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XCZU7EV-1FBVB900E

Xilinx

XCZU7EV-1FBVB900E by Xilinx

XCZU7EV-1FBVB900E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. This GRID ARRAY package with 900 terminals is ideal for applications requiring high-performance processing in various electronic devices.

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Overview

Unleash the power of innovation with the XCZU7EV-1FBVB900E by Xilinx. As a leader in the industry, Xilinx delivers top-quality products like this microprocessor circuit that are designed to exceed expectations. Ideal for a wide range of applications, this versatile IC offers unmatched performance and reliability. Experience seamless integration, superior functionality, and unrivaled value with the XCZU7EV-1FBVB900E. Elevate your projects to new heights with Xilinx.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making the product long-lasting.

Surface Mount: YES

This feature allows for easy and efficient installation on circuit boards, saving time during production.

Maximum Supply Voltage: 0.876 V

With a high maximum supply voltage, this product can handle demanding power requirements without risk of damage.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of space on a circuit board.

No. of Terminals: 900

The high number of terminals enables connectivity with multiple components, increasing versatility in application.

Package Style (Meter): GRID ARRAY

The grid array package style provides stability and secure connections for the components inside.

Minimum Supply Voltage: 0.825 V

Even with a low minimum supply voltage, this product can still operate efficiently, making it versatile in different power situations.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this product can function reliably in a variety of environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that this product can perform consistently even in cold conditions.

Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

The terminal finish of tin/silver/copper provides a reliable connection with other components, enhancing overall performance.

Terminal Position: BOTTOM

The bottom terminal position allows for easy access and connection to other elements on a circuit board.

Maximum Time At Peak Reflow Temperature (s): 30

With a short time at peak reflow temperature, this product minimizes the risk of overheating and damage during the assembly process.

Peak Reflow Temperature °C: 245

The high peak reflow temperature ensures proper soldering and bonding of the components, reducing the chance of faulty connections.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

As a microprocessor circuit, this product offers advanced processing capabilities for efficient operation in various applications.

Technology: CMOS

This CMOS technology enables low power consumption and high-speed operation, making the product energy-efficient.

Terminal Form: BALL

The ball terminal form provides a secure and stable connection, ensuring reliable performance in demanding conditions.

Nominal Supply Voltage: 0.85 V

The nominal supply voltage of 0.85 V offers a balance between power efficiency and high performance, making this product a reliable choice.

Moisture Sensitivity Level (MSL): 4

With a moisture sensitivity level of 4, this product can withstand exposure to humidity and moisture without impacting its functionality.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU7EV-1FBVB900E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B900

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU7EV-1FBVB900E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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