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XCZU6CG-1FFVC900I

Xilinx

XCZU6CG-1FFVC900I by Xilinx

XCZU6CG-1FFVC900I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.

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Overview

Unlock the power of innovation with the XCZU6CG-1FFVC900I by Xilinx. Designed for cutting-edge applications, this high-quality peripheral IC offers unparalleled performance and reliability. Whether you're working on industrial automation, IoT devices, or embedded systems, this microprocessor circuit delivers the speed and efficiency you need. Trust Xilinx, a leader in semiconductor technology, to provide you with the tools to bring your ideas to life. Experience the value and benefits of the XCZU6CG-1FFVC900I and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components, ensuring reliability in various operating conditions.

Surface Mount: YES

Being surface mountable makes the product easy to integrate into circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 0.876 V

The high maximum supply voltage of 0.876 V allows for flexibility in power supply options, making it compatible with a wide range of applications.

Package Shape: RECTANGULAR

The rectangular package shape is efficient for PCB layout and placement, optimizing space utilization within the system design.

No. of Terminals: 900

With a large number of terminals, this product offers high connectivity options for integrating with other components and peripherals within the system.

Package Style (Meter): GRID ARRAY

The grid array package style provides a compact and organized arrangement of terminals, facilitating easier soldering and assembly processes.

Minimum Supply Voltage: 0.825 V

The low minimum supply voltage of 0.825 V ensures energy-efficient operation and enables the product to function reliably even in low-power scenarios.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature of 100°C allows the product to withstand elevated temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance even in extreme cold conditions, expanding the product's usability range.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The terminal finish of tin/silver/copper provides corrosion resistance and excellent electrical conductivity, enhancing the overall reliability and longevity of the product.

Terminal Position: BOTTOM

Having the terminals positioned at the bottom allows for efficient heat dissipation and better mechanical stability during soldering and component mounting processes.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature of 30 seconds helps prevent overheating and potential damage to the product during assembly reflow processes.

Peak Reflow Temperature °C: 245

The high peak reflow temperature of 245°C ensures effective solder joint formation and reliable bonding between the product and the PCB.

Temperature Grade: INDUSTRIAL

The industrial temperature grade signifies that the product is designed to operate reliably within a wide temperature range, making it suitable for harsh industrial environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit as a peripheral IC type adds advanced processing capabilities to the product, enabling complex functions and tasks to be performed efficiently.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, contributing to energy efficiency and robust performance of the product.

Terminal Form: BALL

The ball terminal form provides reliable electrical connections and mechanical strength, ensuring stable operation and connectivity within the system.

Nominal Supply Voltage: 0.85 V

The nominal supply voltage of 0.85 V provides a stable operating voltage for the product, ensuring consistent performance and reliability in various applications.

Moisture Sensitivity Level (MSL): 4

Having a moisture sensitivity level of 4 indicates that the product requires careful handling and storage to prevent moisture-related damage, ensuring long-term reliability and performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU6CG-1FFVC900I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B900

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU6CG-1FFVC900I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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