Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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MT9VDDT6472HY-40BF2
Micron Technology
Other Memory ICs; Temperature Grade: COMMERCIAL; No. of Terminals: 200; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
.7 ns
200 MHz
COMMON
R-PDMA-N200
4831838208 bit
72
200
67108864 words
64M
70 Cel
0 Cel
64MX72
3-STATE
PLASTIC/EPOXY
DIMM
DIMM200,24
RECTANGULAR
MICROELECTRONIC ASSEMBLY
2.6
Not Qualified
8192
.045 Amp
Other Memory ICs
4050 mA
NO
CMOS
COMMERCIAL
NO LEAD
.6 mm
DUAL
MT9HTF3272Y-40EB2
Other Memory ICs; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
.6 ns
R-PDMA-N240
2415919104 bit
240
33554432 words
32M
32MX72
DIMM240,40
1.8
2070 mA
1 mm
MT9VDDF3272Y-40BK1
Other Memory ICs; Temperature Grade: COMMERCIAL; No. of Terminals: 184; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
R-PDMA-N184
184
DIMM184
.036 Amp
1.27 mm
MT36HTF51272FZ-667H1N8
Other Memory ICs; No. of Terminals: 240; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 333 MHz;
333 MHz
38654705664 bit
536870912 words
512M
512MX72
1.5,1.8
4480 mA
MT72HTS1G72FZ-667H1D6
Other Memory ICs; Temperature Grade: OTHER; No. of Terminals: 240; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
.45 ns
77309411328 bit
1073741824 words
1G
95 Cel
1GX72
OTHER
MT18VDDF12872DG-335J1
166 MHz
9663676416 bit
134217728 words
128M
128MX72
2.5
.09 Amp
5220 mA
MT18HTF25672PKZ-667H1
Other Memory ICs; Temperature Grade: COMMERCIAL; No. of Terminals: 244; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
R-PDMA-N244
19327352832 bit
244
268435456 words
256M
256MX72
DIMM244,24
3870 mA
MT9HVF6472PKZ-667G1
.063 Amp
2160 mA
MTFC16GLTDV-WT
MTFC16GLTDV-WT by Micron Technology is a memory IC with 137.4TB density, operating at -25 to 85°C. It features 169 terminals in a grid array package for surface mounting applications. Suitable for various electronic devices requiring high-density memory solutions.
R-PBGA-B169
137438953472 bit
169
85 Cel
-25 Cel
FBGA
BGA169,14X28,20
GRID ARRAY, FINE PITCH
1.8/3.3,3/3.3
YES
BALL
.5 mm
BOTTOM
MR256A08BCYS35R
Everspin Technologies
MR256A08BCYS35R by Everspin: 32KX8 memory IC with 262144 bit density, operates at 3.3V, and has a max access time of 35ns. Ideal for industrial applications requiring fast asynchronous memory operations in a compact package.
35 ns
R-PDSO-G44
18.41 mm
262144 bit
MEMORY CIRCUIT
8
3
1
44
32768 words
32K
ASYNCHRONOUS
-40 Cel
32KX8
TSOP2
TSOP44,.46,32
SMALL OUTLINE, THIN PROFILE
3.3
1.2 mm
.007 Amp
SRAMs
65 mA
3.6 V
3 V
INDUSTRIAL
GULL WING
.8 mm
10.16 mm
MR256A08BCYS35
MR256A08BCYS35 by Everspin Technologies is a 32Kx8 memory IC with CMOS technology. It operates asynchronously at a nominal voltage of 3.3V, with a max access time of 35ns. This industrial-grade IC is ideal for applications requiring fast and reliable memory storage in compact spaces.
NOT SPECIFIED
MR256A08BSO35R
MR256A08BSO35R by Everspin Tech is a 32Kx8 memory IC with CMOS tech. Operating at 3.3V, it has a max access time of 35ns and standby current of 0.007Amp. Ideal for applications requiring high-speed data storage in commercial-grade environments.
R-PDSO-G32
20.726 mm
32
SOP
SOP32,.4
SMALL OUTLINE
2.54 mm
1.25 mm
7.505 mm
MR256A08BSO35
MR256A08BSO35 by Everspin: 32KX8 memory IC with 262144 bit density, operates at 3.3V, and has a max access time of 35ns. Ideal for commercial applications requiring small outline package style and asynchronous operation.
MR256A08BYS35R
MR256A08BYS35R by Everspin Technologies is a 32Kx8 memory IC with CMOS technology. It operates asynchronously at 3.3V, has a max access time of 35ns, and consumes up to 65mA. This small outline, thin profile package is ideal for applications requiring fast and reliable memory storage in commercial temperature environments.
MR256A08BYS35
MR256A08BYS35 by Everspin Technologies is a 32Kx8 memory IC with CMOS technology. It operates asynchronously at 3.3V, with a max access time of 35ns. This small outline, thin profile package is ideal for applications requiring high-speed memory solutions in commercial temperature environments.
NP5Q128A13ESFC0E
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
R-PDSO-G16
10.3 mm
134217728 bit
16
SYNCHRONOUS
128MX1
SOP16,.4
3/3.3
2.65 mm
.0002 Amp
50 mA
2.7 V
7.5 mm
NP5Q128AE3ESFC0E
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Supply Current: 50 mA;
16777216 words
16M
16MX8
NP8P128A13B1760E
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; No. of Words Code: 16M;
R-PBGA-B64
10 mm
64
TBGA
GRID ARRAY, THIN PROFILE
8 mm
NP8P128A13BSM60E
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: TSOP1; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3;
R-PDSO-G56
18.4 mm
56
TSOP1
14 mm
NP8P128A13T1760E
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; Memory Density: 134217728 bit;
NP8P128A13TSM60E
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: TSOP1; Package Shape: RECTANGULAR; Surface Mount: YES;
NP8P128AE3T1760E
Micron Technology's NP8P128AE3T1760E is a 16MX8 memory circuit IC with 134217728-bit density. Operating at 3V, it features synchronous mode and industrial temperature grade. With a package style of grid array and thin profile, it is suitable for applications requiring high-speed data storage and retrieval in various electronic devices.
NP8P128AE3TSM60E
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSOP1; Package Shape: RECTANGULAR; Terminal Position: DUAL;
MR256A08BCSO35
MR256A08BCSO35 by Everspin: 32KX8 memory IC with 262144 bit density, operates at 3.3V, has 35ns access time. Ideal for industrial applications requiring small outline package and asynchronous operation.
75 mA
MR2A16AMYS35R
MR2A16AMYS35R by Everspin Technologies is a 256Kx16 memory IC with CMOS technology. Operating at 3.3V, it has a temperature range of -40 to 125°C and is AEC-Q100 compliant for automotive applications. This small outline, thin profile package with 44 terminals is ideal for high-performance asynchronous memory needs in automotive electronics.
4194304 bit
262144 words
256K
125 Cel
256KX16
AEC-Q100
AUTOMOTIVE
MR2A16AMYS35
MR2A16AMYS35 by Everspin Tech: 256KX16 memory IC with 4194304 bit density. Operating at -40 to 125 °C, it's AEC-Q100 graded for automotive applications. Features include 3.3V supply, small outline package, and dual terminal position.
MR20H40CDFR
MR20H40CDFR by Everspin Technologies is a 512KX8 MEMORY IC with 4194304 bit Memory Density. Operating at 3.3V, it has a Max Supply Current of 46.5mA and can withstand temperatures from -40 to 85 °C. Ideal for industrial applications requiring high-speed synchronous memory solutions in a compact form factor.
R-PDSO-N8
6 mm
524288 words
512K
512KX8
HVSON
SOLCC8,.25
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
.9 mm
.00075 Amp
46.5 mA
5 mm
MB85RS256BPNF-G-JNE1
Fujitsu
Fujitsu's MB85RS256BPNF-G-JNE1 is a 262Kb memory IC with 32Kx8 organization, operating at 3.3V. It features synchronous operation, industrial temperature grade, and small outline package suitable for various applications requiring reliable non-volatile memory storage.
R-PDSO-G8
5.05 mm
SOP8,.25
1.75 mm
.00005 Amp
6 mA
3.9 mm
MR10Q010SCR
Everspin Technologies' MR10Q010SCR is a 128KX8 MEMORY CIRCUIT IC with 1048576 bit Memory Density. Operating at 3.3V, it features SYNCHRONOUS mode and has a small outline package style. Ideal for applications requiring high-speed memory access in commercial temperature environments.
10.34 mm
1048576 bit
131072 words
128K
128KX8
1.8,3.3
2.64 mm
.005 Amp
220 mA
7.52 mm
TMS4C1050-60DJ
Texas Instruments
TMS4C1050-60DJ by Texas Instruments is a 20-terminal memory IC with 5V supply, operating b/w 0-70°C. It features a max access time of 60ns and standby current of 0.01A, suitable for commercial applications requiring fast memory circuits in small outline packages.
60 ns
R-PDSO-J20
20
SOJ
SOJ20/26,.34
5
.01 Amp
35 mA
J BEND
XC17S05PD8C
Xilinx
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Length: 9.3599 mm;
10 MHz
R-PDIP-T8
e0
9.3599 mm
53984 bit
53984 words
53984
53984X1
DIP
DIP8,.3
IN-LINE
225
4.5974 mm
OTP ROMs
10 mA
5.25 V
4.75 V
TIN LEAD
THROUGH-HOLE
30
7.62 mm
XC17S05PD8I
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Seated Height: 4.5974 mm;
5.5 V
4.5 V
XC17S05XLPD8C
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Finish: TIN LEAD;
54544 bit
54544 words
54544
54544X1
5 mA
XC17S10PD8C
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 225;
95008 bit
95008 words
95008
95008X1
XC17S10PD8I
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDIP-T8;
XC17S10XLPD8C
The Xilinx XC17S10XLPD8C is a 95752-bit memory circuit IC with 3.3V supply voltage, operating at up to 10MHz clock frequency. It features synchronous operation, common I/O type, and 3-STATE output characteristics. Ideal for applications requiring low power consumption and high-speed memory access in commercial-grade environments.
95752 bit
95752 words
95752
95752X1
XC17S10XLPD8I
XC17S20PD8C
The Xilinx XC17S20PD8C is a 178144-bit memory circuit IC with synchronous operation and 3-STATE output. It operates at a max clock frequency of 10 MHz, suitable for applications requiring high-speed memory access. With a package style of IN-LINE and through-hole terminal form, it is commonly used in commercial-grade systems needing reliable memory storage.
178144 bit
178144 words
178144
178144X1
Tin/Lead (Sn85Pb15)
XC17S20PD8I
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; JESD-609 Code: e0;
XC17S20XLPD8C
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Memory Width: 1;
179160 bit
179160 words
179160
179160X1
XC17S20XLPD8I
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Length: 9.3599 mm;
XC17S30PD8C
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
247968 bit
247968 words
247968
247968X1
XC17S30PD8I
XC17S30PD8I by Xilinx is a 247968-bit MEMORY CIRCUIT with 3-STATE output characteristics. Operating at 10 MHz clock frequency, it has an industrial temperature grade and synchronous mode. Commonly used in applications requiring reliable memory storage and retrieval within the industrial sector.
XC17S30XLPD8C
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Supply Current: 5 mA;
249168 bit
249168 words
249168
249168X1
XC17S30XLPD8I
XC17S30XLPD8I by Xilinx is a 249168-bit MEMORY CIRCUIT with 3.3V supply, operating at up to 10MHz clock frequency. It features an industrial temperature grade range from -40°C to 85°C and offers a synchronous operation mode. This IC is commonly used in applications requiring high-speed memory functions.
XC17S40PD8C
329312 bit
329312 words
329312
329312X1
XC17S40PD8I
XC17S40PD8I by Xilinx is a 329312-bit MEMORY CIRCUIT IC with 3-STATE output, operating at up to 10 MHz clock frequency. It features a synchronous mode, common I/O type, and operates in industrial temperature range. Ideal for applications requiring high memory density and low standby current.
XC17S40XLPD8C
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Seated Height: 4.5974 mm;
330696 bit
330696 words
330696
330696X1
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