Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MTA18ASF2G72HZ-2G6E1
Micron Technology
Micron Technology's MTA18ASF2G72HZ-2G6E1 is a DDR4 DRAM MODULE with 2GX72 organization, operating at 1333 MHz. It features a memory density of 154618822656 bit and supports DUAL BANK PAGE BURST access mode. Ideal for applications requiring high-speed synchronous memory with self-refresh capability.
DUAL BANK PAGE BURST
AUTO/SELF REFRESH; WD-MAX
1333 MHz
COMMON
4,8
R-XDMA-N260
69.6 mm
154618822656 bit
DDR4 DRAM MODULE
72
1
260
2147483648 words
2G
SYNCHRONOUS
95 Cel
0 Cel
2GX72
3-STATE
UNSPECIFIED
DIMM
RECTANGULAR
MICROELECTRONIC ASSEMBLY
30.15 mm
YES
.45 Amp
1881 mA
1.26 V
1.14 V
1.2
NO
CMOS
OTHER
NO LEAD
DUAL
3.7 mm
MTA8ATF2G64HZ-3G2E2
Micron Technology's MTA8ATF2G64HZ-3G2E2 is a DDR4 DRAM MODULE with 2GX64 organization, operating at 1600 MHz. It features synchronous mode, self-refresh capability, and common I/O type. Ideal for applications requiring high-speed memory access in microelectronic assemblies.
1600 MHz
137438953472 bit
64
2GX64
DIMM260,20
.304 Amp
1480 mA
.5 mm
MT53D512M32D2DS-053AUT:D
Micron Technology's MT53D512M32D2DS-053AUT:D is a 512MX32 LPDDR4 DRAM with 1.1V, -40 to 125 °C temp range, and 1866 MHz clock freq. Ideal for automotive applications due to its robust design and high memory density of 17.18 Gb.
1866 MHz
17179869184 bit
LPDDR4 DRAM
32
536870912 words
512M
125 Cel
-40 Cel
512MX32
1.1
AUTOMOTIVE
MTA36ASF4G72PZ-2G6B2
DDR4 DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 288; Package Code: DIMM; Package Shape: RECTANGULAR; Sequential Burst Length: 8;
8
R-XDMA-N288
133.35 mm
309237645312 bit
288
4294967296 words
4G
4GX72
OPEN-DRAIN
DIMM288,33
31.55 mm
.792 Amp
3996 mA
3.9 mm
MTA9ASF1G72PZ-2G9E1
Micron Technology's MTA9ASF1G72PZ-2G9E1 is a DDR4 DRAM MODULE with 1GX72 organization, operating at up to 1466 MHz. It features synchronous mode, self-refresh capability, and common I/O type. Ideal for applications requiring high-speed memory access in servers or data centers.
SINGLE BANK PAGE BURST
1466 MHz
77309411328 bit
1073741824 words
1G
1GX72
.198 Amp
1665 mA
MTA18ASF2G72PZ-2G9E1
Micron Technology's MTA18ASF2G72PZ-2G9E1 is a DDR4 DRAM MODULE with 2GX72 organization, operating at 1466 MHz. It features synchronous mode, self-refresh capability, and common I/O type. Ideal for applications requiring high-speed memory performance in servers or data centers.
31.4 mm
.396 Amp
3870 mA
MTA36ASF4G72PZ-3G2E7
DDR4 DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 288; Package Code: DIMM; Package Shape: RECTANGULAR; Additional Features: AUTO/SELF REFRESH; WD-MAX;
1612 MHz
4536 mA
MTA8ATF1G64AZ-2G3A1
DDR4 DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 288; Package Code: DIMM; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 1.2;
1204 MHz
68719476736 bit
1GX64
2.7 mm
MTA8ATF1G64AZ-2G6E1
DDR4 DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 288; Package Code: DIMM; Package Shape: RECTANGULAR; Width: 2.7 mm;
MTA8ATF1G64AZ-3G2E1
DDR4 DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 288; Package Code: DIMM; Package Shape: RECTANGULAR; No. of Ports: 1;
MTA18ASF2G72PDZ-2G6E1
Micron's MTA18ASF2G72PDZ-2G6E1 DDR4 DRAM module features 2GX72 organization, 1333 MHz clock frequency, and 154618822656-bit memory density. Ideal for servers, data centers, and high-performance computing applications requiring synchronous operation and self-refresh capabilities.
MTA18ASF2G72PDZ-2G9E1
Micron Technology's MTA18ASF2G72PDZ-2G9E1 is a DDR4 DRAM MODULE with 2GX72 organization, 1466 MHz clock frequency, and 154618822656-bit memory density. It operates synchronously at 1.2V, featuring dual-bank page burst access mode. Ideal for high-performance computing applications requiring fast data processing and storage capabilities.
MTA18ASF2G72PZ-3G2E2
4140 mA
MTA18ASF2G72PDZ-2G3D1
DDR4 DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 288; Package Code: DIMM; Package Shape: RECTANGULAR; Terminal Form: NO LEAD;
MTA36ASF4G72PZ-2G3D1
DDR4 DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 288; Package Code: DIMM; Package Shape: RECTANGULAR; JESD-30 Code: R-XDMA-N288;
MTA36ASF4G72PZ-2G9E2
4266 mA
MT40A512M16LY-062EAIT:E
Micron Technology's MT40A512M16LY-062EAIT:E is a DDR4 DRAM with 512MX16 organization, operating at 1600 MHz. It features a common I/O type, self-refresh mode, and AEC-Q100 screening level. Ideal for applications requiring high-speed synchronous memory with low power consumption.
MULTI BANK PAGE BURST
AUTO/SELF REFRESH
R-PBGA-B96
13.5 mm
8589934592 bit
DDR4 DRAM
16
96
512MX16
PLASTIC/EPOXY
TFBGA
BGA96,9X16,32
GRID ARRAY, THIN PROFILE, FINE PITCH
8192
AEC-Q100
1.2 mm
.018 Amp
270 mA
BALL
.8 mm
BOTTOM
7.5 mm
MTA18ADF2G72AZ-3G2R1
DDR4 DRAM MODULE; No. of Terminals: 288; Package Code: DIMM; Package Shape: RECTANGULAR; Terminal Form: NO LEAD; Maximum Supply Current: 1737 mA;
1612.9 MHz
18.9 mm
.54 Amp
1737 mA
MT53E384M32D2DS-046AIT:E
LPDDR4 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 200; Package Code: VFBGA; Package Shape: RECTANGULAR; No. of Functions: 1;
SELF REFRESH, IT ALSO REQUIRES 1.8V NOMINAL SUPPLY, TERM PITCH-MAX
2133 MHz
16,32
R-PBGA-B200
14.5 mm
12884901888 bit
200
402653184 words
384M
384MX32
VFBGA
BGA200,12X20,32/25
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
1.17 V
1.06 V
INDUSTRIAL
10 mm
MT53E768M32D4DT-046AIT:E
Micron Technology's MT53E768M32D4DT-046AIT:E is a LPDDR4 DRAM with 768MX32 organization, operating at 2133 MHz. It features common I/O type, self-refresh mode, and AEC-Q100 screening level. Ideal for industrial applications requiring high memory density and fast data processing capabilities.
25769803776 bit
805306368 words
768M
768MX32
.95 mm
MT53E768M32D4DE-046AAT:E
Micron Technology's MT53E768M32D4DE-046AAT:E is a LPDDR4 DRAM with 768MX32 organization, operating at 2133 MHz. It features self-refresh and common I/O type, suitable for industrial applications requiring high memory density and fast clock frequency. The package style is grid array with thin profile, making it ideal for space-constrained designs.
105 Cel
1.14 mm
MT53E768M32D4DT-053AUT:E
LPDDR4 DRAM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 200; Package Code: VFBGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 125 Cel;
MT53E384M32D2DS-053AUT:E
LPDDR4 DRAM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 200; Package Code: VFBGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 1.06 V;
MT53E384M32D2FW-046AIT:E
LPDDR4 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 200; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Equivalence Code: BGA200,12X20,32/25;
1.1 mm
MT53E768M32D4DE-046AIT:E
Micron Technology's MT53E768M32D4DE-046AIT:E is a LPDDR4 DRAM with 768MX32 organization, operating at 2133 MHz. It features self-refresh and common I/O type, suitable for industrial applications requiring high memory density and fast clock frequency.
MT53E384M32D2DS-046AAT:E
LPDDR4 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 200; Package Code: VFBGA; Package Shape: RECTANGULAR; No. of Words Code: 384M;
MT53E384M32D2DS-046AUT:E
LPDDR4 DRAM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 200; Package Code: VFBGA; Package Shape: RECTANGULAR; Memory Density: 12884901888 bit;
MT53E384M32D2FW-046AAT:E
LPDDR4 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 200; Package Code: TFBGA; Package Shape: RECTANGULAR; Input/Output Type: COMMON;
MT53E768M32D4DT-046AUT:E
LPDDR4 DRAM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 200; Package Code: VFBGA; Package Shape: RECTANGULAR; Technology: CMOS;
MT46H32M32LFT68MWC2
LPDDR1 DRAM; Package Code: DIE; Package Shape: RECTANGULAR; Package Style (Meter): UNCASED CHIP; Minimum Supply Voltage (Vsup): 1.7 V; No. of Words Code: 32M;
FOUR BANK PAGE BURST
166 MHz
2,4,8,16
R-XUUC-N
1073741824 bit
LPDDR1 DRAM
33554432 words
32M
85 Cel
32MX32
DIE
UNCASED CHIP
1.95 V
1.7 V
1.8
UPPER
MT48LC16M16A2P-6AXIT:GTR
Micron Technology's MT48LC16M16A2P-6AXIT:GTR is a 16MX16 Synchronous DRAM with 167 MHz clock frequency, 5.4 ns access time, and 8192 refresh cycles. Ideal for industrial applications requiring high-speed memory operations in a compact form factor.
5.4 ns
167 MHz
1,2,4,8
R-PDSO-G54
22.22 mm
268435456 bit
SYNCHRONOUS DRAM
54
16777216 words
16M
16MX16
TSOP2
TSOP54,.46,32
SMALL OUTLINE, THIN PROFILE
1,2,4,8,FP
.0025 Amp
100 mA
3.6 V
3 V
3.3
GULL WING
10.16 mm
MT62F512M64D4BG-031WT:B
LPDDR5 DRAM; Temperature Grade: OTHER; Nominal Supply Voltage / Vsup (V): 1.05; Organization: 512MX64; No. of Words Code: 512M; No. of Words: 536870912 words;
3200 MHz
34359738368 bit
LPDDR5 DRAM
-25 Cel
512MX64
1.05
MT40A512M16LY-062EIT:ETR
Micron Technology's MT40A512M16LY-062EIT:ETR is a DDR4 DRAM with 512MX16 organization, operating at up to 1600 MHz. It features synchronous operation, self-refresh capability, and common I/O type. This thin-profile memory module is suitable for applications requiring high-speed data processing in a compact form factor.
e1
3
TIN SILVER COPPER
30
MT62F1G64D8CH-031WT:B
Micron Technology's MT62F1G64D8CH-031WT:B is a 1GX64 LPDDR5 DRAM with 64-bit memory width and 68719476736 bit density. It operates b/w -25°C to 85°C, making it suitable for high-performance applications requiring fast data processing and storage capabilities.
MT62F1G64D8CH-031WT:A
LPDDR5 DRAM; Memory Density: 68719476736 bit; No. of Functions: 1; Memory Width: 64; Maximum Operating Temperature: 85 Cel; No. of Words Code: 1G;
MT53D1024M32D4NQ-062WT:D
LPDDR4 DRAM; No. of Terminals: 200; Package Shape: RECTANGULAR; Maximum Seated Height: .95 mm; No. of Ports: 1; Nominal Supply Voltage / Vsup (V): 1.8;
SELF REFRESH, IT ALSO REQUIRES 1.1V NOMINAL SUPPLY
1GX32
MT53D1024M32D4DT-053WT:D
Micron Technology's MT53D1024M32D4DT-053WT:D is a LPDDR4 DRAM with 1GX32 organization, operating at up to 1869.1 MHz clock frequency. It features dual bank page burst access mode and common I/O type, suitable for applications requiring high-speed synchronous memory with low power consumption.
SELF REFRESH, IT ALSO REQUIRES 1.1V NOMINAL SUPPLY, TERM PITCH-MAX
1869.1 MHz
MT53D1024M32D4NQ-046WT:D
LPDDR4 DRAM; No. of Terminals: 200; Package Shape: RECTANGULAR; No. of Functions: 1; Maximum Supply Voltage (Vsup): 1.95 V; Technology: CMOS;
2136.7 MHz
MT53D1024M32D4NQ-053WT:D
LPDDR4 DRAM; No. of Terminals: 200; Package Shape: RECTANGULAR; Additional Features: SELF REFRESH, IT ALSO REQUIRES 1.1V NOMINAL SUPPLY; Memory Density: 34359738368 bit; Access Mode: DUAL BANK PAGE BURST;
MT53D512M32D2DS-046WT:D
Micron Technology's MT53D512M32D2DS-046WT:D is a LPDDR4 DRAM with 512MX32 organization, operating at 2136.7 MHz clock frequency. It features single bank page burst access mode and common I/O type, suitable for applications requiring high-speed synchronous memory with low power consumption.
MT53D512M32D2NP-053WT:D
LPDDR4 DRAM; No. of Terminals: 200; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; Access Mode: SINGLE BANK PAGE BURST; No. of Words Code: 512M;
MT53D512M32D2NP-062WT:D
LPDDR4 DRAM; No. of Terminals: 200; Package Shape: RECTANGULAR; Maximum Seated Height: .8 mm; Memory Width: 32; Memory Density: 17179869184 bit;
MT53D512M32D2NP-046WT:D
LPDDR4 DRAM; No. of Terminals: 200; Package Shape: RECTANGULAR; Self Refresh: YES; Package Body Material: PLASTIC/EPOXY; No. of Words: 536870912 words;
MT48LC8M16A2P-6AXIT:L
Micron Technology's MT48LC8M16A2P-6AXIT:L is a 8MX16 Synchronous DRAM with 3.3V supply voltage, operating at 167MHz clock frequency. Ideal for applications requiring fast access time and high memory density, such as automotive electronics or industrial control systems.
134217728 bit
8388608 words
8M
8MX16
4096
MT53B1024M32D4NQ-053WT:C
DDR4 DRAM; No. of Terminals: 200; Package Code: VFBGA; Package Shape: RECTANGULAR; Maximum Seated Height: .95 mm; Terminal Position: BOTTOM;
SELF REFRESH; IT ALSO REQUIRES 1.8V NOM
-30 Cel
BGA200,12X22,32/25
MT53B256M32D1NP-062WT:C
DDR4 DRAM; No. of Terminals: 200; Package Code: VFBGA; Package Shape: RECTANGULAR; Terminal Form: BALL; Minimum Supply Voltage (Vsup): 1.06 V;
268435456 words
256M
256MX32
MT53B512M32D2NP-053WT:C
DDR4 DRAM; No. of Terminals: 200; Package Code: VFBGA; Package Shape: RECTANGULAR; No. of Words Code: 512M; Maximum Clock Frequency (fCLK): 1866 MHz;
MT53B256M32D1NP-053WT:C
DDR4 DRAM; No. of Terminals: 200; Package Code: VFBGA; Package Shape: RECTANGULAR; Input/Output Type: COMMON; Length: 14.5 mm;
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