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V62/04669-01XE

Texas Instruments

V62/04669-01XE by Texas Instruments

V62/04669-01XE by Texas Instruments is a CMOS latch with 2 functions, 5.2 ns propagation delay, and 100 MHz max frequency. Ideal for automotive applications, it operates b/w -40 to 125 °C with a supply voltage range of 2-3.6V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,560 parts In-Stock

1+ parts

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7,560

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Digiode

USA . 4,286 parts In-Stock

1+ parts

-

100+ parts

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4,286

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,524 parts In-Stock

1+ parts

$13.620

100+ parts

-

1k+ parts

$14.118

10k+ parts

-

1,524

$13.620

-

$14.118

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ChromeModa Solutions

Germany . 392 parts In-Stock

1+ parts

$15.303

100+ parts

$12.548

1k+ parts

-

10k+ parts

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392

$15.303

$12.548

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IDEA Electronic Components Group

UK . 101 parts In-Stock

1+ parts

$15.303

100+ parts

$14.538

1k+ parts

$13.773

10k+ parts

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101

$15.303

$14.538

$13.773

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AZTECH Wire

Italy . 414 parts In-Stock

1+ parts

$16.474

100+ parts

-

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414

$16.474

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One Stop Electronics

USA . 697 parts In-Stock

1+ parts

$53.000

100+ parts

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697

$53.000

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DigiPath Technology Company

USA . 1,873 parts In-Stock

1+ parts

-

100+ parts

$13.797

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10k+ parts

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1,873

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$13.797

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Corphita

USA . 275 parts In-Stock

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275

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Overview

Enhance your electronic projects with the V62/04669-01XE by Texas Instruments, a high-quality latches & flip-flops component designed to deliver exceptional performance. With a focus on reliability and precision, Texas Instruments ensures that this product meets the highest standards in the industry. Ideal for a wide range of applications, this versatile component offers fast propagation delay and low power consumption, making it a valuable addition to your projects. Trust in Texas Instruments for cutting-edge technology that will elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the latch or flip-flop easy to handle and install.

Propagation Delay At Nominal Supply: 5.2 ns

Fast propagation delay ensures quick response times, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on a PCB, saving space and improving overall circuit design.

Nominal Supply Voltage / Vsup (V): 2.7

The low supply voltage requirement can help conserve power, making this latch or flip-flop energy-efficient.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, making it suitable for automotive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this latch or flip-flop reliable and efficient in operation.

Technical Specifications

Latches & Flip-Flops V62/04669-01XE attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

100000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

5.2 ns

Propagation Delay (tpd):

6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

100 MHz

Trade Compliance

V62/04669-01XE Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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