Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Maximum Supply Voltage: .825 V;
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Other Function uPs,uCs & Peripheral ICs XCVM1302-1MSINSVF1369 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx
JESD-30 Code:
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XCVM1302-1MSINSVF1369 Peripheral ICs trade compliance attributes, and parameters.
HTS
8542.31.00.01
SB
8542.31.00.00
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
CRCW040210K0FKED
Vishay Intertechnology
Vishay Intertechnology's CRCW040210K0FKED is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.063 W power dissipation. Ideal for surface mount applications in electronics due to its compact SMT package style and high operating temperature range of -55 to 155 °C.
MMBT3906LT1G
Onsemi
MMBT3906LT1G by Onsemi is a PNP BJT with VCEsat of 0.4V, hFE of 30, and fT of 250MHz. Ideal for small signal applications in electronics due to its low power dissipation, high transition frequency, and compact SOT-23 package. Suitable for use in temperature-sensitive environments with an operating range from -65°C to 150°C.
1N4148
Won-top Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
USB3320C-EZK-TR
Microchip Technology
Microchip Technology's USB3320C-EZK-TR is a Bus Controller IC with 32 terminals, operating at 1.6-2V. It supports USB bus compatibility, clock frequency up to 60MHz, and CMOS technology. Ideal for applications requiring Universal Serial Bus peripherals in compact designs with low power consumption.
LM555CM
Harris Semiconductor
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LIS2DH12TR
STMicroelectronics
LIS2DH12TR by STMicroelectronics is a 3-axis accelerometer with digital voltage output. It operates b/w -40 to 85°C, with supply voltage range of 1.71-3.6V. Ideal for applications requiring precise motion sensing in compact spaces like wearables and IoT devices.
06035C104KAT2A
KYOCERA AVX
06035C104KAT2A by KYOCERA AVX is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
SS14
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Weitron Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317AEMP/NOPB
Texas Instruments
LM317AEMP/NOPB by Texas Instruments is an adjustable positive single output standard regulator with a max output voltage of 37V and a max output current of 1.5A. It operates in temperatures ranging from -40°C to 125°C, making it suitable for various applications requiring precise voltage regulation in a compact package.
LL4148
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Panjit International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Nexperia
BAV99
Itt Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Microsemi
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum DC Current Gain (hFE): 30; No. of Elements: 1;
Eic Semiconductor
SMBJ18CA
Sensitron Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Changzhou Galaxy Century Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WT
Diotec Semiconductor Ag
National Semiconductor
DS2408S/TR
Dallas Semiconductor
Other uPs/uCs/Peripheral ICs;
MIMXRT1172CVM8A
NXP Semiconductors
NXP Semiconductors' MIMXRT1172CVM8A is a low-profile, fine-pitch SoC with 289 terminals. Operating b/w -40 to 105°C, it supports a supply voltage range of 1.1-1.15V. Ideal for applications requiring high-performance uPs/uCs in compact form factors.
EFR32MG12P432F1024GM48-CR
Silicon Labs
EFR32MG12P432F1024GM48-CR by Silicon Labs is a System on Chip with 48 terminals, operating b/w -40 to 85°C. It has a supply voltage range of 1.8V to 3.8V and utilizes CMOS technology. This chip carrier with a very thin profile is suitable for various applications requiring low power consumption and compact design.
MCIMX515DJM8CR2
MCIMX515DJM8CR2 by NXP Semiconductors is a SYSTEM ON CHIP with 529 terminals, operating at -20 to 85 °C. It has a supply voltage range of 1.05V to 1.2V and uses BALL terminal form for various applications requiring low profile, fine pitch package style in electronics industry.
ASI4UE-G1-SR-7
Zentrum Mikroelektronik Dresden Ag
CY8C3866AXI-039T
Infineon Technologies
CY8C3866AXI-039T by Infineon is a 100-terminal, low-profile, fine-pitch FLATPACK IC with a CMOS technology and 524288 ROM bits. Operating at -40 to 85 °C, it has a supply voltage range of 1.71V to 5.5V making it ideal for industrial applications requiring a programmable SoC solution.
XC7Z030-2FBG484E
Xilinx
XC7Z030-2FBG484E by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage ranging from 0.95V to 1.05V. This package has 484 terminals in a square grid array shape, suitable for various applications requiring high-performance processing capabilities.
EFR32MG21A010F768IM32-B
EFR32MG21A010F768IM32-B by Silicon Labs is a surface mount system on chip (SoC) with 32 terminals. It operates at a voltage range of 1.71V to 3.8V and can withstand temperatures from -40°C to 125°C. This automotive-grade IC is suitable for various applications requiring low power consumption and compact size.
AM6411BSCGHAALV
AM6411BSCGHAALV by Texas Instruments is a System on Chip with 441 terminals in a grid array package. It operates b/w -40 to 105°C, with supply voltage ranging from 0.715V to 0.79V. Ideal for applications requiring high-performance computing in compact spaces.
FT245BL
FTDI
FT245BL by FTDI is a 32-terminal peripheral IC with a supply voltage range of 4.35V to 5.25V. It operates in temperatures from 0°C to 70°C, making it suitable for commercial applications requiring a microprocessor circuit with CMOS technology and matte tin terminal finish.
NRF9160-SIBA-R
Nordic Semiconductor Asa
Nordic Semiconductor's NRF9160-SIBA-R is a CMOS microcontroller with 127 terminals in a grid array package. It operates b/w -40 to 85°C, suitable for industrial applications. With a supply voltage range of 3-5.5V, it is ideal for IoT devices requiring low power consumption and compact design.
MCIMX6Q5EYM10AD
MCIMX6Q5EYM10AD by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -20 to 105 °C, with a supply voltage range of 1.35V to 1.5V. This IC has a grid array package style, 624 terminals, and is suitable for various uP and uC applications.
XCZU7EV-2FFVC1156I
The Xilinx XCZU7EV-2FFVC1156I is a CMOS microprocessor circuit with 1156 terminals in a grid array package. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. Ideal for industrial applications requiring high-performance processing capabilities.
XCZU7EV-L1FFVC1156I
XCZU7EV-L1FFVC1156I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in an industrial temperature range of -40 to 100 °C and has a max supply voltage of 0.742 V. This GRID ARRAY package with 1156 terminals is ideal for applications requiring high-performance processing capabilities.
MIMX8MN1CVTIZAA
SYSTEM ON CHIP; JESD-609 Code: e2; Terminal Finish: TIN SILVER; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
XCZU25DR-2FFVE1156E
The Xilinx XCZU25DR-2FFVE1156E is a programmable SoC with CMOS technology. It features 1156 terminals in a grid array package style, operating b/w 0 to 100°C. With a supply voltage range of 0.825V to 0.876V, it's ideal for various applications requiring high-performance processing capabilities.
TW8804-LC3-GRSH
Renesas Electronics
Other uPs/uCs/Peripheral ICs; JESD-609 Code: e3; Terminal Finish: MATTE TIN; Moisture Sensitivity Level (MSL): 3;
XC7Z045-2FBG676E
XC7Z045-2FBG676E by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.
CC1312R1F3RGZT
The Texas Instruments CC1312R1F3RGZT is a MICROPROCESSOR CIRCUIT with 81920 RAM Bytes. It operates b/w -40 to 85 °C and has a supply voltage range of 1.8V to 3.8V, making it ideal for industrial applications requiring low power consumption and high processing capabilities. The package style is CHIP CARRIER with 48 terminals in a SQUARE shape, suitable for surface mount assembly in compact electronic devices.
FT245RL-REEL
FTDI's FT245RL-REEL is a 28-terminal peripheral IC with CMOS technology. It operates b/w -40 to 85°C, suitable for industrial applications. With a supply voltage range of 3.3V to 5.25V, it is ideal for microprocessor circuits requiring small outline packages and dual terminal positions.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
XCVM1802-1MSEVSVD1760
XCVM1802-1MSEVSVD1760 by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.775-0.825 V. This GRID ARRAY IC is ideal for applications requiring high performance in a compact 40x40 mm package.
XCVM1402-1MSEVFVC1596
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
XCVM1802-2MSEVSVA2197
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; Maximum Supply Voltage: .825 V;
XCVM1102-1MLISFVB625
MICROPROCESSOR CIRCUIT;
XCVM1102-1MSISFVA784
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Technology: CMOS;
XCVM1802-1LSIVSVD1760
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Maximum Operating Temperature: 110 Cel;
XCVM1802-2LLIVSVA2197
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;
XCVM1802-2MLEVSVA2197
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; JESD-609 Code: e1;
XCVM1102-1HLESFVA784
MICROPROCESSOR CIRCUIT; Terminal Finish: TIN SILVER COPPER; JESD-609 Code: e1;
XCVM1102-1GLESFVA784
MICROPROCESSOR CIRCUIT; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER;
XCVM1102-1HLEVFVB1024
XCVM1102-1GSIVFVB1024
XCVM1102-1DSIVFVB1024
XCVM1102-1HLESFVB625
XCVM1102-1DLIVFVB1024
XCVM1102-1HLISFVA784
XCVM1102-1DLEVFVB1024
XCVM1102-1DSESFVA784
XCVM1102-1GLISFVA784
XCVM1102-1GLIVFVB1024
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