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TC1767256F133HRADKXUMA1

Infineon Technologies

TC1767256F133HRADKXUMA1 by Infineon Technologies

Infineon's TC1767256F133HRADKXUMA1 microcontroller features 32-bit architecture, 176 terminals, and 25 MHz clock frequency. Ideal for automotive applications, it offers 131072 RAM bytes, FLASH ROM programmability, and operates in a temperature range of -40 to 125 °C.

Median Price

$29.902

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 307 parts In-Stock

1+ parts

-

100+ parts

$33.225

1k+ parts

$29.725

10k+ parts

$27.975

307

-

$33.225

$29.725

$27.975

Rochester

USA . 307 parts In-Stock

1+ parts

-

100+ parts

$26.580

1k+ parts

$23.780

10k+ parts

$22.380

307

-

$26.580

$23.780

$22.380

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,242 parts In-Stock

1+ parts

-

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3,242

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Nova Conductors

Japan . 81 parts In-Stock

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81

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Digiode

USA . 60 parts In-Stock

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60

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 719 parts In-Stock

1+ parts

$7.000

100+ parts

-

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-

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719

$7.000

-

-

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AZTECH Wire

Italy . 247 parts In-Stock

1+ parts

$8.617

100+ parts

-

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247

$8.617

-

-

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Modulus Dynamics

Lithuania . 3,715 parts In-Stock

1+ parts

$16.316

100+ parts

$15.663

1k+ parts

$15.011

10k+ parts

-

3,715

$16.316

$15.663

$15.011

-

Component Stockers USA

USA . 235 parts In-Stock

1+ parts

$99.990

100+ parts

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235

$99.990

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Argo Parts USA

USA . 4,397 parts In-Stock

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4,397

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Continental Prestige Electronics

USA . 2,503 parts In-Stock

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2,503

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Perfect Parts

USA . 1,120 parts In-Stock

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1,120

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Bastille Electronics

Australia . 500 parts In-Stock

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500

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Microchip USA

USA . 293 parts In-Stock

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293

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Corphita

USA . 197 parts In-Stock

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Overview

Unlock the power of advanced technology with the TC1767256F133HRADKXUMA1 microcontroller by Infineon Technologies. Designed with precision and expertise, this versatile device is perfect for a wide range of applications in the automotive industry and beyond. With its high-quality construction and innovative features such as ADC and DMA channels, this microcontroller offers unparalleled performance and reliability. Experience seamless integration and maximum efficiency with the TC1767256F133HRADKXUMA1, a game-changer in the world of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures the microcontroller is resistant to damage and ideal for long-term use.

Surface Mount: YES

Enables easy installation onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.58 V

Provides stable power supply to the microcontroller, enhancing its performance and reliability.

Package Shape: SQUARE

Compact and efficient design allows for space-saving integration into various electronic devices.

Bit Size: 32

High bit size allows for complex calculations and data processing, making it suitable for demanding applications.

Power Supplies (V): 1.5,3.3,5

Versatile voltage options make it compatible with different systems and power sources.

No. of Terminals: 176

Ample terminals provide flexibility for connecting the microcontroller to external components and peripherals.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Offers a range of mounting options to suit diverse needs and requirements.

Minimum Supply Voltage: 1.42 V

With a low minimum supply voltage, the microcontroller can operate efficiently even in low-power scenarios.

Maximum Operating Temperature: 125 °C

Withstands high temperatures for reliable performance in harsh environments.

Minimum Operating Temperature: -40 °C

Functions effectively in extremely cold conditions, ensuring consistent operation in various climates.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The choice of terminal finish provides strong conductivity and corrosion resistance for long-term use.

ADC Channels: YES

Integrated ADC channels enable precise analog signal conversion for accurate data processing.

DMA Channels: YES

DMA channels enhance data transfer efficiency, improving overall system performance.

Terminal Position: QUAD

Quad terminal position offers a secure connection for stable operation in demanding applications.

ROM Words: 65536

Ample ROM storage capacity for storing program instructions and data for efficient operation.

Width: 24 mm

Compact width allows for easy integration into space-constrained electronic devices.

Maximum Clock Frequency: 25 MHz

Operates at high clock speeds, ensuring rapid data processing and responsiveness.

Length: 24 mm

Compact length facilitates easy placement on circuit boards and in electronic systems.

Temperature Grade: AUTOMOTIVE

Designed to withstand harsh automotive environments for reliable performance in vehicles.

RAM Bytes: 131072

Large RAM capacity enables efficient data storage and processing for demanding applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: GULL WING

Gull wing terminal form provides strong mechanical connection and facilitates soldering for secure installation.

Maximum Supply Current: 330 mA

Capable of handling high current loads, making it suitable for power-intensive applications.

Nominal Supply Voltage: 1.5 V

With a standard supply voltage, the microcontroller is compatible with a wide range of power sources.

ROM Programmability: FLASH

Flash programmability allows for easy updating of firmware and software, enhancing flexibility and usability.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables precise connections and compact layout design for efficient circuit integration.

Moisture Sensitivity Level (MSL): 3

With MSL level 3, the microcontroller is resistant to moisture, ensuring reliability in varying environmental conditions.

Speed: 133 rpm

Operates at high speeds for rapid data processing and response times in real-time applications.

No. of I/O Lines: 88

Multiple I/O lines offer flexibility for connecting external devices and peripherals, enhancing the microcontroller's functionality.

Technical Specifications

Microcontrollers TC1767256F133HRADKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G176

JESD-609 Code:

e4

Length:

24 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

88

No. of Terminals:

176

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.5,3.3,5

Qualification:

Not Qualified

RAM Bytes:

131072

ROM Words:

65536

ROM Programmability:

FLASH

Speed:

133 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

330 mA

Maximum Supply Voltage:

1.58 V

Minimum Supply Voltage:

1.42 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

24 mm

Trade Compliance

TC1767256F133HRADKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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