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UCC2752DTR

Texas Instruments

UCC2752DTR by Texas Instruments

UCC2752DTR by Texas Instruments is a BICMOS technology telecom IC with 16 terminals in a small outline, low profile package. It operates b/w -40 to 85°C, with a nominal voltage of 12V and max supply current of 0.003mA. Ideal for telecom circuits requiring dual terminal position and tin lead finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,543 parts In-Stock

1+ parts

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5,543

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Digiode

USA . 2,648 parts In-Stock

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2,648

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 723 parts In-Stock

1+ parts

$6.671

100+ parts

-

1k+ parts

$7.375

10k+ parts

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723

$6.671

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$7.375

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DigiPath Technology Company

USA . 1,673 parts In-Stock

1+ parts

$7.345

100+ parts

$6.757

1k+ parts

-

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1,673

$7.345

$6.757

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ChromeModa Solutions

Germany . 5,899 parts In-Stock

1+ parts

$7.495

100+ parts

$6.146

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-

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5,899

$7.495

$6.146

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IDEA Electronic Components Group

UK . 1,997 parts In-Stock

1+ parts

$7.495

100+ parts

-

1k+ parts

$6.746

10k+ parts

-

1,997

$7.495

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$6.746

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AZTECH Wire

Italy . 298 parts In-Stock

1+ parts

$12.373

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298

$12.373

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One Stop Electronics

USA . 973 parts In-Stock

1+ parts

$104.000

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973

$104.000

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Ampacity Inc.

Singapore . 1,165 parts In-Stock

1+ parts

$403.000

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1,165

$403.000

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Semicontronic

India . 938 parts In-Stock

1+ parts

$549.000

100+ parts

$535.275

1k+ parts

$532.530

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938

$549.000

$535.275

$532.530

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Corphita

USA . 1,225 parts In-Stock

1+ parts

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1,225

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Corohmni

South Africa . 370 parts In-Stock

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370

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Overview

Elevate your telecom interface designs with the UCC2752DTR from Texas Instruments. Known for their high-quality products, Texas Instruments delivers exceptional reliability and performance in every component they manufacture. This small outline, low profile IC offers a wide range of applications in the telecom industry, providing customers with superior power supplies and dual terminal positions. With a nominal supply voltage of 12V and industrial temperature grade, the UCC2752DTR ensures optimal functionality and efficiency for all your telecom circuit needs. Upgrade your projects today with this cutting-edge solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures a lightweight and durable package for the IC, making it suitable for a variety of applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving on production time and costs.

Power Supplies (V): 12

Operates at a standard voltage of 12V, making it compatible with many existing systems and power sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand extended use in various environmental conditions.

Technology: BICMOS

Utilizing BiCMOS technology allows for high-speed operation and low power consumption, making it an efficient choice for telecom applications.

Technical Specifications

Other Function Telecom Interface ICs UCC2752DTR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

1.65 mm

Sub-Category:

Telephone Circuits

Maximum Supply Current:

.003 mA

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.8989 mm

Trade Compliance

UCC2752DTR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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