Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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V62/04669-02XE by Texas Instruments is a dual-function latches & flip-flops with 5.2ns propagation delay at 3.3V, suitable for military-grade applications. It features a small outline package style, 100MHz max frequency, and operates b/w -55 to 125°C temperature range.
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Corphita
This material provides durability and protection for the internal components of the latch, ensuring long-lasting performance.
Low propagation delay ensures quick response time, making this latch suitable for high-speed applications.
Allows for easy and secure mounting on PCBs, saving space and facilitating automated assembly processes.
Having multiple functions in one device can simplify circuit design and reduce component count, saving costs and board space.
Rectangular shape allows for efficient use of board space and easy integration into existing designs.
Operates at a common supply voltage, making it compatible with a wide range of systems and power sources.
Designed to work effectively with typical load capacitances, ensuring reliable performance in various circuit configurations.
Works efficiently within standard power supply ranges, making it versatile for different applications.
Sufficient terminals for connections and functionality, enabling complex circuit designs and custom configurations.
Compact size saves board space and allows for denser layouts, suitable for compact electronic devices.
High output current capability enables driving of heavy loads or multiple devices, expanding application possibilities.
Low propagation delay ensures fast response time, critical for time-sensitive applications or signal processing.
Wide operating temperature range ensures reliable performance in varying environmental conditions.
Positive edge triggering allows for precise control and synchronization of the latch with other components in the system.
Withstands low temperatures, suitable for applications in harsh environments or outdoor settings.
High-quality finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.
Dual terminal position offers flexibility in layout and connection options, accommodating different PCB designs.
Low profile design saves vertical space and allows for compact device assemblies.
Narrow width facilitates tight PCB layouts and integration into constrained spaces or small form factor devices.
Complementary output signals simplify interfacing with other digital components, enhancing compatibility and ease of use.
Operates at low supply voltage, ideal for energy-efficient applications or battery-powered devices.
Withstands reflow soldering process without damage, ensuring reliable manufacturing and assembly.
High reflow temperature tolerance allows for lead-free soldering processes, meeting modern manufacturing standards.
Optimal length for fitting into standard PCB layouts and enclosures, offering compatibility with industry-standard dimensions.
Military-grade components meet stringent reliability and performance standards, suitable for demanding applications in harsh environments.
High-frequency capability allows for quick data processing and synchronization in advanced digital systems.
CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of digital systems.
Gull wing terminals simplify soldering and ensure secure connections during assembly, reducing the risk of disconnection or short circuits.
Tape and reel packaging facilitates automated assembly processes, reducing manual handling and improving production efficiency.
Standard terminal pitch allows for easy integration into standard PCB designs and compatibility with common connector types.
High maximum frequency ensures reliable operation in high-speed digital circuits and applications requiring fast signal processing.
Wide supply voltage range accommodates different power sources and voltage levels, increasing versatility in system integration.
Low power supply current consumption minimizes energy usage and heat dissipation, ideal for battery-operated devices or energy-efficient designs.
Latches & Flip-Flops V62/04669-02XE attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments
Family:
JESD-30 Code:
JESD-609 Code:
Length:
Load Capacitance (CL):
Logic IC Type:
Maximum Frequency At Nominal Supply:
Maximum I (ol):
Moisture Sensitivity Level (MSL):
No. of Bits:
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Output Polarity:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Packing Method:
Peak Reflow Temperature (C):
Power Supplies (V):
Maximum Power Supply Current (ICC):
Propagation Delay At Nominal Supply:
Propagation Delay (tpd):
Qualification:
Maximum Seated Height:
Sub-Category:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Trigger Type:
Width:
Minimum fmax:
V62/04669-02XE Logic ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Mult Devices Font 21/Apr/2018
PCN Assembly/Origin - Assembly Materials 17/Dec/2021
PCN Packaging - Reels 19/Apr/2018 Reel 10/Jul/2018
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
ULN-2803A
Vishay Sprague
Vishay Sprague's ULN-2803A is an 8-bit peripheral driver with a max supply voltage of 3V. Featuring open-collector output characteristics, it offers built-in transient protections and operates b/w -20°C to 85°C. Ideal for applications requiring sink current flow direction, this rectangular-shaped driver has a terminal pitch of 2.54mm and turn-on/off time of 1us.
2N2222A
International Devices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148
Vishay Telefunken
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SS14
Forward International Electronics
RECTIFIER DIODE; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; No. of Elements: 1; No. of Phases: 1; Maximum Output Current: 1 A;
BAV99
Silicon Standard
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
STM32H753BIT6
STMicroelectronics
STM32H753BIT6 by STMicroelectronics is a 32-bit microcontroller with 208 terminals, operating at up to 48 MHz. It features 20-Ch 16-Bit ADCs, 2-Ch 12-Bit DACs, and extensive peripherals for industrial applications like CAN, Ethernet, and USB connectivity. With a wide temperature range of -40 to +85 °C, it's ideal for demanding environments requiring high-speed processing capabilities.
FDD5614P
Onsemi
FDD5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 45A IDM and 0.1 ohm RDS(ON), operating in ENHANCEMENT MODE at up to 175°C. The PLASTIC/EPOXY package with GULL WING terminals ensures efficient heat dissipation and reliable performance.
CGA3E2X7R1H104K080AA
TDK
CGA3E2X7R1H104K080AA by TDK is a fixed ceramic capacitor with a capacitance of 0.1 uF and a rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate at temperatures ranging from -55 to 125 °C. This capacitor is commonly used in surface mount applications for various electronic devices.
LL4148
Kec
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Surface Mount: NO; Config: SINGLE; Peak Reflow Temperature (C): 260; No. of Phases: 1; Diode Element Material: SILICON;
Bytesonic Electronics
Gec Plessey Semiconductors
Leshan Radio
RECTIFIER DIODE; Surface Mount: YES; Config: SINGLE; No. of Phases: 1; No. of Elements: 1; Maximum Forward Voltage (VF): .5 V;
CRGCQ0805F10K
TE Connectivity
TE Connectivity's CRGCQ0805F10K is a 10000 ohm fixed resistor with 1% tolerance. It operates b/w -55 to 155 °C and has a power dissipation of 0.125 W. Ideal for surface mount applications in automotive electronics due to AEC-Q200 standard compliance.
New Jersey Semiconductor Products
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Package Shape: ROUND;
SMBJ18CA
Vishay Semiconductors
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ISO1050DUBR
Texas Instruments
ISO1050DUBR by Texas Instruments is a network interface IC with 8 terminals, operating from -55 to 105°C. It features a small outline package, nickel palladium gold finish, and gull wing terminal form. Ideal for telecom applications requiring a 5V supply voltage and peak reflow temperature of 260°C.
2N7002
Formosa Microsemi
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Maximum Drain Current (Abs) (ID): .115 A;
Semitronics
74LVC1G74DP
NXP Semiconductors
NXP Semiconductors' 74LVC1G74DP is a latch with 5.9ns propagation delay, operating at 1.8V and 3.3V supplies. It features positive edge trigger, complementary output polarity, and supports up to 175MHz frequency. Ideal for automotive applications due to its small form factor and wide temperature range from -40°C to 125°C.
CD4013BCN
Rochester Electronics
D FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;
MC100EP451FAR2
MC100EP451FAR2 by Onsemi is a 6-bit ECL latch with 0.55 ns propagation delay. Operating at -40 to 85 °C, it has a max frequency of 3 GHz and supports Vsup from 3V to 5.5V. Ideal for industrial applications requiring fast positive edge triggering in a compact square package.
SN74LVC74AD
SN74LVC74AD by Texas Instruments is a dual-function latch with 5.2 ns propagation delay, ideal for automotive applications. Operating at 1.8V to 3.6V, it has a max frequency of 150MHz and low power supply current of 0.01mA. With positive edge trigger type, this CMOS technology device is surface mountable in small outline package style.
54F174DMQB
National Semiconductor
D FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
MM74HC74AM
D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
74AC74SC
74AC74SC by National Semiconductor is a dual latches & flip-flops IC with 14 terminals. It operates at supply voltages of 3.3V/5V, has a propagation delay of 14.5ns, and can handle load capacitance up to 50pF. This CMOS technology device is ideal for industrial applications requiring positive edge triggering and high-frequency operation up to 95MHz.
NC7SZ175P6
Fairchild Semiconductor
D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
MC14013BDG
MC14013BDG by Onsemi is a CMOS latch/flip-flop with 2 functions, operating at 5V. It has a propagation delay of 350ns and can handle load capacitance of 50pF. Ideal for military-grade applications due to its wide temperature range and small outline package style.
74LCX112M
J-K FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
HD74LS76AP
Renesas Electronics
The Renesas Electronics HD74LS76AP is a TTL latch with 2 functions, 20 ns propagation delay, and 5V nominal voltage. Ideal for applications requiring negative edge triggering, such as digital circuits in commercial extended temperature environments. Package style: IN-LINE, dimensions: 19.2mm x 7.62mm x 5.06mm (LxWxH).
SN74HCT273NSRE4
SN74HCT273NSRE4 by Texas Instruments is an 8-bit latch with a 5V supply voltage, 42ns propagation delay, and 20 terminals. It is used in industrial applications requiring positive edge triggering and operates b/w -40 to 85°C. This CMOS technology flip-flop has a max frequency of 20MHz and comes in a small outline package for surface mounting.
MC10EP51DTG
MC10EP51DTG by Onsemi is a latches & flip-flops IC with 0.37 ns propagation delay, 3.3V nominal voltage, and 3000000000 Hz max frequency. Ideal for industrial applications requiring positive edge trigger type, it operates b/w -40 to 85 °C with a compact square package design for surface mount assembly.
SN74HCT74N
D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;
74LV74PW-Q100J
Nexperia
D FLIP-FLOP; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: TSSOP; Package Shape: RECTANGULAR;
MM74HC74AM by Onsemi is a dual-function latches & flip-flops IC with 14 terminals. It operates at a nominal voltage of 4.5V and has a load capacitance of 50pF. With a max frequency of 24MHz, it is ideal for industrial applications requiring positive edge triggering and complementary output polarity.
TC7WZ74FK,LJ(CT
Toshiba
Toshiba's TC7WZ74FK,LJ(CT is a CMOS latch with 8 terminals, operating at -40 to 125°C. It has a propagation delay of 26ns and supports a supply voltage range of 1.65V to 5.5V, making it ideal for automotive applications requiring fast trigger response and low power consumption.
74AHC74PW,118
NXP Semiconductors' 74AHC74PW,118 is a dual-function latch with 12ns propagation delay and 19.5ns tpd. Ideal for automotive applications, it operates at -40 to 125°C, has a max frequency of 75MHz, and supports Vsup from 2-5.5V.
CD4043BE
R-S LATCH; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
SN74HC273QPWRQ1
SN74HC273QPWRQ1 by Texas Instruments is an 8-bit latch with a propagation delay of 48ns, operating at a supply voltage range of 2-6V. It is designed for automotive applications, featuring positive edge triggering and a max frequency of 18MHz. This CMOS technology flip-flop has a compact rectangular package style suitable for surface mount assembly.
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TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
V62/08613-01XE
D FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: TSSOP; Package Shape: RECTANGULAR;
V62/04674-02XE
D FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;
V62/04617-01XE
D FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
V62/06676-01XE
D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 96; Package Code: LFBGA; Package Shape: RECTANGULAR;
V62/04725-01XE
V62/04669-02YE
V62/08617-01XE
D FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: VSSOP; Package Shape: RECTANGULAR;
V62/03652-01YE
V62/04674-02YE
V62/04669-01XE
D FLIP-FLOP; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
V62/06633-01XE
D FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
V62/05621-01XE
D FLIP-FLOP; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 5; Package Code: TSSOP; Package Shape: RECTANGULAR;
V62/08602-01XA
D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 114; Package Code: LFBGA; Package Shape: RECTANGULAR;
V62/03659-01YE
V62/04674-01XE
D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR;
V62/03652-01XE
V62/03659-01XE
V62/04669-01YE
V62/06605-01XE
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