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ULN2003AIPW

Texas Instruments

ULN2003AIPW by Texas Instruments

ULN2003AIPW by Texas Instruments is a NPN BJT with 7 elements, max IC of 0.5A, and VCE of 50V. Ideal for switching applications, it comes in a small outline package with Gull Wing terminals for surface mount assembly.

Median Price

$1.406

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 5 parts In-Stock

1+ parts

$1.150

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-

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5

$1.150

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Mouser Electronics

USA . 28,822 parts In-Stock

1+ parts

$1.260

100+ parts

$0.806

1k+ parts

$0.701

10k+ parts

$0.585

28,822

$1.260

$0.806

$0.701

$0.585

Farnell

UK . 2 parts In-Stock

1+ parts

$1.553

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-

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2

$1.553

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Element14

Singapore . 2 parts In-Stock

1+ parts

$2.784

100+ parts

$1.813

1k+ parts

$1.479

10k+ parts

$1.419

2

$2.784

$1.813

$1.479

$1.419

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 39 parts In-Stock

1+ parts

$0.599

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-

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39

$0.599

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Digiode

USA . 86 parts In-Stock

1+ parts

$1.197

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86

$1.197

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Chip Stock

USA . 23,500 parts In-Stock

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23,500

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Vyrian

USA . 7,092 parts In-Stock

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Cyclops Electronics Ltd

UK . 48 parts In-Stock

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48

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Distributors (Availability)

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Argo Parts USA

USA . 2,317 parts In-Stock

1+ parts

$0.456

100+ parts

-

1k+ parts

-

10k+ parts

$0.443

2,317

$0.456

-

-

$0.443

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.599

100+ parts

-

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1,000

$0.599

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Corohmni

South Africa . 73 parts In-Stock

1+ parts

$0.606

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73

$0.606

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Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$0.624

100+ parts

$0.593

1k+ parts

$0.593

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100

$0.624

$0.593

$0.593

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Modulus Dynamics

Lithuania . 650 parts In-Stock

1+ parts

$0.665

100+ parts

$0.659

1k+ parts

$0.639

10k+ parts

-

650

$0.665

$0.659

$0.639

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Parana Technologies

USA . 194 parts In-Stock

1+ parts

$0.721

100+ parts

-

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$1.744

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194

$0.721

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$1.744

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DigiPath Technology Company

USA . 557 parts In-Stock

1+ parts

$0.794

100+ parts

$0.730

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557

$0.794

$0.730

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ChromeModa Solutions

Germany . 2,405 parts In-Stock

1+ parts

$0.810

100+ parts

$0.664

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2,405

$0.810

$0.664

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IDEA Electronic Components Group

UK . 867 parts In-Stock

1+ parts

$0.810

100+ parts

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1k+ parts

$0.729

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867

$0.810

-

$0.729

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Semicontronic

India . 6,982 parts In-Stock

1+ parts

$0.940

100+ parts

$0.916

1k+ parts

$0.912

10k+ parts

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6,982

$0.940

$0.916

$0.912

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Corphita

USA . 242 parts In-Stock

1+ parts

$1.134

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242

$1.134

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Ampacity Inc.

Singapore . 7,165 parts In-Stock

1+ parts

$2.050

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7,165

$2.050

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Continental Prestige Electronics

USA . 27 parts In-Stock

1+ parts

$2.140

100+ parts

$1.280

1k+ parts

$1.090

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-

27

$2.140

$1.280

$1.090

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Microchip USA

USA . 2,797 parts In-Stock

1+ parts

$14.970

100+ parts

$14.880

1k+ parts

$14.840

10k+ parts

$14.790

2,797

$14.970

$14.880

$14.840

$14.790

Perfect Parts

USA . 27,198 parts In-Stock

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Lixinc

USA . 11,810 parts In-Stock

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11,810

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Kepictronics

USA . 200 parts In-Stock

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200

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Robosynatics

Brazil . 30 parts In-Stock

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30

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Lucentia Tech

USA . 30 parts In-Stock

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30

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Overview

Experience the ultimate in performance and reliability with the Texas Instruments ULN2003AIPW. As a trusted leader in semiconductor technology, Texas Instruments delivers top-quality products that are ideal for a wide range of applications. The ULN2003AIPW is perfect for switching applications, offering seamless operation and unmatched efficiency. With its small outline package and dual terminal position, this transistor provides convenience and ease of use. Trust Texas Instruments to provide you with the cutting-edge technology you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures a lightweight and durable package, making it suitable for various applications.

Polarity or Channel Type: NPN

NPN polarity allows for easier interfacing with other components in typical electronic circuits.

Transistor Application: SWITCHING

Being designed for switching applications, this transistor can efficiently control the flow of current in electronic devices.

Surface Mount: YES

The surface mount feature simplifies the assembly process and offers space-saving advantages for compact electronic designs.

Maximum Collector-Emitter Voltage: 50 V

With a high maximum voltage rating, this transistor can handle a wide range of voltage levels, making it versatile for different circuit requirements.

Maximum Collector Current (IC): 0.5 A

The high maximum collector current rating allows the transistor to handle moderate to high current levels, suitable for various applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections and longevity of the transistor.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) ULN2003AIPW attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Texas Instruments

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

50 V

Configuration:

JEDEC-95 Code:

MO-153AB

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

7

No. of Terminals:

16

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

ULN2003AIPW Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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