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V62/08602-01XA

Texas Instruments

V62/08602-01XA by Texas Instruments

V62/08602-01XA by Texas Instruments is a TTL technology latch with 114 terminals in a low profile grid array package. It operates at 2.5V, has a propagation delay of 3.1ns, and supports a max frequency of 200MHz. Ideal for industrial applications requiring positive edge triggering and true output polarity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,314 parts In-Stock

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8,314

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Digiode

USA . 604 parts In-Stock

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604

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 579 parts In-Stock

1+ parts

$9.000

100+ parts

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579

$9.000

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AZTECH Wire

Italy . 817 parts In-Stock

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$17.221

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817

$17.221

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Parana Technologies

USA . 776 parts In-Stock

1+ parts

$20.053

100+ parts

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$19.984

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776

$20.053

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$19.984

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DigiPath Technology Company

USA . 871 parts In-Stock

1+ parts

$22.081

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871

$22.081

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IDEA Electronic Components Group

UK . 1,692 parts In-Stock

1+ parts

$22.532

100+ parts

$21.405

1k+ parts

$20.279

10k+ parts

-

1,692

$22.532

$21.405

$20.279

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ChromeModa Solutions

Germany . 825 parts In-Stock

1+ parts

$22.532

100+ parts

$18.476

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825

$22.532

$18.476

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Corphita

USA . 2,320 parts In-Stock

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2,320

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Microchip USA

USA . 380 parts In-Stock

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380

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Overview

Elevate your electronics projects with the V62/08602-01XA by Texas Instruments, a high-quality latch and flip-flop component that brings reliability and precision to your designs. Manufactured by the renowned Texas Instruments, this product offers exceptional performance in various applications within the industry. With its advanced technology and industrial-grade temperature grade, this component ensures stable operation and efficient signal processing. Experience the advantages of this product's low profile package and fine pitch design, providing ease of installation and space-saving solutions. Upgrade your projects today with the V62/08602-01XA and unlock a world of possibilities in electronics innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures the product is long-lasting and easy to handle.

Surface Mount: YES

Ease of installation and compatibility with modern PCB designs.

Nominal Supply Voltage / Vsup (V): 2.5

Optimal voltage for stable and efficient operation of the product.

Propagation Delay (tpd): 3.1 ns

Fast response time ensuring quick switching and processing of signals.

Maximum Operating Temperature: 85 °C

Suitable for a wide range of industrial applications with high-temperature requirements.

Trigger Type: POSITIVE EDGE

Precise triggering mechanism for accurate signal processing.

Technology: TTL

Reliable and proven technology for digital signal processing.

Technical Specifications

Latches & Flip-Flops V62/08602-01XA attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

SSTV

JESD-30 Code:

R-PBGA-B114

JESD-609 Code:

e0

Length:

15.5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

114

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA114,6X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

2.5

Propagation Delay (tpd):

3.1 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Trigger Type:

POSITIVE EDGE

Width:

5.5 mm

Minimum fmax:

200 MHz

Trade Compliance

V62/08602-01XA Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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