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MMBT3906TT1G

Onsemi

MMBT3906TT1G by Onsemi

MMBT3906TT1G by Onsemi is a PNP small signal BJT transistor with a max collector-emitter voltage of 40V. It has a min DC current gain of 30 and can handle a max collector current of 0.2A. This transistor is commonly used in amplifier applications due to its high transition frequency of 250MHz.

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$0.034

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Modulus Dynamics

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Benley Electronics

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Advanced Electronics

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Aranea Global

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Aztec Data Supply Inc.

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Perfect Parts

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GreenTree Electronics

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Epart123

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CPlus Electronics

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Futuretech Components

Singapore . 35,000 parts In-Stock

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SupplyDigital Components

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UHIMA Technologies

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Brazil . 199 parts In-Stock

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Lucentia Tech

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Overview

Discover the power of the MMBT3906TT1G by Onsemi, a high-quality Small Signal Bipolar Junction Transistor that delivers exceptional performance and reliability. Manufactured by Onsemi, a leader in semiconductor technology, this PNP transistor offers countless advantages for your amplifier applications. With its surface mount capability, small outline package style, and maximum collector-emitter voltage of 40V, it provides unparalleled value and benefits to customers. Trust the MMBT3906TT1G to deliver superior results, whether you're working on audio amplifiers, signal processing, or other electronic projects. Elevate your designs with this versatile and efficient transistor from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures durability and reliability of the transistor, making it suitable for various applications.

Polarity or Channel Type: PNP

With a PNP polarity or channel type, this transistor is ideal for complementing other PNP transistors in amplifier circuits, allowing for efficient signal amplification.

Configuration: SINGLE

The single configuration of this transistor simplifies circuit design and integration, making it easy to incorporate into amplifier applications.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, this transistor delivers excellent amplification performance, providing clear and powerful audio or signal reproduction.

Surface Mount: YES

With surface mount compatibility, this transistor can be easily mounted onto circuit boards, improving manufacturing efficiency and enabling compact design implementations.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy installation and placement in circuit designs, optimizing space utilization and enhancing overall system integration.

Terminal Form: GULL WING

The gull wing terminal form simplifies soldering and enhances the mechanical stability of the transistor, ensuring secure and reliable connectivity.

No. of Elements: 1

With a single element, this transistor offers a straightforward and simplified circuit connection, reducing complexity during circuit design and implementation.

No. of Terminals: 3

The three terminals enable easy and efficient connectivity to external components, facilitating seamless integration of the transistor into amplifier circuits.

Maximum Power Dissipation (Abs): 0.15 W

The maximum power dissipation of 0.15 W ensures that the transistor can handle high-power applications without overheating or experiencing performance degradation.

Package Style (Meter): SMALL OUTLINE

The small outline package style delivers compactness, allowing for space-saving integration of the transistor in densely populated circuit boards and devices.

Minimum DC Current Gain (hFE): 30

With a minimum DC current gain of 30, this transistor ensures stable and reliable signal amplification, providing consistent and accurate amplification results.

Maximum Operating Temperature: 150 °C

The transistor's ability to operate at a maximum temperature of 150°C guarantees its resilience in demanding environments, ensuring long-lasting performance.

Maximum Collector-Emitter Voltage: 40 V

With a maximum collector-emitter voltage of 40 V, this transistor is capable of handling high voltage inputs, making it suitable for a wide range of amplifier applications.

Transistor Element Material: SILICON

The silicon material composition of the transistor's element ensures excellent performance characteristics, such as high gain, low noise, and fast switching speeds.

Maximum Turn On Time (ton): 70 ns

The maximum turn-on time of 70 ns guarantees quick activation of the transistor, allowing for rapid response in amplifier applications and minimizing signal distortion.

Minimum Operating Temperature: -65 °C

The ability to operate at a minimum temperature of -65°C enables the transistor's functionality in extreme cold environments, expanding its usability range.

Maximum Collector Current (IC): 0.2 A

With a maximum collector current of 0.2 A, this transistor can handle high currents, making it suitable for applications that require significant power amplification.

Maximum Turn Off Time (toff): 300 ns

The maximum turn-off time of 300 ns ensures efficient switching performance, reducing the chances of signal distortion and maintaining signal integrity in amplifier circuits.

Terminal Finish: MATTE TIN

The matte tin terminal finish enhances solderability, ensuring secure and reliable connections between the transistor terminals and external components.

Terminal Position: DUAL

The dual terminal position allows for convenient and flexible circuit board placement, improving overall layout efficiency and enabling ease of connections.

Moisture Sensitivity Level (MSL): 1

With a moisture sensitivity level of 1, this transistor is less susceptible to moisture-induced damage during handling and storage, ensuring long-term reliability.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds guarantees optimum soldering results, minimizing the risk of solder-related defects during manufacturing.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this transistor can withstand high-temperature soldering processes without compromising its performance and reliability.

Nominal Transition Frequency (fT): 250 MHz

With a nominal transition frequency of 250 MHz, this transistor provides high-frequency response capabilities, enabling efficient amplification of signals up to that frequency range.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) MMBT3906TT1G attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

40 V

Configuration:

Minimum DC Current Gain (hFE):

30

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-65 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

PNP

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Maximum Turn Off Time (toff):

300 ns

Maximum Turn On Time (ton):

70 ns

Trade Compliance

MMBT3906TT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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