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TC1797512F180EFACKXUMA1

Infineon Technologies

TC1797512F180EFACKXUMA1 by Infineon Technologies

Infineon's TC1797512F180EFACKXUMA1 microcontroller features 32-bit address and external data bus width, with a max clock frequency of 90 MHz. Ideal for automotive applications, it offers 416 terminals in a grid array package style, operating b/w -40 to 125 °C temperature range.

Median Price

$57.958

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 68 parts In-Stock

1+ parts

$57.958

100+ parts

-

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68

$57.958

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Maritex

Poland . 4,000 parts In-Stock

1+ parts

$124.158

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4,000

$124.158

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Vyrian

USA . 10,432 parts In-Stock

1+ parts

-

100+ parts

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10,432

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-

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Digiode

USA . 991 parts In-Stock

1+ parts

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991

-

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TME

Poland . 160 parts In-Stock

1+ parts

-

100+ parts

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$48.940

10k+ parts

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160

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-

$48.940

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 212 parts In-Stock

1+ parts

$11.235

100+ parts

-

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212

$11.235

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Semicontronic

India . 1,108 parts In-Stock

1+ parts

$20.000

100+ parts

$19.500

1k+ parts

$19.400

10k+ parts

-

1,108

$20.000

$19.500

$19.400

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Aztec Data Supply Inc.

USA . 4,966 parts In-Stock

1+ parts

$28.100

100+ parts

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4,966

$28.100

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Ampacity Inc.

Singapore . 1,606 parts In-Stock

1+ parts

$34.000

100+ parts

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1,606

$34.000

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Continental Prestige Electronics

USA . 1,954 parts In-Stock

1+ parts

$57.958

100+ parts

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1k+ parts

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10k+ parts

$56.799

1,954

$57.958

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-

$56.799

Corohmni

South Africa . 829 parts In-Stock

1+ parts

$66.265

100+ parts

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829

$66.265

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Modulus Dynamics

Lithuania . 976 parts In-Stock

1+ parts

$83.073

100+ parts

$79.750

1k+ parts

$76.427

10k+ parts

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976

$83.073

$79.750

$76.427

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QUARKTWIN TECHNOLOGY LTD

USA . 25,002 parts In-Stock

1+ parts

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25,002

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Argo Parts USA

USA . 1,573 parts In-Stock

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1,573

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Corphita

USA . 804 parts In-Stock

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804

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Netroflash

USA . 500 parts In-Stock

1+ parts

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100+ parts

$56.799

1k+ parts

$55.060

10k+ parts

$53.901

500

-

$56.799

$55.060

$53.901

Microchip USA

USA . 455 parts In-Stock

1+ parts

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100+ parts

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455

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Overview

Unlock unparalleled performance and reliability with the TC1797512F180EFACKXUMA1 microcontroller by Infineon Technologies. Designed with cutting-edge technology and precision engineering, this microcontroller offers seamless integration and enhanced functionality for a wide range of applications. From automotive to industrial automation, this versatile device delivers unmatched efficiency and performance. Experience the next level of innovation with the TC1797512F180EFACKXUMA1 and stay ahead of the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a long lifespan and reliability in various operating conditions.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Maximum Supply Voltage: 1.58 V

Operates efficiently within a safe voltage range, preventing damage to the microcontroller.

Address Bus Width: 32

Enables the microcontroller to access a wide range of memory addresses, facilitating data management and storage.

Package Shape: SQUARE

Optimizes space utilization on the PCB, providing a compact design for various applications.

Bit Size: 32

Enhances processing capability and memory capacity of the microcontroller, suitable for handling complex tasks and data.

No. of Terminals: 416

Offers a sufficient number of connections for interfacing with external components and peripherals, enhancing the flexibility of the microcontroller.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

Allows for efficient heat dissipation, maintaining optimal operating temperatures and preventing overheating issues.

Minimum Supply Voltage: 1.42 V

Ensures reliable operation even at lower voltage levels, providing stability and performance in power-constrained environments.

Maximum Operating Temperature: 125 °C

Supports reliable operation in high-temperature environments, making it suitable for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

Ensures functionality in low-temperature conditions, enabling the microcontroller to operate in a wide range of environments.

ADC Channels: YES

Facilitates analog-to-digital conversion, allowing the microcontroller to interface with analog sensors and signals for diverse applications.

DMA Channels: YES

Enables direct memory access for efficient data transfer, reducing the workload on the CPU and improving system performance.

Terminal Position: BOTTOM

Simplifies PCB layout and component placement, enhancing the ease of integration and assembly.

Maximum Seated Height: 2.4 mm

Provides a low-profile design for space-constrained applications, offering flexibility in product design and installation.

Width: 27 mm

Compact size allows for easy integration into various electronic devices, optimizing board space and layout.

External Data Bus Width: 32

Supports fast data transfer between external peripherals and the microcontroller, enhancing communication efficiency and speed.

Maximum Clock Frequency: 90 MHz

Delivers high-speed processing capabilities, enabling quick execution of commands and tasks for responsive performance.

Length: 27 mm

Compact form factor for versatility in product design and integration, suitable for space-constrained applications.

Temperature Grade: AUTOMOTIVE

Meets strict automotive industry standards for temperature range and performance, ensuring reliability in automotive applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes RISC architecture for efficient and optimized instruction execution, enhancing processing speed and performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving energy efficiency and reliability of the microcontroller.

Terminal Form: BALL

Ball terminal form provides secure connections and reliability in contact with PCB pads, ensuring stable operation and durability.

Nominal Supply Voltage: 1.5 V

Standard supply voltage for compatibility with a wide range of power sources, making it versatile for various applications.

ROM Programmability: FLASH

Offers flexible and reprogrammable ROM memory, allowing for firmware updates and customization without replacing the microcontroller.

Terminal Pitch: 1 mm

Optimized terminal pitch for easy soldering and PCB assembly, simplifying the manufacturing process and ensuring reliable connections.

Speed: 180 rpm

High operational speed for efficient data processing and real-time performance, suitable for demanding applications and tasks.

No. of I/O Lines: 221

Abundance of I/O lines for versatile interfacing with external devices and peripherals, enhancing the functionality and connectivity of the microcontroller.

Technical Specifications

Microcontrollers TC1797512F180EFACKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

90 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B416

Length:

27 mm

No. of I/O Lines:

221

No. of Terminals:

416

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Programmability:

FLASH

Maximum Seated Height:

2.4 mm

Speed:

180 rpm

Maximum Supply Voltage:

1.58 V

Minimum Supply Voltage:

1.42 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

27 mm

Peripheral IC Type:

Trade Compliance

TC1797512F180EFACKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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