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V62/04669-02XE

Texas Instruments

V62/04669-02XE by Texas Instruments

V62/04669-02XE by Texas Instruments is a dual-function latches & flip-flops with 5.2ns propagation delay at 3.3V, suitable for military-grade applications. It features a small outline package style, 100MHz max frequency, and operates b/w -55 to 125°C temperature range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,838 parts In-Stock

1+ parts

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8,838

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Digiode

USA . 3,188 parts In-Stock

1+ parts

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3,188

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,595 parts In-Stock

1+ parts

$7.000

100+ parts

-

1k+ parts

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1,595

$7.000

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AZTECH Wire

Italy . 337 parts In-Stock

1+ parts

$13.534

100+ parts

-

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337

$13.534

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Parana Technologies

USA . 2,098 parts In-Stock

1+ parts

$16.696

100+ parts

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1k+ parts

$16.956

10k+ parts

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2,098

$16.696

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$16.956

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DigiPath Technology Company

USA . 227 parts In-Stock

1+ parts

$18.384

100+ parts

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227

$18.384

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ChromeModa Solutions

Germany . 561 parts In-Stock

1+ parts

$18.759

100+ parts

$15.382

1k+ parts

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10k+ parts

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561

$18.759

$15.382

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IDEA Electronic Components Group

UK . 48 parts In-Stock

1+ parts

$18.759

100+ parts

$17.821

1k+ parts

$16.883

10k+ parts

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48

$18.759

$17.821

$16.883

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Corphita

USA . 4,090 parts In-Stock

1+ parts

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4,090

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Overview

Experience unmatched quality and reliability with the V62/04669-02XE by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments sets the standard for excellence. This latches & flip-flops device offers fast propagation delay, low power consumption, and a wide operating temperature range, making it ideal for a variety of applications. With its small outline package style and dual terminals, this product provides customers with easy integration and high performance. Trust Texas Instruments to deliver top-notch solutions for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the latch, ensuring long-lasting performance.

Propagation Delay At Nominal Supply: 5.2 ns

Low propagation delay ensures quick response time, making this latch suitable for high-speed applications.

Surface Mount: YES

Allows for easy and secure mounting on PCBs, saving space and facilitating automated assembly processes.

No. of Functions: 2

Having multiple functions in one device can simplify circuit design and reduce component count, saving costs and board space.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of board space and easy integration into existing designs.

Nominal Supply Voltage / Vsup (V): 2.7

Operates at a common supply voltage, making it compatible with a wide range of systems and power sources.

Load Capacitance (CL): 50 pF

Designed to work effectively with typical load capacitances, ensuring reliable performance in various circuit configurations.

Power Supplies (V): 3.3

Works efficiently within standard power supply ranges, making it versatile for different applications.

No. of Terminals: 14

Sufficient terminals for connections and functionality, enabling complex circuit designs and custom configurations.

Package Style (Meter): SMALL OUTLINE

Compact size saves board space and allows for denser layouts, suitable for compact electronic devices.

Maximum I (ol): 24 Amp

High output current capability enables driving of heavy loads or multiple devices, expanding application possibilities.

Propagation Delay (tpd): 6 ns

Low propagation delay ensures fast response time, critical for time-sensitive applications or signal processing.

Maximum Operating Temperature: 125 °C

Wide operating temperature range ensures reliable performance in varying environmental conditions.

Trigger Type: POSITIVE EDGE

Positive edge triggering allows for precise control and synchronization of the latch with other components in the system.

Minimum Operating Temperature: -55 °C

Withstands low temperatures, suitable for applications in harsh environments or outdoor settings.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal position offers flexibility in layout and connection options, accommodating different PCB designs.

Maximum Seated Height: 1.75 mm

Low profile design saves vertical space and allows for compact device assemblies.

Width: 3.9 mm

Narrow width facilitates tight PCB layouts and integration into constrained spaces or small form factor devices.

Output Polarity: COMPLEMENTARY

Complementary output signals simplify interfacing with other digital components, enhancing compatibility and ease of use.

Minimum Supply Voltage (Vsup): 2 V

Operates at low supply voltage, ideal for energy-efficient applications or battery-powered devices.

Maximum Time At Peak Reflow Temperature (s): 30

Withstands reflow soldering process without damage, ensuring reliable manufacturing and assembly.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance allows for lead-free soldering processes, meeting modern manufacturing standards.

Length: 8.65 mm

Optimal length for fitting into standard PCB layouts and enclosures, offering compatibility with industry-standard dimensions.

Temperature Grade: MILITARY

Military-grade components meet stringent reliability and performance standards, suitable for demanding applications in harsh environments.

Maximum Frequency At Nominal Supply: 100000000 Hz

High-frequency capability allows for quick data processing and synchronization in advanced digital systems.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Terminal Form: GULL WING

Gull wing terminals simplify soldering and ensure secure connections during assembly, reducing the risk of disconnection or short circuits.

Packing Method: TR

Tape and reel packaging facilitates automated assembly processes, reducing manual handling and improving production efficiency.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for easy integration into standard PCB designs and compatibility with common connector types.

Minimum fmax: 100 MHz

High maximum frequency ensures reliable operation in high-speed digital circuits and applications requiring fast signal processing.

Maximum Supply Voltage (Vsup): 3.6 V

Wide supply voltage range accommodates different power sources and voltage levels, increasing versatility in system integration.

Maximum Power Supply Current (ICC): 0.01 mA

Low power supply current consumption minimizes energy usage and heat dissipation, ideal for battery-operated devices or energy-efficient designs.

Technical Specifications

Latches & Flip-Flops V62/04669-02XE attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

100000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

5.2 ns

Propagation Delay (tpd):

6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

100 MHz

Trade Compliance

V62/04669-02XE Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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