Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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MTA8ATF2G64AZ-3G2F1
Micron Technology
MTA8ATF2G64AZ-3G2F1 by Micron Technology is a DDR4 DRAM MODULE with 2GX64 organization, operating at 1600 MHz. It features a memory width of 64 bits and density of 137.44 Gb, suitable for applications requiring high-speed synchronous memory like servers and workstations.
SINGLE BANK PAGE BURST
AUTO/SELF REFRESH
1600 MHz
COMMON
R-XDMA-N288
133.35 mm
137438953472 bit
DDR4 DRAM MODULE
64
1
288
2147483648 words
2G
SYNCHRONOUS
95 Cel
0 Cel
2GX64
UNSPECIFIED
DIMM
RECTANGULAR
MICROELECTRONIC ASSEMBLY
31.25 mm
YES
.304 Amp
1336 mA
1.2
NO
CMOS
NO LEAD
DUAL
MTA18ASF4G72AZ-3G2F1
DDR4 DRAM MODULE; No. of Terminals: 288; Terminal Form: NO LEAD; No. of Words: 4294967296 words; Organization: 4GX72; Package Body Material: UNSPECIFIED;
DUAL BANK PAGE BURST
309237645312 bit
72
4294967296 words
4G
4GX72
MT40A1G16KH-062EAUT:E
Micron Technology's MT40A1G16KH-062EAUT:E is a DDR4 DRAM with 1GX16 organization, operating at 1600 MHz. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for applications requiring high-speed memory access in automotive electronics due to AEC-Q100 screening level.
MULTI BANK PAGE BURST
8
R-PBGA-B96
13 mm
17179869184 bit
DDR4 DRAM
16
96
1073741824 words
1G
125 Cel
-40 Cel
1GX16
PLASTIC/EPOXY
TFBGA
BGA96,9X16,32
GRID ARRAY, THIN PROFILE, FINE PITCH
8192
AEC-Q100
1.2 mm
.043 Amp
299 mA
1.26 V
1.14 V
BALL
.8 mm
BOTTOM
9 mm
MT40A2G8JE-062EAUT:E
Micron Technology's MT40A2G8JE-062EAUT:E is a DDR4 DRAM with 2GX8 organization, operating at up to 1600 MHz. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for applications requiring high-speed memory with a thin profile and fine pitch package style.
R-PBGA-B78
11 mm
78
2GX8
BGA78,9X13,32
260
162 mA
30
MT40A1G16KH-062EAIT:E
Micron Technology's MT40A1G16KH-062EAIT:E is a DDR4 DRAM with 1GX16 organization, operating at up to 1600 MHz. It features common I/O type, synchronous mode, and self-refresh capability. Ideal for applications requiring high-speed memory in automotive and industrial environments.
7.5 mm
MT40A2G8JE-062EAAT:E
Micron Technology's MT40A2G8JE-062EAAT:E is a DDR4 DRAM with 2GX8 organization, operating at 1600 MHz. It features a common I/O type, synchronous mode, and self-refresh capability. Ideal for automotive applications due to AEC-Q100 screening level and thin profile grid array package.
105 Cel
MT48LC4M32B2B5-6A:LTR
Micron Technology's MT48LC4M32B2B5-6A:LTR is a 4MX32 Synchronous DRAM with 3.3V supply voltage, operating at 167MHz clock frequency. It features common I/O type and self-refresh mode, suitable for applications requiring fast memory access and low power consumption.
FOUR BANK PAGE BURST
5.4 ns
167 MHz
1,2,4,8
R-PBGA-B90
134217728 bit
SYNCHRONOUS DRAM
32
90
4194304 words
4M
70 Cel
4MX32
3-STATE
VFBGA
BGA90,9X15,32
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
4096
1 mm
1,2,4,8,FP
.0025 Amp
180 mA
3.6 V
3 V
3.3
8 mm
MTA18ADF4G72PZ-3G2F1
DDR4 DRAM MODULE; No. of Terminals: 288; Package Code: DIMM; Package Shape: RECTANGULAR; Maximum Operating Temperature: 95 Cel; Additional Features: AUTO/SELF REFRESH;
.756 Amp
1845 mA
MT40A512M16TB-062E:R
Micron Technology's MT40A512M16TB-062E:R is a DDR4 DRAM with 512MX16 organization, operating at up to 1600 MHz. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for applications requiring high-speed memory access in devices such as computers and servers.
8589934592 bit
536870912 words
512M
512MX16
65536
MT41K2G4RKB-107:P
DDR3L DRAM; No. of Terminals: 78; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 933 MHz;
933 MHz
10.5 mm
DDR3L DRAM
4
2GX4
.022 Amp
163 mA
1.45 V
1.283 V
1.35
MTA18ASF4G72HZ-3G2F1
Micron Technology's MTA18ASF4G72HZ-3G2F1 is a DDR4 DRAM module with 4GX72 organization, operating at 1612.9 MHz. It features synchronous operation, self-refresh capability, and a common I/O type. Ideal for high-performance computing applications requiring fast data processing and storage.
AUTO/SELF REFRESH; WD-MAX
1612.9 MHz
R-XZMA-N260
69.6 mm
30.15 mm
.684 Amp
ZIG-ZAG
3.7 mm
MTC4C10163S1SC48BA1
Micron Technology's MTC4C10163S1SC48BA1 DDR5 DRAM Module offers 1GX64 organization, 2403.8 MHz clock frequency, and 64-bit memory width. Ideal for high-performance computing applications requiring fast synchronous operation and a max operating temperature of 95°C.
SELF REFRESH
2403.8 MHz
R-XDMA-N262
68719476736 bit
DDR5 DRAM MODULE
262
1GX64
.065 Amp
778 mA
1.1
MTC16C2085S1UC48BA1
DDR5 DRAM MODULE; No. of Terminals: 288; Package Code: DIMM; Package Shape: RECTANGULAR; Maximum Supply Current: 993 mA; Access Mode: DUAL BANK PAGE BURST;
274877906944 bit
4GX64
.086 Amp
993 mA
MT53D1024M32D4DT-046AIT:D
Micron Technology's MT53D1024M32D4DT-046AIT:D is a LPDDR4 DRAM with 1GX32 organization, operating at 2136.7 MHz clock frequency. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for applications requiring high memory density and fast data processing in automotive electronics or industrial devices.
SELF REFRESH; IT ALSO REQUIRES 1.8V NOM; TERM PITCH-MAX
2136.7 MHz
16,32
R-PBGA-B200
14.5 mm
34359738368 bit
LPDDR4 DRAM
200
1GX32
BGA200,12X22,32/25
.95 mm
1.17 V
1.06 V
10 mm
MT53D512M32D2DS-046AUT:D
Micron Technology's MT53D512M32D2DS-046AUT:D is a LPDDR4 DRAM with 512MX32 organization, operating at up to 2136.7 MHz clock frequency. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for applications requiring high memory density and fast data processing in automotive electronics or industrial systems.
512MX32
MT53D512M32D2DS-046AIT:D
Micron Technology's MT53D512M32D2DS-046AIT:D is a LPDDR4 DRAM with 512MX32 organization, operating at 2136.7 MHz clock frequency. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for applications requiring high memory density and fast data processing in automotive electronics or industrial devices.
MT53D1024M32D4DT-046AUT:D
Micron Technology's MT53D1024M32D4DT-046AUT:D is a LPDDR4 DRAM with 1GX32 organization, operating at up to 2136.7 MHz clock frequency. It features common I/O type, self-refresh mode, and AEC-Q100 screening level. Ideal for applications requiring high-speed synchronous memory in automotive electronics.
MT53D512M32D2DS-046AAT:D
Micron Technology's MT53D512M32D2DS-046AAT:D is a LPDDR4 DRAM with 512MX32 organization, operating at 2136.7 MHz. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for applications requiring high-speed memory with a wide temperature range from -40 to 105°C.
MT53E512M16D1FW-046AIT:D
Micron Technology's MT53E512M16D1FW-046AIT:D is a LPDDR4 DRAM with 512MX16 organization, operating at up to 2136.7 MHz clock frequency. It features common I/O type, self-refresh mode, and synchronous operation. Ideal for applications requiring high-speed and low-power memory solutions in automotive electronics or mobile devices.
1.1 mm
MT53E512M16D1FW-046AAT:D
LPDDR4 DRAM; No. of Terminals: 200; Package Code: TFBGA; Package Shape: RECTANGULAR; Memory Width: 16; Sequential Burst Length: 16,32;
MT53E512M32D2FW-046AUT:D
LPDDR4 DRAM; No. of Terminals: 200; Package Code: TFBGA; Package Shape: RECTANGULAR; Terminal Form: BALL; No. of Ports: 1;
MT53E512M32D2FW-046AIT:D
LPDDR4 DRAM; No. of Terminals: 200; Package Code: TFBGA; Package Shape: RECTANGULAR; Technology: CMOS; Sequential Burst Length: 16,32;
MT61M256M32JE-10AAT:A
GDDR6 DRAM; No. of Terminals: 180; Package Code: TFBGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 1.2125 V; Memory Density: 8589934592 bit;
1500 MHz
R-PBGA-B180
14 mm
GDDR6 DRAM
180
268435456 words
256M
256MX32
BGA180,14X18,30
1.2875 V
1.2125 V
1.25
.75 mm
12 mm
MT61M256M32JE-12AAT:A
Micron Technology's MT61M256M32JE-12AAT:A is a GDDR6 DRAM with 256MX32 organization, operating at up to 1500 MHz. It features synchronous mode, self-refresh capability, and common I/O type. Ideal for high-performance applications requiring fast memory access and data processing.
MT60B1G16HC-48B:A
Micron Technology's MT60B1G16HC-48B:A is a DDR5 DRAM with 1GX16 organization, operating at 2403.8 MHz clock frequency. It features 8192 refresh cycles and supports multi-bank page burst access mode. This memory module is suitable for high-performance applications requiring fast synchronous operation in a compact grid array package.
R-PBGA-B102
DDR5 DRAM
102
BGA102,9X17,32
MT40A4G4SA-062E:F
DDR4 DRAM; No. of Terminals: 78; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR; Additional Features: AUTO/SELF REFRESH;
4GX4
MT40A1G16KD-062EIT:ETR
Micron Technology's MT40A1G16KD-062EIT:ETR is a DDR4 DRAM with 1GX16 organization, operating at 1600 MHz. It features synchronous operation, self-refresh capability, and common I/O type. Suitable for applications requiring high-speed memory access in devices like computers and servers.
e1
TIN SILVER COPPER
MT40A1G16KD-062EIT:E
Micron Technology's MT40A1G16KD-062EIT:E is a DDR4 DRAM with 1GX16 organization, operating at 1600 MHz. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for applications requiring high-speed memory access in devices like computers and servers.
MT40A2G8SA-062E:F
Micron Technology's MT40A2G8SA-062E:F is a DDR4 DRAM with 2GX8 organization, operating at up to 1600 MHz. It features a thin profile grid array package suitable for applications requiring high-speed synchronous memory with common I/O.
MT53E512M64D2HJ-046WT:B
LPDDR4 DRAM; No. of Terminals: 556; Package Code: TFBGA; Package Shape: SQUARE; Terminal Form: BALL; Technology: CMOS;
SELF REFRESH; IT ALSO REQUIRES 1.8V NOM
S-PBGA-B556
12.4 mm
556
85 Cel
-25 Cel
512MX64
BGA556,29X29,16
SQUARE
.4 mm
MT53E128M16D1DS-046WT:A
LPDDR4 DRAM; No. of Terminals: 200; Package Code: VFBGA; Package Shape: RECTANGULAR; No. of Words Code: 128M; Terminal Form: BALL;
SELF REFRESH, IT ALSO REQUIRES 1.8V NOMINAL SUPPLY, TERM PITCH-MAX
2133 MHz
2147483648 bit
134217728 words
128M
128MX16
MT53E128M32D2FW-046IT:A
LPDDR4 DRAM; No. of Terminals: 200; Package Code: TFBGA; Package Shape: RECTANGULAR; Width: 10 mm; Memory Width: 32;
4294967296 bit
128MX32
MT53E128M32D2FW-046WT:A
LPDDR4 DRAM; No. of Terminals: 200; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 1.17 V; Minimum Operating Temperature: -25 Cel;
MT40A512M16TB-062E:J
Micron Technology's MT40A512M16TB-062E:J is a DDR4 DRAM with 512MX16 organization, operating at 1.2V. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for applications requiring high memory density and fast data access in thin-profile devices.
13.5 mm
MT40A1G8SA-062E:J
Micron Technology's MT40A1G8SA-062E:J is a DDR4 DRAM with 1GX8 organization, operating at 1.2V. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for applications requiring high memory density and fast data access in thin-profile devices.
1GX8
BGA78,6X13,32
MT40A2G4SA-062E:J
DDR4 DRAM; No. of Terminals: 78; Package Code: TFBGA; Refresh Cycles: 65536; Package Shape: RECTANGULAR; No. of Ports: 1;
MT40A2G4SA-062E:R
DDR4 DRAM; No. of Terminals: 78; Package Code: TFBGA; Refresh Cycles: 65536; Package Shape: RECTANGULAR; Package Equivalence Code: BGA78,6X13,32;
MT47H32M8BP-3:BTR
DDR2 DRAM; No. of Terminals: 60; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR; Maximum Supply Current: 250 mA;
.45 ns
333 MHz
4,8
R-PBGA-B60
268435456 bit
DDR2 DRAM
60
33554432 words
32M
32MX8
BGA60,9X11,32
.04 Amp
250 mA
1.9 V
1.7 V
1.8
MT53B512M32D2NP-062AAT:C
LPDDR4 DRAM; No. of Terminals: 200; Package Code: VFBGA; Refresh Cycles: 16384; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
16384
.0033 Amp
410 mA
MT53B512M32D2NP-062AIT:C
400 mA
MT53B256M32D1DS-062AIT:C
LPDDR4 DRAM; No. of Terminals: 200; Package Code: VFBGA; Refresh Cycles: 16384; Package Shape: RECTANGULAR; Memory Density: 8589934592 bit;
MT53B256M32D1NP-062AAT:C
LPDDR4 DRAM; No. of Terminals: 200; Package Code: VFBGA; Refresh Cycles: 16384; Package Shape: RECTANGULAR; Technology: CMOS;
MT53B256M32D1NP-062AIT:C
LPDDR4 DRAM; No. of Terminals: 200; Package Code: VFBGA; Refresh Cycles: 16384; Package Shape: RECTANGULAR; No. of Words: 268435456 words;
MT47H64M16NF-25EAAT:MTR
Micron Technology's MT47H64M16NF-25EAAT:MTR is a DDR2 DRAM with 64MX16 organization, operating at 400 MHz. It features synchronous operation, self-refresh capability, and common I/O type. Suitable for applications requiring high memory density and fast data access in automotive electronics or industrial control systems.
.4 ns
400 MHz
R-PBGA-B84
12.5 mm
1073741824 bit
84
67108864 words
64M
64MX16
BGA84,9X15,32
.01 Amp
260 mA
MT53E1G32D2FW-046AUT:B
Micron Technology's MT53E1G32D2FW-046AUT:B is a LPDDR4 DRAM with 1GX32 organization, operating at 2133 MHz. It features a thin profile grid array package, operates at temperatures from -40 to 125 °C, and is suitable for applications requiring high-speed synchronous memory.
BGA200,12X20,32/25
MT9KBF51272AKZ-1G4E2
DDR3L DRAM MODULE; No. of Terminals: 244; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR; Technology: CMOS;
AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V NOMINAL SUPPLY
666.66 MHz
R-XDMA-N244
82 mm
38654705664 bit
DDR3L DRAM MODULE
244
512MX72
OPEN-DRAIN
17.91 mm
3.8 mm
MT53E256M32D2FW-046AAT:B
Micron Technology's MT53E256M32D2FW-046AAT:B is a LPDDR4 DRAM with 256MX32 organization, operating at 2133 MHz. It features a common I/O type, self-refresh mode, and synchronous operation. Ideal for applications requiring high-speed memory performance in automotive electronics or industrial devices.
MTA16ATF4G64HZ-3G2F1
Micron's MTA16ATF4G64HZ-3G2F1 is a DDR4 DRAM module with 4GX64 organization, 64-bit memory width, and 274877906944 bit memory density. It operates synchronously with self-refresh capability and dual bank page burst access mode. Ideal for applications requiring high-speed data processing in compact systems.
AUTO REFRESH AND SELF REFRESH; WIDTH MAX
R-XDMA-N260
DIMM260,20
.5 mm
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