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416 Microcontrollers 33

Microcontrollers
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors Digital To Analog Convertors
SAK-TC1197-512F180EAC by Infineon Technologies

SAK-TC1197-512F180EAC

Infineon Technologies

Microcontrollers; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 416; Package Code: BGA; Package Shape: SQUARE;

32

S-PBGA-B416

e3

3

416

125 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA416,26X26,40

SQUARE

GRID ARRAY

250

1.5,2.5/3.3,3.3,5

Not Qualified

131072

4194304

FLASH

180 rpm

Microcontrollers

600 mA

YES

CMOS

AUTOMOTIVE

MATTE TIN

BALL

1 mm

BOTTOM

SAK-TC1797-512F180EAC by Infineon Technologies

SAK-TC1797-512F180EAC

Infineon Technologies

Microcontrollers; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 416; Package Code: BGA; Package Shape: SQUARE;

YES

32

32

40 MHz

NO

YES

32

S-PBGA-B416

e0

27 mm

3

221

416

125 Cel

-40 Cel

NO

PLASTIC/EPOXY

BGA

BGA416,26X26,40

SQUARE

GRID ARRAY

250

1.5,2.5/3.3,3.3

Not Qualified

131072

4194304

FLASH

2.5 mm

180 rpm

Microcontrollers

1.58 V

1.42 V

1.5 V

YES

CMOS

AUTOMOTIVE

TIN LEAD

BALL

1 mm

BOTTOM

27 mm

TC1796256F150EBEKDUMA1 by Infineon Technologies

TC1796256F150EBEKDUMA1

Infineon Technologies

MICROCONTROLLER; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 416; Package Code: BGA; Package Shape: SQUARE;

YES

24

32

40 MHz

NO

YES

32

S-PBGA-B416

27 mm

3

127

416

8

125 Cel

-10 Cel

NO

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

65536

2097152

FLASH

2.5 mm

150 rpm

1.58 V

1.42 V

1.5 V

YES

CMOS

OTHER

BALL

1 mm

BOTTOM

27 mm

MICROCONTROLLER

128K

ASC(2), CAN(4), ETHERNET, MLI(2), MSC(2), SSC(2)

DMA(16), TIMER(2)

16 Ch 12-Bit(2), FADC 4 Ch 10-Bit

TC1197256F180EACKXUMA1 by Infineon Technologies

TC1197256F180EACKXUMA1

Infineon Technologies

MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 416; Package Code: BGA; Package Shape: SQUARE; Speed: 180 rpm;

YES

24

32

40 MHz

NO

YES

32

27 mm

221

416

NO

BGA

SQUARE

GRID ARRAY

NOT SPECIFIED

180 rpm

1.58 V

1.42 V

1.5 V

YES

CMOS

BALL

1 mm

BOTTOM

NOT SPECIFIED

27 mm

MICROCONTROLLER, RISC

SAK-TC1796-256F150EBD by Infineon Technologies

SAK-TC1796-256F150EBD

Infineon Technologies

Infineon's SAK-TC1796-256F150EBD microcontroller features 32-bit architecture, 24-bit address bus, and 40 MHz clock frequency. Ideal for automotive applications due to its FLASH ROM programmability, 127 I/O lines, and ADC/DMA channels for efficient data processing. Package style is a grid array with a compact size of 27mm x 27mm and low power consumption at max supply current of 700mA.

YES

24

32

40 MHz

NO

YES

32

S-PBGA-B416

27 mm

127

416

125 Cel

-10 Cel

NO

PLASTIC/EPOXY

BGA

BGA416,26X26,40

SQUARE

GRID ARRAY

NOT SPECIFIED

1.5,2.5/3.3,3.3

Not Qualified

65536

2097152

FLASH

2.5 mm

150 rpm

Microcontrollers

700 mA

1.58 V

1.42 V

1.5 V

YES

CMOS

OTHER

BALL

1 mm

BOTTOM

NOT SPECIFIED

27 mm

MICROCONTROLLER

TC1797512F180EFACKXUMA1 by Infineon Technologies

TC1797512F180EFACKXUMA1

Infineon Technologies

Infineon's TC1797512F180EFACKXUMA1 microcontroller features 32-bit address and external data bus width, with a max clock frequency of 90 MHz. Ideal for automotive applications, it offers 416 terminals in a grid array package style, operating b/w -40 to 125 °C temperature range.

YES

32

32

90 MHz

NO

YES

32

S-PBGA-B416

27 mm

221

416

125 Cel

-40 Cel

NO

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

NOT SPECIFIED

FLASH

2.4 mm

180 rpm

1.58 V

1.42 V

1.5 V

YES

CMOS

AUTOMOTIVE

BALL

1 mm

BOTTOM

NOT SPECIFIED

27 mm

MICROCONTROLLER, RISC

SPC5777CCK3MME3R by NXP Semiconductors

SPC5777CCK3MME3R

NXP Semiconductors

NXP Semiconductors' SPC5777CCK3MME3R microcontroller features 32-bit architecture, 8388608 ROM words, and 524288 RAM bytes. Ideal for automotive applications with CAN(6), DSPI(5), EBI, ETHERNET connectivity, and peripherals like DMA(128) and PWM channels. Operating temperature ranges from -40 to 125 °C with a max clock frequency of 40 MHz.

YES

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

0

32

40 MHz

NO

YES

0

S-PBGA-B416

e2

27 mm

3

416

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

524288

8388608

FLASH

2.02 mm

264 rpm

1.32 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

DMA(128), PWM, TEMPERATURE SENSOR

SPC5777CCK3MME3 by NXP Semiconductors

SPC5777CCK3MME3

NXP Semiconductors

NXP Semiconductors' SPC5777CCK3MME3 microcontroller features 32-bit architecture, 40 MHz clock frequency, and 524288 RAM bytes. Ideal for automotive applications with CAN, SCI, SPI connectivity and low power mode support. This CMOS technology-based chip offers high performance in a compact square package.

YES

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SD ADC AVAILABLE.

0

32

YES

E200Z7

40 MHz

NO

YES

0

FLOATING-POINT

YES

S-PBGA-B416

e2

27 mm

YES

3

128

1

5

416

0

8

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

BGA416,26X26,40

SQUARE

GRID ARRAY

260

524288

8388608

FLASH

2.02 mm

264 rpm

1350 mA

1.32 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER

0

CAN(4), SCI(5), SPI(5)

POR

SPC5777CK3MME3R by NXP Semiconductors

SPC5777CK3MME3R

NXP Semiconductors

The NXP Semiconductors SPC5777CK3MME3R is a 32-bit microcontroller with a max clock frequency of 40 MHz. It features 416 terminals, CAN and DSPI connectivity, and on-chip program ROM width of 8. This automotive-grade microcontroller is suitable for applications requiring high-speed processing and advanced connectivity capabilities.

YES

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

0

32

40 MHz

NO

YES

0

S-PBGA-B416

e2

27 mm

3

416

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

524288

8388608

FLASH

2.02 mm

264 rpm

1.32 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

DMA(128), PWM, TEMPERATURE SENSOR

SPC5777CK3MME3 by NXP Semiconductors

SPC5777CK3MME3

NXP Semiconductors

NXP Semiconductors' SPC5777CK3MME3 microcontroller features a 32-bit CPU with E200Z7 family, 524288 RAM bytes, and 8388608 ROM words. It is designed for automotive applications with CAN(4), SCI(5), SPI(5) connectivity, PWM channels, and low power mode support. The microcontroller operates at a max clock frequency of 40 MHz and has a temperature grade suitable for automotive environments.

YES

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SD ADC AVAILABLE.

0

32

YES

E200Z7

40 MHz

NO

YES

0

FLOATING-POINT

YES

S-PBGA-B416

e2

27 mm

YES

3

128

1

5

416

0

8

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

BGA416,26X26,40

SQUARE

GRID ARRAY

260

524288

8388608

FLASH

2.02 mm

264 rpm

1350 mA

1.32 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER

0

CAN(4), SCI(5), SPI(5)

POR

SPC5777MK0MVU8R by NXP Semiconductors

SPC5777MK0MVU8R

NXP Semiconductors

NXP Semiconductors' SPC5777MK0MVU8R microcontroller features 32-bit address bus, 544K data EEPROM size, and 40 MHz max clock frequency. Ideal for automotive applications with ISO 26262 screening level, it offers connectivity options like CAN(5), DSPI(8), I2C(2), PSI5(5), SENT(15), UART(3).

YES

INCLUDES GTM104, ETHERNET SUPPORT, 74KB(ADDITIONAL RAM)

32

32

40 MHz

NO

YES

32

S-PBGA-B416

e1

27 mm

3

0

416

8

125 Cel

-40 Cel

NO

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

413696

8388608

FLASH

ISO 26262

2.55 mm

300 rpm

1.38 V

1.19 V

1.325 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

544K

CAN(5), DSPI(8), I2C(2), PSI5(5), SENT(15), UART(3)

DMA(128), TIMER(8), WDT(4)

12-Ch 12-Bit, 10-Ch 16-Bit

SPC5777MK0MVU8 by NXP Semiconductors

SPC5777MK0MVU8

NXP Semiconductors

NXP Semiconductors' SPC5777MK0MVU8 microcontroller features 32-bit address bus, 544K data EEPROM size, and 40 MHz max clock frequency. Ideal for automotive applications with ISO 26262 screening level, it offers connectivity options like CAN(5), DSPI(8), I2C(2), PSI5(5), SENT(15), UART(3).

YES

INCLUDES GTM104, ETHERNET SUPPORT, 74KB(ADDITIONAL RAM)

32

32

40 MHz

NO

YES

32

S-PBGA-B416

e1

27 mm

3

0

416

8

125 Cel

-40 Cel

NO

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

413696

8388608

FLASH

ISO 26262

2.55 mm

300 rpm

1.38 V

1.19 V

1.325 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

544K

CAN(5), DSPI(8), I2C(2), PSI5(5), SENT(15), UART(3)

DMA(128), TIMER(8), WDT(4)

12-Ch 12-Bit, 10-Ch 16-Bit

TC1796256F150EBEKDUMA2 by Infineon Technologies

TC1796256F150EBEKDUMA2

Infineon Technologies

Infineon's TC1796256F150EBEKDUMA2 microcontroller features 32-bit architecture, 24-bit address bus, and 40 MHz clock frequency. Ideal for automotive applications, it offers 16 ADC channels, 128K data EEPROM size, and connectivity options like CAN and Ethernet.

YES

24

32

40 MHz

NO

YES

32

S-PBGA-B416

e1

27 mm

3

127

416

8

125 Cel

-40 Cel

NO

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

65536

2097152

FLASH

2.5 mm

150 rpm

1.58 V

1.42 V

1.5 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

1 mm

BOTTOM

27 mm

MICROCONTROLLER

128K

ASC(2), CAN(4), ETHERNET, MLI(2), MSC(2), SSC(2)

DMA(16), TIMER(2)

16 Ch 12-Bit(2), FADC 4 Ch 10-Bit

TC1796256F150EBEKXUMA2 by Infineon Technologies

TC1796256F150EBEKXUMA2

Infineon Technologies

Infineon Technologies' TC1796256F150EBEKXUMA2 microcontroller features 32-bit architecture, 24-bit address bus width, and 40 MHz clock frequency. Ideal for automotive applications with connectivity options like CAN, ETHERNET, and MSC. Operating temperature ranges from -40 to 125 °C.

YES

24

32

40 MHz

NO

YES

32

S-PBGA-B416

27 mm

3

127

416

8

125 Cel

-40 Cel

NO

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

65536

2097152

FLASH

2.5 mm

150 rpm

1.58 V

1.42 V

1.5 V

YES

CMOS

AUTOMOTIVE

BALL

1 mm

BOTTOM

30

27 mm

MICROCONTROLLER

128K

ASC(2), CAN(4), ETHERNET, MLI(2), MSC(2), SSC(2)

DMA(16), TIMER(2)

16 Ch 12-Bit(2), FADC 4 Ch 10-Bit

SPC5674FAMVR3R by NXP Semiconductors

SPC5674FAMVR3R

NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 416; Package Code: HBGA; Package Shape: SQUARE;

YES

0

32

40 MHz

NO

YES

0

S-PBGA-B416

e2

27 mm

3

416

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

262144

4194304

FLASH

2.55 mm

264 rpm

1.32 V

1.14 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(4), SCI(3), SPI(4)

DMA(96), POR, PWM(32), TIMER(64)

64-Ch 12-Bit

SPC5674FAMVR3 by NXP Semiconductors

SPC5674FAMVR3

NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 416; Package Code: HBGA; Package Shape: SQUARE;

YES

0

32

40 MHz

NO

YES

0

S-PBGA-B416

e2

27 mm

3

416

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

262144

4194304

FLASH

2.55 mm

264 rpm

1.32 V

1.14 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(4), SCI(3), SPI(4)

DMA(96), POR, PWM(32), TIMER(64)

64-Ch 12-Bit

TC1793F512F270EFABKXUMA2 by Infineon Technologies

TC1793F512F270EFABKXUMA2

Infineon Technologies

Infineon's TC1793F512F270EFABKXUMA2 is a 32-bit microcontroller with 416 terminals, operating at up to 40 MHz. Ideal for automotive applications, it features 44-Ch ADCs, CAN connectivity, and 294912 bytes of RAM. With a flash ROM and DMA support, this CMOS technology chip offers high performance in a compact square package.

YES

32

32

40 MHz

NO

YES

32

S-PBGA-B416

e1

27 mm

3

221

416

8

125 Cel

-40 Cel

NO

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

294912

4194304

FLASH

2.15 mm

270 rpm

1.43 V

1.17 V

1.3 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

1 mm

BOTTOM

27 mm

MICROCONTROLLER, RISC

192K

ASC, CAN(4), MLI, SENT, SSC(2)

DMA(24), POR, TIMER(3)

44-Ch 12-Bit, 4-Ch 10-Bit

TC1796256F150EBCKDUMA1 by Infineon Technologies

TC1796256F150EBCKDUMA1

Infineon Technologies

MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 416; Package Code: BGA; Package Shape: SQUARE;

YES

24

32

40 MHz

NO

YES

32

S-PBGA-B416

27 mm

127

416

8

125 Cel

-40 Cel

NO

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

NOT SPECIFIED

196608

2097152

FLASH

2.5 mm

150 rpm

1.58 V

1.42 V

1.5 V

YES

CMOS

AUTOMOTIVE

BALL

1 mm

BOTTOM

NOT SPECIFIED

27 mm

MICROCONTROLLER

128K

ASC(2), CAN(4), MLI(2), MSC(2), SSC(2)

DMA(16), POR, TIMER(4), WDT

32-Ch 12-Bit, FADC 4-Ch 10-Bit

TC1797384F150EACKDUMA1 by Infineon Technologies

TC1797384F150EACKDUMA1

Infineon Technologies

MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 416; Package Code: BGA; Package Shape: SQUARE;

YES

32

32

40 MHz

NO

YES

32

S-PBGA-B416

27 mm

221

416

8

125 Cel

-40 Cel

NO

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

NOT SPECIFIED

180224

3145728

FLASH

2.5 mm

180 rpm

1.58 V

1.42 V

1.5 V

YES

CMOS

AUTOMOTIVE

BALL

1 mm

BOTTOM

NOT SPECIFIED

27 mm

MICROCONTROLLER, RISC

64K

ASC(2), CAN(4), MLI(2), MSC(2), SSC(2)

DMA(16), POR, TIMER(4), WDT

44-Ch 12-Bit, FADC 4-Ch 10-Bit

TC1797384F150EACKXUMA1 by Infineon Technologies

TC1797384F150EACKXUMA1

Infineon Technologies

MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 416; Package Code: BGA; Package Shape: SQUARE;

YES

32

32

40 MHz

NO

YES

32

S-PBGA-B416

27 mm

221

416

8

125 Cel

-40 Cel

NO

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

NOT SPECIFIED

180224

3145728

FLASH

2.5 mm

180 rpm

1.58 V

1.42 V

1.5 V

YES

CMOS

AUTOMOTIVE

BALL

1 mm

BOTTOM

NOT SPECIFIED

27 mm

MICROCONTROLLER, RISC

64K

ASC(2), CAN(4), MLI(2), MSC(2), SSC(2)

DMA(16), POR, TIMER(4), WDT

44-Ch 12-Bit, FADC 4-Ch 10-Bit

SPC5777CAK3MME3R by NXP Semiconductors

SPC5777CAK3MME3R

NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 416; Package Code: BGA; Package Shape: SQUARE;

YES

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

0

32

40 MHz

NO

YES

0

S-PBGA-B416

e2

27 mm

3

416

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

524288

8388608

FLASH

2.02 mm

264 rpm

1.32 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(4), DSPI(5), EBI, ETHERNET, SCI(5)

DMA(128), PWM, TEMPERATURE SENSOR

SPC5777CAK3MME3 by NXP Semiconductors

SPC5777CAK3MME3

NXP Semiconductors

The NXP Semiconductors SPC5777CAK3MME3 microcontroller features a 32-bit architecture, 416 terminals, and 8388608 ROM words. Ideal for automotive applications, it offers peripherals like DMA(128), PWM, and temperature sensor support. With a max clock frequency of 40 MHz and connectivity options including CAN(4) and ETHERNET, this CMOS technology-based microcontroller is designed for high-performance automotive systems.

YES

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

0

32

40 MHz

NO

YES

0

S-PBGA-B416

e2

27 mm

3

416

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

524288

8388608

FLASH

2.02 mm

264 rpm

1.32 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(4), DSPI(5), EBI, ETHERNET, SCI(5)

DMA(128), PWM, TEMPERATURE SENSOR

SPC5777CDK3MME3R by NXP Semiconductors

SPC5777CDK3MME3R

NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 416; Package Code: BGA; Package Shape: SQUARE;

YES

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

0

32

40 MHz

NO

YES

0

S-PBGA-B416

e2

27 mm

3

416

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

524288

8388608

FLASH

2.02 mm

264 rpm

1.32 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

DMA(128), PWM, TEMPERATURE SENSOR

SPC5777CDK3MME3 by NXP Semiconductors

SPC5777CDK3MME3

NXP Semiconductors

The NXP Semiconductors SPC5777CDK3MME3 microcontroller features a 32-bit architecture with 8388608 ROM words and 524288 RAM bytes. It offers peripherals like DMA(128), PWM, and temperature sensor, suitable for automotive applications. With CAN(6), DSPI(5), EBI, Ethernet, and SCI(5) connectivity options, it operates at a max clock frequency of 40 MHz in an automotive-grade package.

YES

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

0

32

40 MHz

NO

YES

0

S-PBGA-B416

e2

27 mm

3

416

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

524288

8388608

FLASH

2.02 mm

264 rpm

1.32 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

DMA(128), PWM, TEMPERATURE SENSOR

SPC5777CLK3MME3R by NXP Semiconductors

SPC5777CLK3MME3R

NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 416; Package Code: BGA; Package Shape: SQUARE;

YES

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

0

32

40 MHz

NO

YES

0

S-PBGA-B416

e2

27 mm

3

416

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

524288

8388608

FLASH

2.02 mm

264 rpm

1.32 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

DMA(128), PWM, TEMPERATURE SENSOR

SPC5777CLK3MME3 by NXP Semiconductors

SPC5777CLK3MME3

NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 416; Package Code: BGA; Package Shape: SQUARE;

YES

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

0

32

40 MHz

NO

YES

0

S-PBGA-B416

e2

27 mm

3

416

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

524288

8388608

FLASH

2.02 mm

264 rpm

1.32 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

DMA(128), PWM, TEMPERATURE SENSOR

SPC5777CRK3MME3 by NXP Semiconductors

SPC5777CRK3MME3

NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 416; Package Code: BGA; Package Shape: SQUARE;

YES

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

0

32

40 MHz

NO

YES

0

S-PBGA-B416

e2

27 mm

3

416

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

524288

8388608

FLASH

2.02 mm

264 rpm

1.32 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(4), DSPI(5), EBI, ETHERNET, SCI(5)

DMA(128), PWM, TEMPERATURE SENSOR

SPC5777CSK3MME3R by NXP Semiconductors

SPC5777CSK3MME3R

NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 416; Package Code: BGA; Package Shape: SQUARE;

YES

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

0

32

40 MHz

NO

YES

0

S-PBGA-B416

e2

27 mm

3

416

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

524288

8388608

FLASH

2.02 mm

264 rpm

1.32 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

DMA(128), PWM, TEMPERATURE SENSOR

SPC5777CSK3MME3 by NXP Semiconductors

SPC5777CSK3MME3

NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 416; Package Code: BGA; Package Shape: SQUARE;

YES

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

0

32

40 MHz

NO

YES

0

S-PBGA-B416

e2

27 mm

3

416

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

524288

8388608

FLASH

2.02 mm

264 rpm

1.32 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

DMA(128), PWM, TEMPERATURE SENSOR

SPC5645SF1CVU by NXP Semiconductors

SPC5645SF1CVU

NXP Semiconductors

MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 416; Package Code: BGA; Package Shape: SQUARE; Terminal Finish: Tin/Silver (Sn/Ag);

YES

0

32

16 MHz

YES

0

e2

27 mm

3

177

416

YES

BGA

SQUARE

GRID ARRAY

260

125 rpm

1.32 V

1.08 V

1.2 V

YES

Tin/Silver (Sn/Ag)

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

SPC5777CDK3MME4R by NXP Semiconductors

SPC5777CDK3MME4R

NXP Semiconductors

MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 416; Package Code: BGA; Package Shape: SQUARE; Width: 27 mm;

YES

0

32

40 MHz

YES

0

e2

27 mm

3

416

YES

BGA

SQUARE

GRID ARRAY

260

264 rpm

1.32 V

1.2 V

YES

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

SPC5777CDK3MME4 by NXP Semiconductors

SPC5777CDK3MME4

NXP Semiconductors

NXP Semiconductors' SPC5777CDK3MME4 microcontroller features 32-bit architecture, 40 MHz clock frequency, and 416 terminals in a square package. Ideal for applications requiring ADC and DMA channels, with a peak reflow temperature of 260°C.

YES

0

32

40 MHz

YES

0

e2

27 mm

3

416

YES

BGA

SQUARE

GRID ARRAY

260

264 rpm

1.32 V

1.2 V

YES

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

SAL-TC298TP-128F300NBC by Infineon Technologies

SAL-TC298TP-128F300NBC

Infineon Technologies

Infineon's SAL-TC298TP-128F300NBC microcontroller features 32-bit architecture, 40 MHz clock frequency, and 745472 bytes of RAM. Ideal for automotive applications with ISO 26262 screening level, it offers connectivity options like CAN, I2C, SPI, and more. With low power mode and integrated cache, this device ensures efficient performance in a compact package.

YES

32

YES

TC29X

40 MHz

NO

YES

FLOATING-POINT

YES

S-PBGA-B416

e4

27 mm

YES

3

128

416

3

8

8

150 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

BGA416,26X26,40

SQUARE

GRID ARRAY

745472

8388608

FLASH

ISO 26262

2.15 mm

300 rpm

290 mA

1.43 V

1.235 V

1.3 V

YES

CMOS

NICKEL GOLD

BALL

1 mm

BOTTOM

27 mm

MICROCONTROLLER

131072

ASCLIN(4), CAN(6), I2C(2), I2S, LIN(6), PSI5(5), PSI5S, SPI,(4), QSPI(5)

DMA(128), POR, RTC, TIMER(3), WDT

94-Ch 12-Bit