. Ideal for industrial applications requiring small outline packages in telecom circuits.
e0
240
1.75 mm
26 mA
TIN LEAD
BA4116FV-E2
ROHM
ROHM's BA4116FV-E2 is a 16-terminal telecom interface IC with a small outline, thin profile package. It operates b/w -30°C to 85°C and has a peak reflow temperature of 260°C. Ideal for telecom circuits, it has a nominal voltage of 5V and Gull Wing terminal form.
e3/e2
TIN/TIN COPPER
10
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