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V62/06605-01XE

Texas Instruments

V62/06605-01XE by Texas Instruments

V62/06605-01XE by Texas Instruments is a dual-function latch with 18ns propagation delay, suitable for military-grade applications. It operates at 2.5V nominal voltage and supports a max frequency of 45MHz. This CMOS technology flip-flop has a compact design with surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,785 parts In-Stock

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Digiode

USA . 4,064 parts In-Stock

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4,064

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Distributors (Availability)

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AZTECH Wire

Italy . 424 parts In-Stock

1+ parts

$12.113

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424

$12.113

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Parana Technologies

USA . 1,424 parts In-Stock

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$16.196

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$16.516

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1,424

$16.196

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$16.516

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DigiPath Technology Company

USA . 1,446 parts In-Stock

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$17.834

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1,446

$17.834

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IDEA Electronic Components Group

UK . 1,880 parts In-Stock

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$18.198

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$17.288

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$16.378

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1,880

$18.198

$17.288

$16.378

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ChromeModa Solutions

Germany . 1,583 parts In-Stock

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$18.198

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$14.922

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1,583

$18.198

$14.922

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One Stop Electronics

USA . 368 parts In-Stock

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$39.000

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368

$39.000

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Corphita

USA . 2,617 parts In-Stock

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Overview

Experience the exceptional quality and reliability of Texas Instruments with the V62/06605-01XE latches & flip-flops. This innovative product offers customers unparalleled performance and versatility for a wide range of applications. With a package body material of PLASTIC/EPOXY, surface mount capability, and dual terminal position, this product delivers value and benefits that exceed expectations. Trust Texas Instruments to provide top-of-the-line technology designed to enhance your projects and exceed your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection to the internal components of the latch/flip-flop, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 18 ns

With a low propagation delay, this latch/flip-flop offers fast switching speeds, making it suitable for high-speed applications where quick response times are vital.

Surface Mount: YES

Being surface mountable simplifies the installation process and saves valuable PCB space, making this latch/flip-flop a convenient choice for compact electronic designs.

No. of Functions: 2

Having multiple functions within a single device increases functionality and efficiency, allowing for more complex operations to be performed within the same component.

Nominal Supply Voltage / Vsup (V): 2.5

The low nominal supply voltage of 2.5V makes this latch/flip-flop energy-efficient and suitable for low-power applications, helping to conserve battery life.

Maximum I (ol): 12 Amp

The high maximum output current of 12A allows this latch/flip-flop to drive heavy loads without any issues, making it ideal for applications requiring high power handling capabilities.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures that the latch/flip-flop operates reliably and accurately, triggering on the rising edge of the input signal for precise timing control.

Technology: CMOS

Utilizing CMOS technology results in lower power consumption, higher noise immunity, and faster operation speeds, making this latch/flip-flop a reliable and efficient choice for various applications.

Technical Specifications

Latches & Flip-Flops V62/06605-01XE attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

45000000 Hz

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

18 ns

Propagation Delay (tpd):

23 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Minimum fmax:

75 MHz

Trade Compliance

V62/06605-01XE Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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