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TC1796256F150EBEKXUMA2

Infineon Technologies

TC1796256F150EBEKXUMA2 by Infineon Technologies

Infineon Technologies' TC1796256F150EBEKXUMA2 microcontroller features 32-bit architecture, 24-bit address bus width, and 40 MHz clock frequency. Ideal for automotive applications with connectivity options like CAN, ETHERNET, and MSC. Operating temperature ranges from -40 to 125 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,078 parts In-Stock

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Greenchips

USA . 2,500 parts In-Stock

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Nova Conductors

Japan . 870 parts In-Stock

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Chip Stock

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Digiode

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Ampacity Inc.

Singapore . 389 parts In-Stock

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$6.000

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AZTECH Wire

Italy . 203 parts In-Stock

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Modulus Dynamics

Lithuania . 2,494 parts In-Stock

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$17.071

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$16.388

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$15.705

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Semicontronic

India . 574 parts In-Stock

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$35.000

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$34.125

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$33.950

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Aztec Data Supply Inc.

USA . 492 parts In-Stock

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$63.870

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Corohmni

South Africa . 251 parts In-Stock

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Argo Parts USA

USA . 4,286 parts In-Stock

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Continental Prestige Electronics

USA . 1,453 parts In-Stock

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Microchip USA

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Bastille Electronics

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Corphita

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Overview

Infineon Technologies presents the TC1796256F150EBEKXUMA2, a top-notch microcontroller that sets the standard for performance and reliability. With Infineon's renowned expertise in semiconductor manufacturing, this device offers unmatched quality and precision engineering. Ideal for automotive applications, this microcontroller boasts advanced features like ADC channels, DMA channels, and extensive connectivity options. Experience seamless operation and unparalleled efficiency with the TC1796256F150EBEKXUMA2, delivering exceptional value and cutting-edge technology to customers worldwide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY package body material ensures durability and reliability, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability enhances ease of assembly and saves valuable space on the PCB, making the product efficient for compact designs.

Maximum Supply Voltage: 1.58 V

A high maximum supply voltage allows for flexibility in power supply requirements, accommodating various system configurations.

Address Bus Width: 24

A 24-bit address bus width enables efficient memory access and handling of large data sets, enhancing the processing capabilities of the microcontroller.

Package Shape: SQUARE

The square package shape offers uniformity and ease of integration into different board layouts, contributing to a neat and organized design.

Bit Size: 32

With a 32-bit architecture, the microcontroller can handle complex calculations and operations with precision, making it suitable for demanding applications.

No. of Terminals: 416

The large number of terminals allows for versatile connectivity options and interactions with external devices, expanding the functionality of the microcontroller.

Minimum Supply Voltage: 1.42 V

A low minimum supply voltage ensures energy efficiency and helps in minimizing power consumption, making the product cost-effective in the long run.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range ensures stable performance even in harsh environmental conditions, enhancing the product's reliability.

Minimum Operating Temperature: -40 °C

The wide operating temperature range from -40 to 125°C enables the microcontroller to function effectively in extreme temperature environments.

ADC Channels: YES

The presence of analog-to-digital converter (ADC) channels allows for accurate conversion of analog signals into digital data, facilitating precise measurements and sensor interfacing.

DMA Channels: YES

Direct Memory Access (DMA) channels improve data transfer efficiency by allowing peripherals to access memory directly, enhancing overall system performance.

Technical Specifications

Microcontrollers TC1796256F150EBEKXUMA2 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B416

Length:

27 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

127

No. of Terminals:

416

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

RAM Bytes:

65536

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

2.5 mm

Speed:

150 rpm

Maximum Supply Voltage:

1.58 V

Minimum Supply Voltage:

1.42 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

27 mm

Peripheral IC Type:

Data EEPROM Size:

128K

Connectivity:

ASC(2), CAN(4), ETHERNET, MLI(2), MSC(2), SSC(2)

Peripherals:

DMA(16), TIMER(2)

Analog To Digital Convertors:

16 Ch 12-Bit(2), FADC 4 Ch 10-Bit

Trade Compliance

TC1796256F150EBEKXUMA2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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