Loading...

XCVM1302-2HSINSVF1369

Xilinx

XCVM1302-2HSINSVF1369 by Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Terminal Pitch: .92 mm;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,117 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,117

-

-

-

-

VNN

France . 677 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

677

-

-

-

-

Digiode

USA . 208 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

208

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,115 parts In-Stock

1+ parts

$7.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,115

$7.000

-

-

-

Semicontronic

India . 852 parts In-Stock

1+ parts

$7.000

100+ parts

$6.825

1k+ parts

$6.790

10k+ parts

-

852

$7.000

$6.825

$6.790

-

One Stop Electronics

USA . 1,383 parts In-Stock

1+ parts

$13.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,383

$13.000

-

-

-

AZTECH Wire

Italy . 207 parts In-Stock

1+ parts

$15.780

100+ parts

-

1k+ parts

-

10k+ parts

-

207

$15.780

-

-

-

MARBEL Systems

Belgium . 2,095 parts In-Stock

1+ parts

$39.315

100+ parts

-

1k+ parts

-

10k+ parts

-

2,095

$39.315

-

-

-

Texas Native Microelectronics

USA . 1,000 parts In-Stock

1+ parts

$45.190

100+ parts

-

1k+ parts

-

10k+ parts

$39.767

1,000

$45.190

-

-

$39.767

Kenton Components

USA . 1,393 parts In-Stock

1+ parts

$54.228

100+ parts

-

1k+ parts

-

10k+ parts

$47.721

1,393

$54.228

-

-

$47.721

Qasali Group International

UK . 100 parts In-Stock

1+ parts

$122.013

100+ parts

-

1k+ parts

-

10k+ parts

$107.371

100

$122.013

-

-

$107.371

Microchip USA

USA . 1,346 parts In-Stock

1+ parts

$3,214.925

100+ parts

-

1k+ parts

-

10k+ parts

-

1,346

$3,214.925

-

-

-

Supply Digital

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

Corohmni

South Africa . 256 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

256

-

-

-

-

Corphita

USA . 91 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

91

-

-

-

-

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCVM1302-2HSINSVF1369 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B1369

Length:

35 mm

No. of Terminals:

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA1369,37X37,36

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Maximum Seated Height:

4 mm

Maximum Supply Voltage:

.906 V

Minimum Supply Voltage:

.854 V

Nominal Supply Voltage:

.88 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.92 mm

Terminal Position:

BOTTOM

Width:

35 mm

Peripheral IC Type:

Trade Compliance

XCVM1302-2HSINSVF1369 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20