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V62/04674-02YE

Texas Instruments

V62/04674-02YE by Texas Instruments

V62/04674-02YE by Texas Instruments is an 8-bit latch with a propagation delay of 4.9 ns and operates at a supply voltage of 3.3V. It is ideal for applications requiring fast response times, such as military-grade systems, with a max frequency of 150 MHz and operating temperature range from -55 to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,974 parts In-Stock

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3,974

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Component Sense

UK . 3,478 parts In-Stock

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3,478

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Digiode

USA . 2,104 parts In-Stock

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2,104

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 227 parts In-Stock

1+ parts

$16.185

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227

$16.185

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Parana Technologies

USA . 69 parts In-Stock

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$19.394

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$19.409

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69

$19.394

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$19.409

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DigiPath Technology Company

USA . 189 parts In-Stock

1+ parts

$21.355

100+ parts

$19.647

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189

$21.355

$19.647

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ChromeModa Solutions

Germany . 907 parts In-Stock

1+ parts

$21.791

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$17.869

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907

$21.791

$17.869

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IDEA Electronic Components Group

UK . 236 parts In-Stock

1+ parts

$21.791

100+ parts

$20.701

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$19.612

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236

$21.791

$20.701

$19.612

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One Stop Electronics

USA . 1,103 parts In-Stock

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$48.000

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1,103

$48.000

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Corphita

USA . 1,182 parts In-Stock

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Perfect Parts

USA . 190 parts In-Stock

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Overview

Enhance your electronic projects with the V62/04674-02YE by Texas Instruments, a top-tier producer of latches & flip-flops. This versatile component offers fast signal processing with a propagation delay of 4.9ns, ensuring seamless performance in various applications. With a compact design and high-quality materials, this product guarantees reliability and durability. Upgrade your circuits with Texas Instruments' innovation and experience enhanced functionality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for efficient performance.

Propagation Delay At Nominal Supply: 4.9 ns

Fast response time for quick operation.

Surface Mount: YES

Ease of installation on circuit boards.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with standard voltage requirements.

No. of Bits: 8

Sufficient number of bits for versatile use.

Trigger Type: POSITIVE EDGE

Precise triggering mechanism for accurate control.

Technology: BICMOS

Utilizes BiCMOS technology for high performance and efficiency.

Output Polarity: TRUE

Reliable output polarity ensures consistent operation.

Technical Specifications

Latches & Flip-Flops V62/04674-02YE attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

LVT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.6 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

150000000 Hz

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

5 mA

Propagation Delay At Nominal Supply:

4.9 ns

Propagation Delay (tpd):

7 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

5.3 mm

Minimum fmax:

150 MHz

Trade Compliance

V62/04674-02YE Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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