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TC1796256F150EBEKDUMA2

Infineon Technologies

TC1796256F150EBEKDUMA2 by Infineon Technologies

Infineon's TC1796256F150EBEKDUMA2 microcontroller features 32-bit architecture, 24-bit address bus, and 40 MHz clock frequency. Ideal for automotive applications, it offers 16 ADC channels, 128K data EEPROM size, and connectivity options like CAN and Ethernet.

Median Price

$58.032

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$58.032

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100

$58.032

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Vyrian

USA . 3,569 parts In-Stock

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3,569

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Digiode

USA . 516 parts In-Stock

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516

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 677 parts In-Stock

1+ parts

$5.414

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677

$5.414

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Semicontronic

India . 158 parts In-Stock

1+ parts

$18.000

100+ parts

$17.550

1k+ parts

$17.460

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158

$18.000

$17.550

$17.460

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Ampacity Inc.

Singapore . 454 parts In-Stock

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$28.000

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454

$28.000

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Corohmni

South Africa . 516 parts In-Stock

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$33.099

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516

$33.099

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Continental Prestige Electronics

USA . 640 parts In-Stock

1+ parts

$58.032

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$56.872

640

$58.032

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$56.872

Advanced Electronics

New Zealand . 63 parts In-Stock

1+ parts

$59.193

100+ parts

$59.193

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$59.193

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63

$59.193

$59.193

$59.193

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Aztec Data Supply Inc.

USA . 255 parts In-Stock

1+ parts

$75.360

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255

$75.360

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Modulus Dynamics

Lithuania . 4,302 parts In-Stock

1+ parts

$77.334

100+ parts

$74.241

1k+ parts

$71.147

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4,302

$77.334

$74.241

$71.147

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Argo Parts USA

USA . 4,007 parts In-Stock

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Corphita

USA . 989 parts In-Stock

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989

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Microchip USA

USA . 259 parts In-Stock

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Overview

Elevate your project with the TC1796256F150EBEKDUMA2 by Infineon Technologies, a top-tier microcontroller that delivers exceptional quality and reliability. Designed for automotive applications, this microcontroller boasts advanced features such as ADC channels and DMA channels for seamless integration into various systems. With a maximum clock frequency of 40 MHz and a wide range of connectivity options, this product offers unparalleled performance and versatility. Trust in the expertise of Infineon Technologies to provide cutting-edge solutions that exceed expectations, making the TC1796256F150EBEKDUMA2 the ideal choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Maximum Supply Voltage: 1.58 V

Allows for a wide range of supply voltage, making it versatile for different applications.

Bit Size: 32

Higher bit size allows for more complex calculations and processing capabilities.

ROM Words: 2097152

Large ROM capacity enables storing a significant amount of program data.

ADC Channels: YES

Analog to digital converters allow for interfacing with analog sensors and signals.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it integrates various peripherals and processing capabilities in a single chip.

RAM Bytes: 65536

Sufficient RAM capacity for data storage and processing tasks.

Maximum Clock Frequency: 40 MHz

High clock frequency enables faster execution of instructions, enhancing performance.

Connectivity: ASC(2), CAN(4), ETHERNET, MLI(2), MSC(2), SSC(2)

Multiple connectivity options allow for versatile communication interfaces with other devices.

Moisture Sensitivity Level (MSL): 3

MSL level of 3 indicates the microcontroller can withstand moderate exposure to moisture during handling and assembly.

Technical Specifications

Microcontrollers TC1796256F150EBEKDUMA2 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B416

JESD-609 Code:

e1

Length:

27 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

127

No. of Terminals:

416

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

RAM Bytes:

65536

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

2.5 mm

Speed:

150 rpm

Maximum Supply Voltage:

1.58 V

Minimum Supply Voltage:

1.42 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

ASC(2), CAN(4), ETHERNET, MLI(2), MSC(2), SSC(2)

Peripherals:

DMA(16), TIMER(2)

Analog To Digital Convertors:

16 Ch 12-Bit(2), FADC 4 Ch 10-Bit

Trade Compliance

TC1796256F150EBEKDUMA2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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