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RECTANGULAR Cellphone ICs 86

Cellphone ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Companding Law Data Rate Filter Maximum Gain Tolerance Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Maximum Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Resolution (um) Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
MAX2608EUT-T by Maxim Integrated

MAX2608EUT-T

Maxim Integrated

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: LSSOP; Package Shape: RECTANGULAR;

R-PDSO-G6

e0

2.9 mm

1

1

6

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Not Qualified

1.45 mm

2.75 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

.95 mm

DUAL

1.625 mm

MAX2609EUT-T by Maxim Integrated

MAX2609EUT-T

Maxim Integrated

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: LSSOP; Package Shape: RECTANGULAR;

R-PDSO-G6

e0

2.9 mm

1

1

6

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Not Qualified

1.45 mm

2.75 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

.95 mm

DUAL

1.625 mm

DSL01-010SC5 by STMicroelectronics

DSL01-010SC5

STMicroelectronics

DSL01-010SC5 by STMicroelectronics is a compact baseband circuit IC designed for cellphone applications. It features a 5-terminal gull-wing design with a peak reflow temp of 260 °C and max time at peak of 30s. Its plastic/epoxy package ensures durability in mobile devices.

R-PDSO-G5

e4

1

5

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

Not Qualified

YES

BASEBAND CIRCUIT

NICKEL PALLADIUM GOLD

GULL WING

DUAL

30

DSL01-024SC5 by STMicroelectronics

DSL01-024SC5

STMicroelectronics

DSL01-024SC5 by STMicroelectronics is a compact baseband circuit IC designed for cellphone applications. It features a 5-terminal gull-wing design with a peak reflow temp of 260 °C and a max time at peak of 30s. Its plastic/epoxy package ensures durability in mobile devices.

R-PDSO-G5

e4

1

5

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

Not Qualified

YES

BASEBAND CIRCUIT

NICKEL PALLADIUM GOLD

GULL WING

DUAL

30

TRF4903PW by Texas Instruments

TRF4903PW

Texas Instruments

TRF4903PW by Texas Instruments is a cellphone IC with 24 terminals, operating voltage of 2.7V, and max supply current of 0.042mA. It features RF and baseband circuits for telecom applications, in a small outline package suitable for industrial temperature range.

R-PDSO-G24

7.8 mm

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP24,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

NOT SPECIFIED

2.7

Not Qualified

1.2 mm

Other Telecom ICs

.042 mA

2.7 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

GULL WING

.65 mm

DUAL

NOT SPECIFIED

4.4 mm

MAX2685EEE-T by Maxim Integrated

MAX2685EEE-T

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR;

R-PDSO-G16

e0

4.89 mm

1

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

SSOP

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

Not Qualified

1.73 mm

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

.635 mm

DUAL

3.9 mm

MAX2690EUB-T by Maxim Integrated

MAX2690EUB-T

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: TSSOP; Package Shape: RECTANGULAR;

R-PDSO-G10

e0

3 mm

1

1

10

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.092 mm

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

.5 mm

DUAL

2.9465 mm

AD8348ARUZ by Analog Devices

AD8348ARUZ

Analog Devices

AD8348ARUZ by Analog Devices is a Cellphone IC with 28 terminals, operating at -40 to 85°C. It has a supply voltage of 5V and uses BIPOLAR technology for BASEBAND CIRCUIT in telecom applications. The package is RECTANGULAR, PLASTIC/EPOXY material, with GULL WING terminals and a small outline of 9.7mm x 4.4mm x 1.2mm dimensions.

R-PDSO-G28

e3

9.7 mm

1

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP28,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

260

5

Not Qualified

1.2 mm

Other Telecom ICs

5 V

YES

BIPOLAR

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

GULL WING

.65 mm

DUAL

30

4.4 mm

TRF4903PWR by Texas Instruments

TRF4903PWR

Texas Instruments

TRF4903PWR by Texas Instruments is a cellphone IC with 24 terminals, operating voltage of 2.7V, and low supply current of 0.043mA. It features RF and baseband circuits for telecom applications. The package is small outline, thin profile, suitable for surface mount with a rectangular shape made of plastic/epoxy material.

R-PDSO-G24

7.8 mm

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP24,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

NOT SPECIFIED

2.7

Not Qualified

1.2 mm

Other Telecom ICs

.043 mA

2.7 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

GULL WING

.65 mm

DUAL

NOT SPECIFIED

4.4 mm

TRF4900PWRG4 by Texas Instruments

TRF4900PWRG4

Texas Instruments

TRF4900PWRG4 by Texas Instruments is a cellphone IC with 24 terminals, operating at 3V. It features CMOS technology, RF and baseband circuit for telecom applications. The package is small outline, thin profile, suitable for surface mount with a temperature range of -20 to 60°C.

R-PDSO-G24

7.8 mm

1

24

60 Cel

-20 Cel

PLASTIC/EPOXY

TSSOP

TSSOP24,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

NOT SPECIFIED

3

Not Qualified

1.2 mm

Other Telecom ICs

.075 mA

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

COMMERCIAL

GULL WING

.65 mm

DUAL

NOT SPECIFIED

4.4 mm

AD607ARSZ by Analog Devices

AD607ARSZ

Analog Devices

AD607ARSZ by Analog Devices is a cellphone IC with 20 terminals in a small outline package. Operating temp range -25 to 85°C, nominal voltage of 3V, and peak reflow temp of 260°C. Ideal for telecom applications as a baseband circuit due to its compact size and gull wing terminal form.

R-PDSO-G20

e3

7.2 mm

1

1

20

85 Cel

-25 Cel

PLASTIC/EPOXY

SSOP

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

260

Not Qualified

2 mm

3 V

YES

BASEBAND CIRCUIT

OTHER

MATTE TIN

GULL WING

.65 mm

DUAL

5.3 mm

TRF4903PWG4 by Texas Instruments

TRF4903PWG4

Texas Instruments

TRF4903PWG4 by Texas Instruments is a cellphone IC with 24 terminals, operating at -40 to 85°C. It features RF and baseband circuits, with a supply voltage of 2.7V and max current of 0.042mA. This small outline package is ideal for telecom applications requiring compact design and low power consumption.

R-PDSO-G24

7.8 mm

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP24,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

NOT SPECIFIED

2.7

Not Qualified

1.2 mm

Other Telecom ICs

.042 mA

2.7 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

GULL WING

.65 mm

DUAL

NOT SPECIFIED

4.4 mm

TRF4903PWRG4 by Texas Instruments

TRF4903PWRG4

Texas Instruments

TRF4903PWRG4 by Texas Instruments is a cellphone IC with 24 terminals, operating at -40 to 85°C. It features a supply voltage of 2.7V and low current consumption of 0.043mA. Ideal for RF and baseband circuits in telecom applications due to its compact size and dual terminal position.

R-PDSO-G24

7.8 mm

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP24,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

NOT SPECIFIED

2.7

Not Qualified

1.2 mm

Other Telecom ICs

.043 mA

2.7 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

GULL WING

.65 mm

DUAL

NOT SPECIFIED

4.4 mm

ADF7901BRUZ-RL by Analog Devices

ADF7901BRUZ-RL

Analog Devices

Analog Devices' ADF7901BRUZ-RL is a cellphone IC with 24 terminals, operating at 0-50 °C. It features a 3V supply voltage, RF and baseband circuitry for telecom applications. The small outline package has a thin profile, matte tin finish, and dual terminal position.

R-PDSO-G24

e3

7.8 mm

1

1

24

50 Cel

0 Cel

PLASTIC/EPOXY

TSSOP

TSSOP24,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

260

3

Not Qualified

1.2 mm

Other Telecom ICs

3 V

YES

RF AND BASEBAND CIRCUIT

COMMERCIAL

MATTE TIN

GULL WING

.65 mm

DUAL

30

4.4 mm

AD607ARSZ-REEL by Analog Devices

AD607ARSZ-REEL

Analog Devices

AD607ARSZ-REEL by Analog Devices is a BASEBAND CIRCUIT for cellphones. It operates b/w -25 to 85°C with a supply voltage of 3V. This SMALL OUTLINE IC has 20 terminals, matte tin finish, and measures 7.2mm x 5.3mm in size for telecom applications.

R-PDSO-G20

e3

7.2 mm

1

1

20

85 Cel

-25 Cel

PLASTIC/EPOXY

SSOP

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

260

Not Qualified

2 mm

3 V

YES

BASEBAND CIRCUIT

OTHER

MATTE TIN

GULL WING

.65 mm

DUAL

5.3 mm

CC1050PWG3 by Texas Instruments

CC1050PWG3

Texas Instruments

CC1050PWG3 by Texas Instruments is a cellphone IC with 24 terminals in a small outline package. It operates at temperatures ranging from -40 to 85°C and has a supply voltage of 3V. This RF and baseband circuit technology features a terminal pitch of 0.65mm, making it ideal for industrial telecom applications.

R-PDSO-G24

e4

7.8 mm

3

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP24,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

260

2.5/3.3

Not Qualified

1.2 mm

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

30

4.4 mm

CC1050PWRG3 by Texas Instruments

CC1050PWRG3

Texas Instruments

CC1050PWRG3 by Texas Instruments is a cellphone IC with 24 terminals, operating at 2.5/3.3V. It features a small outline package style and CMOS technology for RF and baseband circuits. With a temperature range of -40 to 85°C, it is ideal for industrial telecom applications.

R-PDSO-G24

e4

7.8 mm

3

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP24,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

260

2.5/3.3

Not Qualified

1.2 mm

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

30

4.4 mm

CC1050PW by Texas Instruments

CC1050PW

Texas Instruments

The Texas Instruments CC1050PW is a cellphone IC with 24 terminals in a small outline package. It operates at temperatures ranging from -40 to 85°C and has a supply voltage of 3V. This RF and baseband circuit technology features gull wing terminals, making it ideal for industrial telecom applications.

R-PDSO-G24

e4

7.8 mm

3

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP24,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

260

2.5/3.3

Not Qualified

1.2 mm

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

30

4.4 mm

LARA-R211-02B by U-blox Ag

LARA-R211-02B

U-blox Ag

LARA-R211-02B by U-blox Ag is a Cellphone IC with TS 16949 screening. It features RF and baseband circuit, operates at -20 to 65 °C, and requires 3.8V supply voltage. This rectangular GRID ARRAY package is ideal for mobile communication applications.

-40 to 85 extended operating temp available

R-XLGA-N100

26 mm

4

1

100

65 Cel

-20 Cel

UNSPECIFIED

LGA

LGA100(UNSPEC)

RECTANGULAR

GRID ARRAY

TS 16949

2.87 mm

300 mA

3.8 V

YES

RF AND BASEBAND CIRCUIT

NO LEAD

BOTTOM

24 mm

LISA-U200-03S by U-blox Ag

LISA-U200-03S

U-blox Ag

LISA-U200-03S by U-blox Ag is a surface mount Cellphone IC with 76 terminals in a rectangular package. It operates b/w -40 to 85°C, suitable for RF and baseband circuits with a nominal voltage of 3.8V. Its compact size of 22.4mm width and 33.2mm length makes it ideal for mobile communication devices.

R-XQMA-N76

33.2 mm

1

76

85 Cel

-40 Cel

UNSPECIFIED

QMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.87 mm

3.8 V

YES

RF AND BASEBAND CIRCUIT

NO LEAD

1.1 mm

QUAD

22.4 mm

TOBY-L210-03S by U-blox Ag

TOBY-L210-03S

U-blox Ag

TOBY-L210-03S by U-blox Ag is a Cellphone IC with 152 terminals in a rectangular grid array package. Operating b/w -20°C to 65°C, it integrates RF and baseband circuits at 3.8V supply voltage. Ideal for compact mobile devices due to its small dimensions of 24.8mm width and 35.6mm length.

-40 to 85 extended operating temp available

R-XBGA-N152

35.6 mm

4

1

152

65 Cel

-20 Cel

UNSPECIFIED

LGA

RECTANGULAR

GRID ARRAY

2.87 mm

3.8 V

YES

RF AND BASEBAND CIRCUIT

NO LEAD

BOTTOM

24.8 mm

TOBY-L210-65S by U-blox Ag

TOBY-L210-65S

U-blox Ag

TOBY-L210-65S by U-blox Ag is a surface mount Cellphone IC with 1 function. It has 152 terminals and a rectangular package shape. With a max operating temperature of 65°C, it is suitable for RF and baseband circuit applications.

-40 to 85 extended operating temp available

R-XBGA-N152

35.6 mm

4

1

152

65 Cel

-20 Cel

UNSPECIFIED

LGA

RECTANGULAR

GRID ARRAY

2.87 mm

3.8 V

YES

RF AND BASEBAND CIRCUIT

NO LEAD

BOTTOM

24.8 mm

TOBY-L280-03S by U-blox Ag

TOBY-L280-03S

U-blox Ag

TOBY-L280-03S by U-blox Ag is a CELLPHONE IC with 152 terminals in GRID ARRAY package. It operates b/w -20°C to 65°C, ideal for RF and baseband circuits. With a compact size of 24.8mm x 35.6mm x 2.87mm, it's suitable for mobile communication devices.

-40 to 85 extended operating temp available

R-XBGA-N152

35.6 mm

4

1

152

65 Cel

-20 Cel

UNSPECIFIED

LGA

RECTANGULAR

GRID ARRAY

2.87 mm

3.8 V

YES

RF AND BASEBAND CIRCUIT

NO LEAD

BOTTOM

24.8 mm

BLM6G10-30G,118 by NXP Semiconductors

BLM6G10-30G,118

NXP Semiconductors

BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Finish: TIN;

R-PDSO-G16

e3

15.9 mm

3

1

16

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

245

3.6 mm

28 V

YES

BASEBAND CIRCUIT

TIN

GULL WING

1.37 mm

DUAL

30

11 mm

BLM6G10-30G,135 by NXP Semiconductors

BLM6G10-30G,135

NXP Semiconductors

BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Length: 15.9 mm;

R-PDSO-G16

e3

15.9 mm

1

16

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

3.6 mm

28 V

YES

BASEBAND CIRCUIT

Tin (Sn)

GULL WING

1.37 mm

DUAL

11 mm

J-N3-B3E6-LR by Telit Communications Plc

J-N3-B3E6-LR

Telit Communications Plc

Telit Communications Plc's J-N3-B3E6-LR is a cellphone IC with 24 terminals, operating temp. range of -40 to 85°C. It features RF and baseband circuits, suitable for telecom applications. The small outline package measures 12.2mm x 16mm with a seated height of 2.4mm, making it ideal for compact devices.

R-PDSO-N24

16 mm

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

SON

RECTANGULAR

SMALL OUTLINE

2.4 mm

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

DUAL

12.2 mm

A2I25H060GNR1 by NXP Semiconductors

A2I25H060GNR1

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 17; Package Code: HSOP; Package Shape: RECTANGULAR; Surface Mount: YES;

R-PDSO-G17

e3

17.53 mm

3

1

17

PLASTIC/EPOXY

HSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG

260

2.67 mm

28 V

YES

LDMOS

RF AND BASEBAND CIRCUIT

TIN

GULL WING

DUAL

40

9.02 mm

A2I25H060NR1 by NXP Semiconductors

A2I25H060NR1

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 17; Package Code: HSOP; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): 40;

R-PDSO-G17

e3

17.53 mm

3

1

17

PLASTIC/EPOXY

HSOP

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG

260

2.67 mm

28 V

YES

LDMOS

RF AND BASEBAND CIRCUIT

TIN

GULL WING

DUAL

40

9.02 mm

LARA-R202-02B by U-blox Ag

LARA-R202-02B

U-blox Ag

LARA-R202-02B by U-blox Ag is a Cellphone IC with TS 16949 screening. Features RF and baseband circuit for telecom, operates at -20 to 65°C, and requires 3.8V supply voltage. Ideal for compact devices due to its small size of 24x26mm and low seated height of 2.87mm.

-40 to 85 extended operating temp available

R-XLGA-N100

26 mm

4

1

100

65 Cel

-20 Cel

UNSPECIFIED

LGA

LGA100(UNSPEC)

RECTANGULAR

GRID ARRAY

245

TS 16949

2.87 mm

3.8 V

YES

RF AND BASEBAND CIRCUIT

NO LEAD

BOTTOM

24 mm

EG91EXGA-128-SGNS by Quectel Wireless Solutions

EG91EXGA-128-SGNS

Quectel Wireless Solutions

Quectel Wireless Solutions' EG91EXGA-128-SGNS is a Cellphone IC with 102 terminals, operating temp. range of -35 to 75°C, and 3.8V supply voltage. It integrates RF and baseband circuits for telecom applications in a compact rectangular package measuring 25mm x 29mm with a seated height of 2.3mm, suitable for surface mount assembly.

Also has Extended temp from -40 Deg c to 85 Deg c

R-XXMA-N102

29 mm

1

102

75 Cel

-35 Cel

UNSPECIFIED

XMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.3 mm

3.8 V

YES

RF AND BASEBAND CIRCUIT

COMMERCIAL EXTENDED

NO LEAD

UNSPECIFIED

25 mm

NRF9160-SIBA-B1A-R7 by Nordic Semiconductor Asa

NRF9160-SIBA-B1A-R7

Nordic Semiconductor Asa

Nordic Semiconductor's NRF9160-SIBA-B1A-R7 is a CELL IC with RF & baseband circuit. It operates in industrial temp range (-40 to 85°C) with 3.8V supply voltage. This surface-mountable chip has 127 terminals, rectangular shape, and grid array package suitable for cellphone applications.

R-XBGA-N127

16 mm

1

127

85 Cel

-40 Cel

UNSPECIFIED

LGA

LGA127,21X30,20

RECTANGULAR

GRID ARRAY

1.1 mm

3.8 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

BOTTOM

10.5 mm

NRF9160-SIBA-B1A-R by Nordic Semiconductor Asa

NRF9160-SIBA-B1A-R

Nordic Semiconductor Asa

Nordic Semiconductor's NRF9160-SIBA-B1A-R is a CELL IC with RF & BASEBAND CIRCUIT for telecom. It operates in -40 to 85°C, has 127 terminals in GRID ARRAY package style, and requires 3.8V supply voltage. Ideal for cellphone applications due to its compact RECTANGULAR shape and 0.5mm terminal pitch.

R-XBGA-N127

16 mm

1

127

85 Cel

-40 Cel

UNSPECIFIED

LGA

LGA127,21X30,20

RECTANGULAR

GRID ARRAY

1.1 mm

3.8 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

BOTTOM

10.5 mm

M95FA-03-STD by Quectel Wireless Solutions

M95FA-03-STD

Quectel Wireless Solutions

M95FA-03-STD by Quectel Wireless Solutions is a cellphone IC with 42 terminals, operating temperature range of -40 to 85°C. It features RF and baseband circuit for telecom applications. This surface-mount IC has a rectangular package style, measuring 19.9mm in width and 23.6mm in length, making it suitable for compact electronic devices.

R-XQMA-N42

23.6 mm

1

42

85 Cel

-40 Cel

UNSPECIFIED

QMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.65 mm

4 V

YES

RF AND BASEBAND CIRCUIT

NO LEAD

QUAD

19.9 mm

ACPM-7788-TR1 by Broadcom

ACPM-7788-TR1

Broadcom

RF FRONT END CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 42; Package Shape: RECTANGULAR; Surface Mount: YES; JESD-30 Code: R-XQCC-N42;

R-XQCC-N42

7 mm

1

42

RECTANGULAR

.9 mm

YES

RF FRONT END CIRCUIT

NO LEAD

QUAD

5 mm

EG25GGC-128-SGNS by Quectel Wireless Solutions

EG25GGC-128-SGNS

Quectel Wireless Solutions

Quectel Wireless Solutions' EG25GGC-128-SGNS is a compact CELL IC with RF & baseband circuit. Operating temp range -35 to 75°C, it has a low profile of 4.9mm making it ideal for space-constrained applications like IoT devices and mobile communication systems. Package style: Microelectronic Assembly, Terminal position: Single.

also available Extended Temperature Range -40 to 80 degree Celsius

R-XSMA-N

51 mm

1

75 Cel

-35 Cel

UNSPECIFIED

SMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

4.9 mm

3.3 V

YES

RF AND BASEBAND CIRCUIT

NO LEAD

SINGLE

30 mm

BC66NB-04-STD by Quectel Wireless Solutions

BC66NB-04-STD

Quectel Wireless Solutions

Quectel Wireless Solutions BC66NB-04-STD is a CELL IC with 58 terminals, operating temp -35 to 75°C. Telecom IC for RF and baseband circuits, package style MICROELECTRONIC ASSEMBLY. Ideal for compact applications requiring low power consumption.

EXTENDED TEMP AVAILABLE WITH -40 TO 85

R-XQMA-N58

17.7 mm

1

58

75 Cel

-35 Cel

UNSPECIFIED

QMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2 mm

3.3 V

YES

RF AND BASEBAND CIRCUIT

NO LEAD

QUAD

15.8 mm

BG95M1LA-64-SGNS by Quectel Wireless Solutions

BG95M1LA-64-SGNS

Quectel Wireless Solutions

Quectel Wireless Solutions' BG95M1LA-64-SGNS, a CELL IC with 102 terminals in MICROELECTRONIC ASSEMBLY, operates b/w -35°C to 75°C. This RF and BASEBAND CIRCUIT has a nominal voltage of 3.3V, ideal for compact cellphone designs due to its small dimensions of 19.9mm width and 23.6mm length.

EXTENDED TEMP AVAILABLE WITH -40 TO 85

R-XQMA-N102

23.6 mm

1

102

75 Cel

-35 Cel

UNSPECIFIED

QMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.2 mm

3.3 V

NO

RF AND BASEBAND CIRCUIT

NO LEAD

QUAD

19.9 mm

TOBY-L210-03S-03 by U-blox Ag

TOBY-L210-03S-03

U-blox Ag

TOBY-L210-03S-03 by U-blox Ag is a Cellphone IC with 152 terminals in a rectangular grid array package. Operating b/w -20°C to 65°C, it integrates RF and baseband circuits for telecom applications. With a compact size of 24.8mm x 35.6mm and low seated height of 2.87mm, it's ideal for mobile device designs.

-40 to 85 extended operating temp available

R-XBGA-N152

35.6 mm

1

152

65 Cel

-20 Cel

UNSPECIFIED

LGA

RECTANGULAR

GRID ARRAY

2.87 mm

3.8 V

YES

RF AND BASEBAND CIRCUIT

NO LEAD

BOTTOM

24.8 mm