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RECTANGULAR Cellphone ICs 86

Cellphone ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Companding Law Data Rate Filter Maximum Gain Tolerance Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Maximum Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Resolution (um) Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
SX8653IWLTRT by Semtech

SX8653IWLTRT

Semtech

Semtech's SX8653IWLTRT is a 14-terminal cellphone IC in a small outline package with industrial temperature grade. Operating from -40 to 85°C, it has a nominal voltage of 1.8V and terminal pitch of 0.5mm. Ideal for baseband circuits, this IC is surface mountable and features a very thin profile for compact designs.

R-PDSO-N14

4 mm

1

14

85 Cel

-40 Cel

PLASTIC/EPOXY

HVSON

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

Not Qualified

.8 mm

1.8 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

DUAL

NOT SPECIFIED

3 mm

ACFM-7103-BLK by Broadcom

ACFM-7103-BLK

Broadcom

RF FRONT END CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 7; Package Shape: RECTANGULAR; Surface Mount: NO; Terminal Position: DUAL;

R-XDMA-N7

7

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NO

RF FRONT END CIRCUIT

NO LEAD

DUAL

ACFM-7103-TR1 by Broadcom

ACFM-7103-TR1

Broadcom

RF FRONT END CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 7; Package Shape: RECTANGULAR; Terminal Position: DUAL; JESD-30 Code: R-XDMA-N7;

R-XDMA-N7

7

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NO

RF FRONT END CIRCUIT

NO LEAD

DUAL

LMH6523SQE/NOPB by Texas Instruments

LMH6523SQE/NOPB

Texas Instruments

Texas Instruments LMH6523SQE/NOPB is a 54-terminal cellphone IC with 4 channels, RF and baseband circuit type. It operates b/w -40 to 85°C, with a gain tolerance of 25.74 dB. Suitable for telecom applications due to its compact rectangular chip carrier package style.

25.74 dB

R-XQCC-N54

e3

10 mm

2

4

1

54

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

485 mA

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

5.5 mm

SKY13437-11 by Skyworks Solutions

SKY13437-11

Skyworks Solutions

SKY13437-11 by Skyworks Solutions is a Cellphone IC with 22 terminals in RECTANGULAR package. Telecom IC Type: RF AND BASEBAND CIRCUIT, Nominal Voltage: 2.85V, Terminal Pitch: 0.4mm. Ideal for cellphone applications due to its compact MICROELECTRONIC ASSEMBLY and low operating temperatures of -35°C to 90°C.

R-XQMA-N22

3.2 mm

3

1

22

90 Cel

-35 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

260

.9 mm

2.85 V

YES

RF AND BASEBAND CIRCUIT

OTHER

NO LEAD

.4 mm

QUAD

2.5 mm

BGA713N7E6327XTSA1 by Infineon Technologies

BGA713N7E6327XTSA1

Infineon Technologies

BGA713N7E6327XTSA1 by Infineon Technologies is a cellphone IC with 6 terminals in a small outline package. It operates b/w -30°C to 85°C, suitable for RF and baseband circuits. With a nominal voltage of 2.8V, it features tin terminal finish and measures 1.3mm in width and 2mm in length.

R-PDSO-N6

e3

2 mm

1

1

6

85 Cel

-30 Cel

PLASTIC/EPOXY

HVSON

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

2.8 V

YES

RF AND BASEBAND CIRCUIT

OTHER

TIN

NO LEAD

.5 mm

DUAL

1.3 mm

CC1050-RTB1 by Texas Instruments

CC1050-RTB1

Texas Instruments

CC1050-RTB1 by Texas Instruments is a cellphone IC with 24 terminals in a small outline package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V, making it ideal for telecom applications.

R-PDSO-G24

e4

7.8 mm

3

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

260

1.2 mm

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

30

4.4 mm

CC1050-RTR1 by Texas Instruments

CC1050-RTR1

Texas Instruments

CC1050-RTR1 by Texas Instruments is a cellphone IC with 24 terminals in a small outline, thin profile package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V and terminal pitch of 0.65mm.

R-PDSO-G24

e4

7.8 mm

3

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

260

1.2 mm

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

30

4.4 mm

MAX2690EUB by Maxim Integrated

MAX2690EUB

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: TSSOP; Package Shape: RECTANGULAR;

R-PDSO-G10

e0

3 mm

1

1

10

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.092 mm

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

.5 mm

DUAL

2.9465 mm

CC1000PWG3 by Texas Instruments

CC1000PWG3

Texas Instruments

CC1000PWG3 by Texas Instruments is a cellphone IC with 28 terminals, operating at temperatures from -40 to 85°C. It features a supply voltage of 2.5/3.3V and telecom IC type for RF and baseband circuits. The package is small outline, thin profile, with shrink pitch, suitable for industrial applications.

R-PDSO-G28

e4

9.7 mm

3

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP28,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

260

2.5/3.3

Not Qualified

1.2 mm

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

30

4.4 mm

CC1000PWRG3 by Texas Instruments

CC1000PWRG3

Texas Instruments

CC1000PWRG3 by Texas Instruments is a cellphone IC with 28 terminals, operating at temperatures from -40 to 85°C. It features a supply voltage of 2.5/3.3V and telecom IC type for RF and baseband circuits. The package is small outline, thin profile, with gull wing terminals suitable for industrial applications.

R-PDSO-G28

e4

9.7 mm

3

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP28,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

260

2.5/3.3

Not Qualified

1.2 mm

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

30

4.4 mm

MAX2440EAI by Maxim Integrated

MAX2440EAI

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR;

R-PDSO-G28

e0

10.2 mm

1

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

SSOP

SSOP28,.3

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

3.3

Not Qualified

1.99 mm

Other Telecom ICs

.036 mA

3.3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

.65 mm

DUAL

5.29 mm

MAX2421EAI by Maxim Integrated

MAX2421EAI

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR;

R-PDSO-G28

e0

10.2 mm

1

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

SSOP

SSOP28,.3

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

3.3

Not Qualified

1.99 mm

Other Telecom ICs

3.3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

.65 mm

DUAL

5.29 mm

MAX2422EAI by Maxim Integrated

MAX2422EAI

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR;

R-PDSO-G28

e0

10.2 mm

1

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

SSOP

SSOP28,.3

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

3.3

Not Qualified

1.99 mm

Other Telecom ICs

3.3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

.65 mm

DUAL

5.29 mm

ALM-2412-BLKG by Broadcom

ALM-2412-BLKG

Broadcom

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 12; Package Code: BCC; Package Shape: RECTANGULAR;

R-XBCC-B12

3.3 mm

3

1

12

85 Cel

-40 Cel

UNSPECIFIED

BCC

RECTANGULAR

CHIP CARRIER

260

Not Qualified

1.2 mm

2.85 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

BUTT

2 mm

BOTTOM

2.5 mm

ALM-2412-TR1G by Broadcom

ALM-2412-TR1G

Broadcom

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 12; Package Code: BCC; Package Shape: RECTANGULAR;

R-XBCC-B12

3.3 mm

3

1

12

85 Cel

-40 Cel

UNSPECIFIED

BCC

RECTANGULAR

CHIP CARRIER

260

Not Qualified

1.2 mm

2.85 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

BUTT

2 mm

BOTTOM

2.5 mm

ALM-2712-BLKG by Broadcom

ALM-2712-BLKG

Broadcom

RF AND BASEBAND CIRCUIT; Terminal Form: BUTT; No. of Terminals: 12; Package Code: BCC; Package Shape: RECTANGULAR; Qualification: Not Qualified;

R-XBCC-B12

3 mm

3

1

12

UNSPECIFIED

BCC

RECTANGULAR

CHIP CARRIER

260

Not Qualified

1.1 mm

2.7 V

YES

RF AND BASEBAND CIRCUIT

BUTT

1.25 mm

BOTTOM

2.5 mm

ALM-2712-TR1G by Broadcom

ALM-2712-TR1G

Broadcom

RF AND BASEBAND CIRCUIT; Terminal Form: BUTT; No. of Terminals: 12; Package Code: BCC; Package Shape: RECTANGULAR; No. of Functions: 1;

R-XBCC-B12

3 mm

3

1

12

UNSPECIFIED

BCC

RECTANGULAR

CHIP CARRIER

260

Not Qualified

1.1 mm

2.7 V

YES

RF AND BASEBAND CIRCUIT

BUTT

1.25 mm

BOTTOM

2.5 mm

MAX2312EEI by Maxim Integrated

MAX2312EEI

Maxim Integrated

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR;

R-PDSO-G28

e0

9.89 mm

1

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

SSOP

SSOP28,.25

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

3/5

Not Qualified

1.73 mm

Other Telecom ICs

.0415 mA

2.75 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

.635 mm

DUAL

3.9 mm

AD607ARS-REEL by Analog Devices

AD607ARS-REEL

Analog Devices

AD607ARS-REEL by Analog Devices is a Cellphone IC with 20 terminals in a small outline package. It operates b/w -25°C to 85°C, with a nominal voltage of 3V. Ideal for baseband circuits, this IC has Gull Wing terminals and is surface mountable.

R-PDSO-G20

e0

7.2 mm

1

1

20

85 Cel

-25 Cel

PLASTIC/EPOXY

SSOP

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

240

Not Qualified

2 mm

3 V

YES

BASEBAND CIRCUIT

OTHER

TIN LEAD

GULL WING

.65 mm

DUAL

5.3 mm

TRF4900PW by Texas Instruments

TRF4900PW

Texas Instruments

TRF4900PW by Texas Instruments is a 24-terminal cellphone IC with 3V supply voltage. It features CMOS technology, RF and baseband circuit for telecom applications. With a small outline package style, it operates b/w 0-70°C temperature range.

R-PDSO-G24

7.8 mm

1

24

70 Cel

0 Cel

PLASTIC/EPOXY

TSSOP

TSSOP24,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

NOT SPECIFIED

3

Not Qualified

1.2 mm

Other Telecom ICs

.075 mA

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

COMMERCIAL

GULL WING

.65 mm

DUAL

NOT SPECIFIED

4.4 mm

TRF4400PWG4 by Texas Instruments

TRF4400PWG4

Texas Instruments

TRF4400PWG4 by Texas Instruments is a cellphone IC with 24 terminals, operating at 3V. It features CMOS technology, RF and baseband circuit for telecom applications. The package is small outline, thin profile, with shrink pitch, suitable for surface mount assembly.

R-PDSO-G24

7.8 mm

1

24

60 Cel

-20 Cel

PLASTIC/EPOXY

TSSOP

TSSOP24,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

NOT SPECIFIED

3

Not Qualified

1.2 mm

Other Telecom ICs

.075 mA

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

OTHER

GULL WING

.65 mm

DUAL

NOT SPECIFIED

4.4 mm

TRF4900PWG4 by Texas Instruments

TRF4900PWG4

Texas Instruments

TRF4900PWG4 by Texas Instruments is a cellphone IC with 24 terminals, operating at 0-70°C. It features a supply voltage of 2.5/3.3V and CMOS technology for RF and baseband circuits. The package is small outline, thin profile, with shrink pitch, suitable for telecom applications.

R-PDSO-G24

7.8 mm

1

24

70 Cel

0 Cel

PLASTIC/EPOXY

TSSOP

TSSOP24,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

NOT SPECIFIED

2.5/3.3

Not Qualified

1.2 mm

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

COMMERCIAL

GULL WING

.65 mm

DUAL

NOT SPECIFIED

4.4 mm

SI4136-F-BT by Silicon Labs

SI4136-F-BT

Silicon Labs

SI4136-F-BT by Silicon Labs is a cellphone IC with 24 terminals, operating at 3/3.3V. It features a small outline package style and CMOS technology, suitable for RF and baseband circuits in telecom applications. With a temperature range of -40 to 85°C, it offers low supply current at 0.031mA for industrial-grade performance.

R-PDSO-G24

7.8 mm

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP24,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

NOT SPECIFIED

3/3.3

Not Qualified

1.2 mm

Other Telecom ICs

.031 mA

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

GULL WING

.65 mm

DUAL

NOT SPECIFIED

4.4 mm

SI4136-F-GTR by Silicon Labs

SI4136-F-GTR

Silicon Labs

SI4136-F-GTR by Silicon Labs is a cellphone IC with 24 terminals in a small outline, thin profile package. Operating b/w -40 to 85°C, it features RF and baseband circuits for telecom applications. With matte tin finish and gull wing terminals, it's ideal for industrial use at 3V supply voltage.

R-PDSO-G24

e3

7.8 mm

3

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

260

Not Qualified

1.2 mm

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

GULL WING

.65 mm

DUAL

4.4 mm

SI4136-F-GT by Silicon Labs

SI4136-F-GT

Silicon Labs

SI4136-F-GT by Silicon Labs is a cellphone IC with 24 terminals, operating at 3/3.3V. It features a small outline package style and CMOS technology, suitable for RF and baseband circuits in industrial telecom applications. With a temperature range of -40 to 85°C, it offers low supply current of 0.031mA for efficient performance.

R-PDSO-G24

e3

7.8 mm

3

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP24,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

260

3/3.3

Not Qualified

1.2 mm

Other Telecom ICs

.031 mA

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

GULL WING

.65 mm

DUAL

4.4 mm

CC1000PW by Texas Instruments

CC1000PW

Texas Instruments

CC1000PW by Texas Instruments is a cellphone IC with 28 terminals, operating at -40 to 85°C. It features a supply voltage of 2.5/3.3V, RF and baseband circuitry for telecom applications, and CMOS technology in a small outline package suitable for industrial use.

R-PDSO-G28

e4

9.7 mm

3

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP28,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

260

2.5/3.3

Not Qualified

1.2 mm

Other Telecom ICs

.001 mA

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

30

4.4 mm

CC1000YZR by Texas Instruments

CC1000YZR

Texas Instruments

CC1000YZR by Texas Instruments is a Cellphone IC with 28 terminals in a rectangular package. It operates at temperatures ranging from -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V, making it ideal for telecom applications.

R-PBGA-B28

4.034 mm

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA28,4X7,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.5/3.3

Not Qualified

.652 mm

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

BALL

.5 mm

BOTTOM

2.339 mm

CC1000YZ by Texas Instruments

CC1000YZ

Texas Instruments

CC1000YZ by Texas Instruments is a cellphone IC with 28 terminals in a rectangular grid array package. Operating at temperatures from -40 to 85°C, it features CMOS technology and RF/baseband circuitry for telecom applications. With a thin profile of 0.652mm, it supports power supplies of 2.5/3.3V for industrial-grade performance.

R-PBGA-B28

4.034 mm

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA28,4X7,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.5/3.3

Not Qualified

.652 mm

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

BALL

.5 mm

BOTTOM

2.339 mm

TRF4400PWRG4 by Texas Instruments

TRF4400PWRG4

Texas Instruments

TRF4400PWRG4 by Texas Instruments is a cellphone IC with 24 terminals, operating at 3V. It features CMOS technology, RF and baseband circuit for telecom applications. The package is small outline, thin profile, with shrink pitch, suitable for surface mount assembly.

R-PDSO-G24

7.8 mm

1

24

60 Cel

-20 Cel

PLASTIC/EPOXY

TSSOP

TSSOP24,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

NOT SPECIFIED

3

Not Qualified

1.2 mm

Other Telecom ICs

.075 mA

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

OTHER

GULL WING

.65 mm

DUAL

NOT SPECIFIED

4.4 mm

ACFM-7102-BLK by Broadcom

ACFM-7102-BLK

Broadcom

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: UNSPECIFIED; No. of Terminals: 6; Package Shape: RECTANGULAR; Qualification: Not Qualified;

R-XXMA-X6

3

1

6

100 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

Not Qualified

NO

BASEBAND CIRCUIT

INDUSTRIAL

UNSPECIFIED

UNSPECIFIED

ACFM-7102-TR1 by Broadcom

ACFM-7102-TR1

Broadcom

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: UNSPECIFIED; No. of Terminals: 6; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;

R-XXMA-X6

3

1

6

100 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

Not Qualified

NO

BASEBAND CIRCUIT

INDUSTRIAL

UNSPECIFIED

UNSPECIFIED

CC1000-RTB1 by Texas Instruments

CC1000-RTB1

Texas Instruments

CC1000-RTB1 by Texas Instruments is a cellphone IC with 28 terminals, operating at temperatures from -40 to 85°C. It features a supply voltage of 2.5/3.3V and telecom IC type for RF and baseband circuits. This CMOS technology device has a small outline package style suitable for industrial applications.

R-PDSO-G28

e4

9.7 mm

3

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP28,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

260

2.5/3.3

Not Qualified

1.2 mm

Other Telecom ICs

.001 mA

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

30

4.4 mm

CC1000-RTR1 by Texas Instruments

CC1000-RTR1

Texas Instruments

CC1000-RTR1 by Texas Instruments is a cellphone IC with 28 terminals, operating at -40 to 85°C. It features a supply voltage of 2.5/3.3V, RF and baseband circuit for telecom applications, and CMOS technology in a small outline package. Ideal for industrial use due to its nickel palladium gold finish and dual terminal position.

R-PDSO-G28

e4

9.7 mm

3

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP28,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

260

2.5/3.3

Not Qualified

1.2 mm

Other Telecom ICs

.001 mA

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

30

4.4 mm

1605C by Murata Manufacturing

1605C

Murata Manufacturing

Murata Manufacturing's 1605C is a BASEBAND CIRCUIT for cellphones. It has 16 terminals in IN-LINE package style, with dimensions of 7.62mm width and 22.5mm length. Operating temperature range is 0-70°C, making it ideal for commercial telecom applications.

R-XDIP-T16

22.5 mm

1

16

70 Cel

0 Cel

UNSPECIFIED

DIP

RECTANGULAR

IN-LINE

NOT SPECIFIED

Not Qualified

6.84 mm

NO

BASEBAND CIRCUIT

COMMERCIAL

THROUGH-HOLE

2.54 mm

DUAL

NOT SPECIFIED

7.62 mm

MAX2392ETI by Maxim Integrated

MAX2392ETI

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: QCCN; Package Shape: RECTANGULAR;

R-XQCC-N28

e0

1

28

85 Cel

-40 Cel

UNSPECIFIED

QCCN

LCC28,.2SQ,20

RECTANGULAR

CHIP CARRIER

3

Not Qualified

Other Telecom ICs

.04 mA

3 V

YES

BICMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

MAX2396EGI by Maxim Integrated

MAX2396EGI

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: QCCN; Package Shape: RECTANGULAR;

R-XQCC-N28

e0

1

28

85 Cel

-40 Cel

UNSPECIFIED

QCCN

LCC28,.2SQ,20

RECTANGULAR

CHIP CARRIER

3

Not Qualified

Other Telecom ICs

.038 mA

3 V

YES

BICMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

MAX2401ETI by Maxim Integrated

MAX2401ETI

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: QCCN; Package Shape: RECTANGULAR;

R-XQCC-N28

1

28

85 Cel

-40 Cel

UNSPECIFIED

QCCN

LCC28,.2SQ,20

RECTANGULAR

CHIP CARRIER

3

Not Qualified

Other Telecom ICs

.043 mA

3 V

YES

BICMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

ALM-1522-BLKG by Broadcom

ALM-1522-BLKG

Broadcom

BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 22; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 2; Nominal Supply Voltage: 5 V;

R-XQMA-N22

2

1

22

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

260

Not Qualified

5 V

YES

BASEBAND CIRCUIT

NO LEAD

QUAD

SA601DK,112 by NXP Semiconductors

SA601DK,112

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;

R-PDSO-G20

e4

6.5 mm

1

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

260

Not Qualified

1.5 mm

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

GULL WING

.65 mm

DUAL

30

4.4 mm

SA601DK,118 by NXP Semiconductors

SA601DK,118

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;

R-PDSO-G20

e4

6.5 mm

1

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Not Qualified

1.5 mm

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

4.4 mm

SA620DK,112 by NXP Semiconductors

SA620DK,112

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;

R-PDSO-G20

e4

6.5 mm

1

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

260

Not Qualified

1.5 mm

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

GULL WING

.65 mm

DUAL

30

4.4 mm

SA620DK,118 by NXP Semiconductors

SA620DK,118

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;

R-PDSO-G20

e4

6.5 mm

1

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

260

Not Qualified

1.5 mm

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

GULL WING

.65 mm

DUAL

30

4.4 mm

ACFM-7101-TR1G by Broadcom

ACFM-7101-TR1G

Broadcom

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: UNSPECIFIED; No. of Terminals: 6; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;

R-XXMA-X6

3

1

6

100 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

260

Not Qualified

NO

BASEBAND CIRCUIT

INDUSTRIAL

UNSPECIFIED

UNSPECIFIED

SX8652IWLTRT by Semtech

SX8652IWLTRT

Semtech

Semtech's SX8652IWLTRT is a Cellphone IC with 14 terminals, operating temp. range of -40 to 85°C, and 1.8V supply voltage. It features a small outline package suitable for baseband circuits in telecom applications.

R-PDSO-N14

e3

4 mm

2

1

14

85 Cel

-40 Cel

PLASTIC/EPOXY

HVSON

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

260

Not Qualified

.8 mm

1.8 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

DUAL

3 mm

TRF4900PWR by Texas Instruments

TRF4900PWR

Texas Instruments

TRF4900PWR by Texas Instruments is a cellphone IC with 24 terminals, operating at 3V. It features a small outline package style and CMOS technology for RF and baseband circuits. Suitable for telecom applications, it has a temperature range of -20 to 60°C.

R-PDSO-G24

7.8 mm

1

24

60 Cel

-20 Cel

PLASTIC/EPOXY

TSSOP

TSSOP24,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

NOT SPECIFIED

3

Not Qualified

1.2 mm

Other Telecom ICs

.075 mA

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

COMMERCIAL

GULL WING

.65 mm

DUAL

NOT SPECIFIED

4.4 mm

MAX2606EUT-T by Maxim Integrated

MAX2606EUT-T

Maxim Integrated

MAX2606EUT-T by Maxim Integrated is a small outline, low profile cellphone IC with 6 terminals. Operating temperature ranges from -40 to 85°C. Ideal for baseband circuits in telecom applications due to its compact size and industrial temperature grade suitability.

R-PDSO-G6

e0

2.9 mm

1

1

6

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Not Qualified

1.45 mm

2.75 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

.95 mm

DUAL

1.625 mm

MAX2607EUT-T by Maxim Integrated

MAX2607EUT-T

Maxim Integrated

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: LSSOP; Package Shape: RECTANGULAR;

R-PDSO-G6

e0

2.9 mm

1

1

6

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Not Qualified

1.45 mm

2.75 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

.95 mm

DUAL

1.625 mm