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TC1793F512F270EFABKXUMA2

Infineon Technologies

TC1793F512F270EFABKXUMA2 by Infineon Technologies

Infineon's TC1793F512F270EFABKXUMA2 is a 32-bit microcontroller with 416 terminals, operating at up to 40 MHz. Ideal for automotive applications, it features 44-Ch ADCs, CAN connectivity, and 294912 bytes of RAM. With a flash ROM and DMA support, this CMOS technology chip offers high performance in a compact square package.

Median Price

$26.117

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,626 parts In-Stock

1+ parts

-

100+ parts

$23.810

1k+ parts

$21.300

10k+ parts

$20.050

3,626

-

$23.810

$21.300

$20.050

Avnet

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$28.424

10k+ parts

$25.735

500

-

-

$28.424

$25.735

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 100 parts In-Stock

1+ parts

$25.128

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$25.128

-

-

-

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$33.327

100+ parts

-

1k+ parts

-

10k+ parts

-

150

$33.327

-

-

-

Vyrian

USA . 5,456 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,456

-

-

-

-

Rutronik

Germany . 2,000 parts In-Stock

1+ parts

-

100+ parts

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2,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,057 parts In-Stock

1+ parts

$20.470

100+ parts

$19.958

1k+ parts

$19.856

10k+ parts

-

1,057

$20.470

$19.958

$19.856

-

Ampacity Inc.

Singapore . 767 parts In-Stock

1+ parts

$20.470

100+ parts

-

1k+ parts

-

10k+ parts

-

767

$20.470

-

-

-

Corphita

USA . 503 parts In-Stock

1+ parts

$23.805

100+ parts

-

1k+ parts

-

10k+ parts

-

503

$23.805

-

-

-

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$32.660

100+ parts

-

1k+ parts

$31.354

10k+ parts

-

2,000

$32.660

-

$31.354

-

Continental Prestige Electronics

USA . 3,704 parts In-Stock

1+ parts

$33.327

100+ parts

-

1k+ parts

-

10k+ parts

$32.660

3,704

$33.327

-

-

$32.660

Modulus Dynamics

Lithuania . 3,458 parts In-Stock

1+ parts

$43.561

100+ parts

$41.819

1k+ parts

$40.076

10k+ parts

-

3,458

$43.561

$41.819

$40.076

-

Microchip USA

USA . 1,989 parts In-Stock

1+ parts

$63.468

100+ parts

-

1k+ parts

-

10k+ parts

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1,989

$63.468

-

-

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Corohmni

South Africa . 751 parts In-Stock

1+ parts

$75.197

100+ parts

-

1k+ parts

-

10k+ parts

-

751

$75.197

-

-

-

Aztec Data Supply Inc.

USA . 2,499 parts In-Stock

1+ parts

$77.200

100+ parts

-

1k+ parts

-

10k+ parts

-

2,499

$77.200

-

-

-

Argo Parts USA

USA . 1,854 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,854

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Overview

Unlock next-level performance with the TC1793F512F270EFABKXUMA2 by Infineon Technologies. This cutting-edge microcontroller boasts top-notch quality and reliability, making it perfect for automotive applications. With a wide range of peripherals, high clock frequency, and extensive ROM and RAM capacity, this powerhouse delivers unmatched value and benefits to customers. Experience seamless connectivity, advanced ADC channels, and DMA support, all in a compact package that guarantees optimal performance. Upgrade your projects with the TC1793F512F270EFABKXUMA2 and take your innovations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection, making the product suitable for various environments.

Bit Size: 32

32-bit processing allows for faster and more efficient computing, making the product suitable for high-performance applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, the product can withstand heat-intensive operations without compromising performance.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in the microcontroller ensures efficient processing and execution of tasks, making the product a reliable choice for embedded systems.

Technical Specifications

Microcontrollers TC1793F512F270EFABKXUMA2 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B416

JESD-609 Code:

e1

Length:

27 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

221

No. of Terminals:

416

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

RAM Bytes:

294912

ROM Words:

4194304

ROM Programmability:

FLASH

Maximum Seated Height:

2.15 mm

Speed:

270 rpm

Maximum Supply Voltage:

1.43 V

Minimum Supply Voltage:

1.17 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Data EEPROM Size:

192K

Connectivity:

ASC, CAN(4), MLI, SENT, SSC(2)

Peripherals:

DMA(24), POR, TIMER(3)

Analog To Digital Convertors:

44-Ch 12-Bit, 4-Ch 10-Bit

Trade Compliance

TC1793F512F270EFABKXUMA2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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