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V62/03652-01YE

Texas Instruments

V62/03652-01YE by Texas Instruments

V62/03652-01YE by Texas Instruments is a dual-function latch & flip-flop with 17.5 ns propagation delay at 3.3V, suitable for military-grade applications. It features a small outline package with 14 terminals, Gull Wing terminal form, and operates at temperatures ranging from -55 to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,816 parts In-Stock

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2,816

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Digiode

USA . 1,557 parts In-Stock

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1,557

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 247 parts In-Stock

1+ parts

$8.141

100+ parts

-

1k+ parts

$8.739

10k+ parts

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247

$8.141

-

$8.739

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DigiPath Technology Company

USA . 1,167 parts In-Stock

1+ parts

$8.964

100+ parts

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1,167

$8.964

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ChromeModa Solutions

Germany . 5,998 parts In-Stock

1+ parts

$9.147

100+ parts

$7.501

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5,998

$9.147

$7.501

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IDEA Electronic Components Group

UK . 634 parts In-Stock

1+ parts

$9.147

100+ parts

$8.690

1k+ parts

$8.232

10k+ parts

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634

$9.147

$8.690

$8.232

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AZTECH Wire

Italy . 523 parts In-Stock

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$12.902

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523

$12.902

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One Stop Electronics

USA . 761 parts In-Stock

1+ parts

$46.000

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761

$46.000

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Corphita

USA . 3,617 parts In-Stock

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Overview

Elevate your electronic designs with the V62/03652-01YE by Texas Instruments, a top-of-the-line latches and flip-flops component. Crafted with precision using high-quality materials, this product offers unparalleled performance and reliability. Ideal for a wide range of applications, this versatile component provides seamless operation and efficiency. Experience the value of Texas Instruments' expertise in every circuit, as this product delivers exceptional benefits and advantages to meet all your design needs. Upgrade your projects today with the V62/03652-01YE and unlock endless possibilities in electronic innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and reliability for long-term use.

Propagation Delay At Nominal Supply: 17.5 ns

Fast propagation delay ensures quick response times, making it suitable for high-speed applications.

Surface Mount: YES

Ease of installation and space-saving design due to surface mount capability.

No. of Functions: 2

Provides dual functions in a single component, saving space and complexity in circuit design.

Nominal Supply Voltage / Vsup (V): 3.3

Operates efficiently at a standard voltage, suitable for many electronic systems.

Output Polarity: COMPLEMENTARY

Complementary outputs provide both true and inverted signals, offering versatility in signal processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for battery-operated devices and signal integrity.

Maximum Frequency At Nominal Supply: 75000000 Hz

High operating frequency capability allows for reliable performance in high-speed digital circuits.

Technical Specifications

Latches & Flip-Flops V62/03652-01YE attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

75000000 Hz

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

17.5 ns

Propagation Delay (tpd):

17.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

110 MHz

Trade Compliance

V62/03652-01YE Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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