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ULN2003ANS

Texas Instruments

ULN2003ANS by Texas Instruments

NPN; Configuration: COMPLEX; Surface Mount: YES; Additional Features: LOGIC LEVEL COMPATIBLE; Maximum Collector-Emitter Voltage: 50 V; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;

Median Price

$1.123

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 14,591 parts In-Stock

1+ parts

$0.956

100+ parts

$0.735

1k+ parts

$0.387

10k+ parts

$0.387

14,591

$0.956

$0.735

$0.387

$0.387

DigiKey

USA . 13,045 parts In-Stock

1+ parts

$1.290

100+ parts

$0.899

1k+ parts

$0.586

10k+ parts

$0.520

13,045

$1.290

$0.899

$0.586

$0.520

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 36 parts In-Stock

1+ parts

$0.489

100+ parts

-

1k+ parts

-

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36

$0.489

-

-

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Corphita

USA . 385 parts In-Stock

1+ parts

-

100+ parts

-

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385

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LWI Electronics Inc

India . 27 parts In-Stock

1+ parts

-

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27

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,118 parts In-Stock

1+ parts

$0.326

100+ parts

-

1k+ parts

$1.557

10k+ parts

-

2,118

$0.326

-

$1.557

-

Corohmni

South Africa . 178 parts In-Stock

1+ parts

$0.330

100+ parts

-

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178

$0.330

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-

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Semicontronic

India . 64 parts In-Stock

1+ parts

$0.330

100+ parts

-

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64

$0.330

-

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DigiPath Technology Company

USA . 1,832 parts In-Stock

1+ parts

$0.359

100+ parts

$0.330

1k+ parts

-

10k+ parts

-

1,832

$0.359

$0.330

-

-

ChromeModa Solutions

Germany . 6,335 parts In-Stock

1+ parts

$0.366

100+ parts

$0.300

1k+ parts

-

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6,335

$0.366

$0.300

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IDEA Electronic Components Group

UK . 828 parts In-Stock

1+ parts

$0.366

100+ parts

-

1k+ parts

$0.329

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828

$0.366

-

$0.329

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Continental Prestige Electronics

USA . 4,113 parts In-Stock

1+ parts

$0.377

100+ parts

-

1k+ parts

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10k+ parts

$0.369

4,113

$0.377

-

-

$0.369

Argo Parts USA

USA . 938 parts In-Stock

1+ parts

$0.377

100+ parts

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1k+ parts

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$0.366

938

$0.377

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-

$0.366

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.499

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2,000

$0.499

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Ampacity Inc.

Singapore . 4,000 parts In-Stock

1+ parts

$0.698

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4,000

$0.698

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Abianca Electronics

United Arab Emirates . 15 parts In-Stock

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$1.170

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15

$1.170

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One Stop Electronics

USA . 2,841 parts In-Stock

1+ parts

$4.738

100+ parts

$4.311

1k+ parts

$4.216

10k+ parts

$4.216

2,841

$4.738

$4.311

$4.216

$4.216

Euler Denison

Australia . 953 parts In-Stock

1+ parts

$6.645

100+ parts

-

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$4.816

953

$6.645

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-

$4.816

QUARKTWIN TECHNOLOGY LTD

USA . 28,199 parts In-Stock

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28,199

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Lixinc

USA . 6,100 parts In-Stock

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6,100

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Metaverse IC Inc.

Canada . 4,946 parts In-Stock

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4,946

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Microchip USA

USA . 1,031 parts In-Stock

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1,031

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-

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Decca Corp

Germany . 500 parts In-Stock

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500

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Robosynatics

Brazil . 100 parts In-Stock

1+ parts

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100

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Kepictronics

USA . 90 parts In-Stock

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90

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-

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) ULN2003ANS attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Texas Instruments

Package Body Material:

PLASTIC/EPOXY

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Configuration:

Transistor Element Material:

SILICON

Transistor Application:

SWITCHING

Polarity or Channel Type:

NPN

Surface Mount:

YES

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

JESD-609 Code:

e4

No. of Terminals:

16

Qualification:

Not Qualified

Maximum Collector-Emitter Voltage:

50 V

Terminal Position:

DUAL

Package Style (Meter):

SMALL OUTLINE

JESD-30 Code:

R-PDSO-G16

No. of Elements:

7

Package Shape:

RECTANGULAR

Terminal Form:

GULL WING

Additional Features:

LOGIC LEVEL COMPATIBLE

Peak Reflow Temperature (C):

260

Moisture Sensitivity Level (MSL):

1

Trade Compliance

ULN2003ANS Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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