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V62/06676-01XE

Texas Instruments

V62/06676-01XE by Texas Instruments

V62/06676-01XE by Texas Instruments is a 26-bit latch with 5.5 ns propagation delay, suitable for industrial applications. It operates at a supply voltage of 2.3-2.7V and has a max temperature of 85°C. This CMOS technology device features positive edge trigger and true output polarity in a compact grid array package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,663 parts In-Stock

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3,663

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Digiode

USA . 3,398 parts In-Stock

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3,398

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Distributors (Availability)

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AZTECH Wire

Italy . 771 parts In-Stock

1+ parts

$4.885

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771

$4.885

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Parana Technologies

USA . 1,871 parts In-Stock

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$11.856

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$12.255

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1,871

$11.856

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$12.255

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ChromeModa Solutions

Germany . 1,900 parts In-Stock

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$13.321

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$10.923

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1,900

$13.321

$10.923

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IDEA Electronic Components Group

UK . 1,505 parts In-Stock

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$13.321

100+ parts

$12.655

1k+ parts

$11.989

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1,505

$13.321

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$11.989

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One Stop Electronics

USA . 354 parts In-Stock

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$58.000

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354

$58.000

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DigiPath Technology Company

USA . 1,896 parts In-Stock

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$12.010

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$12.010

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Corphita

USA . 1,881 parts In-Stock

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Overview

Unlock the power of innovation with the V62/06676-01XE by Texas Instruments, a cutting-edge latches & flip-flops device. Crafted with precision and expertise by a trusted manufacturer, this product offers unparalleled quality and reliability. Ideal for a wide range of applications, this versatile component provides seamless integration, fast response times, and superior performance. Elevate your projects with the value, benefits, and advantages that only Texas Instruments can deliver. Experience next-level technology like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensures the latch or flip-flop is resistant to damage and can withstand harsh environments.

Surface Mount: YES

Easily mountable on PCBs, saving space and making installation more convenient.

Package Shape: RECTANGULAR

Standard shape that fits well in most circuit designs and layouts.

Nominal Supply Voltage / Vsup (V): 2.5

Works efficiently at a common voltage level, ensuring compatibility with a wide range of systems.

Propagation Delay (tpd): 5.5 ns

Fast response time ensures quick switching and processing of signals.

Maximum Operating Temperature: 85 °C

Suitable for use in industrial settings where high temperatures may be present.

Trigger Type: POSITIVE EDGE

Specific trigger type for precise control and functionality in digital circuits.

Width: 5.5 mm

Compact size allows for efficient use of space on a circuit board.

Output Polarity: TRUE

Consistent output polarity ensures reliable performance in digital systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Technical Specifications

Latches & Flip-Flops V62/06676-01XE attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

SSTV

JESD-30 Code:

R-PBGA-B96

JESD-609 Code:

e0

Length:

13.5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Bits:

26

No. of Functions:

1

No. of Terminals:

96

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,6X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

2.5

Propagation Delay (tpd):

5.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Trigger Type:

POSITIVE EDGE

Width:

5.5 mm

Minimum fmax:

200 MHz

Trade Compliance

V62/06676-01XE Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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