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TC1766192F80HLBDKXUMA2

Infineon Technologies

TC1766192F80HLBDKXUMA2 by Infineon Technologies

Infineon Technologies' TC1766192F80HLBDKXUMA2 is a 32-bit microcontroller with a max clock frequency of 25 MHz. It has 81 I/O lines and is suitable for automotive applications due to its temperature grade and moisture sensitivity level.

Median Price

$36.577

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

EBV Elektronik

Germany . 1,000 parts In-Stock

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Nova Conductors

Japan . 750 parts In-Stock

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$36.577

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750

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Vyrian

USA . 4,623 parts In-Stock

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Digiode

USA . 134 parts In-Stock

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AZTECH Wire

Italy . 1,133 parts In-Stock

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$20.000

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Ampacity Inc.

Singapore . 642 parts In-Stock

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$30.000

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Semicontronic

India . 590 parts In-Stock

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$33.000

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$32.175

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$32.010

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590

$33.000

$32.175

$32.010

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Continental Prestige Electronics

USA . 544 parts In-Stock

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$36.577

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$35.846

544

$36.577

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$35.846

Bastille Electronics

Australia . 10 parts In-Stock

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$36.580

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$34.751

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$32.556

10

$36.580

$34.751

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$32.556

Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$37.309

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$37.309

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$37.309

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Modulus Dynamics

Lithuania . 487 parts In-Stock

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$50.362

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$48.348

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$46.333

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$46.333

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Aztec Data Supply Inc.

USA . 3,279 parts In-Stock

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$53.000

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Corohmni

South Africa . 1,022 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Argo Parts USA

USA . 1,697 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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Microchip USA

USA . 184 parts In-Stock

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Corphita

USA . 83 parts In-Stock

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Overview

Looking for a high-quality microcontroller that delivers exceptional performance? Look no further than the TC1766192F80HLBDKXUMA2 by Infineon Technologies. With its advanced technology and innovative features, this microcontroller is perfect for a wide range of applications. Whether you're working on automotive systems, industrial automation, or consumer electronics, this product offers unmatched value, benefits, and advantages. With Infineon Technologies, you can trust that you're getting a reliable and durable solution that will meet all your needs. Upgrade your projects with the TC1766192F80HLBDKXUMA2 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY.

This product's plastic/epoxy package body material provides excellent durability and protection, making it a reliable choice in harsh operating conditions.

Surface Mount: YES.

With surface mount capability, this microcontroller offers easy installation and space-saving design, making it convenient for compact electronic applications.

Maximum Supply Voltage: 1.58 V.

The high maximum supply voltage of 1.58 V ensures optimal performance, allowing for stable and efficient operation in a wide range of voltage conditions.

Package Shape: SQUARE.

The square package shape of this microcontroller enhances ease of mounting and integration, making it suitable for space-constrained applications.

Bit Size: 32.

With a bit size of 32, this microcontroller provides a larger data processing capacity, enabling it to handle complex tasks and high-performance applications effectively.

No. of Terminals: 176.

This microcontroller offers an extensive number of terminals, allowing for versatile connections to various peripherals and enabling flexibility in circuit designs.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH.

The flatpack, low profile, and fine pitch package style of this microcontroller enable efficient heat dissipation and facilitate precise and compact circuit board layouts.

Minimum Supply Voltage: 1.42 V.

The low minimum supply voltage requirement of 1.42 V ensures power efficiency and extends battery life, making this microcontroller an energy-efficient choice.

Maximum Operating Temperature: 125 °C.

With a maximum operating temperature of 125 °C, this microcontroller exhibits robust thermal stability, ensuring reliable performance even in demanding environments.

Minimum Operating Temperature: -40 °C.

This microcontroller's ability to operate at temperatures as low as -40 °C enables it to function reliably in extreme cold conditions, expanding its application range.

Terminal Finish: TIN.

Equipped with a tin terminal finish, this microcontroller offers excellent solderability and corrosion resistance, ensuring long-lasting connections and reliable performance.

ADC Channels: YES.

The inclusion of ADC channels allows this microcontroller to efficiently convert analog signals to digital data, enabling accurate measurements and control in various sensing applications.

DMA Channels: YES.

With DMA channels, this microcontroller enables data transfer between peripherals and memory without CPU intervention, improving overall system performance and reducing processing overhead.

Terminal Position: QUAD.

The quad terminal position of this microcontroller contributes to enhanced stability and secure electrical connections, making it suitable for high-vibration and harsh operating environments.

Maximum Seated Height: 1.6 mm.

This microcontroller's low maximum seated height of 1.6 mm facilitates space-saving designs and allows for more compact and slim electronic devices.

Width: 24 mm.

The compact width of 24 mm ensures easy integration and compatibility with various electronic systems and PCB layouts, providing flexibility in design and installation.

Maximum Clock Frequency: 25 MHz.

With a maximum clock frequency of 25 MHz, this microcontroller delivers fast and efficient processing capabilities, enabling rapid execution of tasks and high-speed data communication.

Length: 24 mm.

The 24 mm length of this microcontroller allows for convenient placement in compact electronic applications, making it suitable for miniaturized devices and space-restricted environments.

Temperature Grade: AUTOMOTIVE.

Designed for automotive applications, this microcontroller withstands extreme temperature fluctuations and harsh conditions, ensuring reliable performance in automotive electronics.

Peripheral IC Type: MICROCONTROLLER.

This microcontroller belongs to the peripheral IC type, offering a comprehensive range of built-in peripheral functions and interfaces, simplifying system design and reducing external component requirements.

Technology: CMOS.

Built on CMOS technology, this microcontroller exhibits low power consumption, high noise immunity, and enhanced reliability, making it an optimal choice for battery-powered and noise-sensitive applications.

Terminal Form: GULL WING.

The gull-wing terminal form of this microcontroller allows for easy soldering and secure mechanical connections, making it suitable for automated production processes and ensuring robust electrical connections.

Nominal Supply Voltage: 1.5 V.

With a nominal supply voltage requirement of 1.5 V, this microcontroller operates efficiently with commonly available power sources, providing compatibility and ease of use.

ROM Programmability: FLASH.

Featuring flash ROM programmability, this microcontroller allows for flexible firmware updates, enabling easy maintenance and future-proofing of embedded systems.

Terminal Pitch: 0.5 mm.

The small terminal pitch of 0.5 mm enables high-density circuit board layouts, enabling compact and intricate designs, making it suitable for miniaturized and high-performance applications.

Moisture Sensitivity Level (MSL): 3.

This microcontroller has an MSL rating of 3, indicating that it can withstand moderate moisture exposure during storage and assembly, ensuring consistent performance and reliability.

Speed: 80 rpm.

With a speed rating of 80 rpm, this microcontroller provides rapid data processing and response times, enabling real-time control and high-speed computation in a wide range of applications.

No. of I/O Lines: 81.

Equipped with 81 I/O lines, this microcontroller offers extensive input and output capabilities, facilitating versatile communication and interface options, making it suitable for complex and multifunctional systems.

Technical Specifications

Microcontrollers TC1766192F80HLBDKXUMA2 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G176

JESD-609 Code:

e3

Length:

24 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

81

No. of Terminals:

176

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

1.58 V

Minimum Supply Voltage:

1.42 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TC1766192F80HLBDKXUMA2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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