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UCC2750DW

Texas Instruments

UCC2750DW by Texas Instruments

UCC2750DW by Texas Instruments is a BICMOS technology telecom IC with 28 terminals in a small outline package. It operates b/w -40 to 85°C, has a data rate of 0.25 Mbps, and nominal voltage of 5V. Ideal for telecom circuits, it features nickel palladium gold terminal finish and gull wing form factor.

Median Price

$21.125

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3 parts In-Stock

1+ parts

$22.770

100+ parts

$17.930

1k+ parts

$15.330

10k+ parts

$14.600

3

$22.770

$17.930

$15.330

$14.600

Rochester

USA . 2,855 parts In-Stock

1+ parts

-

100+ parts

$19.480

1k+ parts

$17.430

10k+ parts

$16.400

2,855

-

$19.480

$17.430

$16.400

DigiKey

USA . 2,855 parts In-Stock

1+ parts

-

100+ parts

$16.880

1k+ parts

-

10k+ parts

-

2,855

-

$16.880

-

-

Verical

USA . 2,855 parts In-Stock

1+ parts

-

100+ parts

$24.350

1k+ parts

$21.788

10k+ parts

$20.500

2,855

-

$24.350

$21.788

$20.500

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,973 parts In-Stock

1+ parts

$15.418

100+ parts

-

1k+ parts

-

10k+ parts

-

4,973

$15.418

-

-

-

Vyrian

USA . 2,389 parts In-Stock

1+ parts

$16.230

100+ parts

-

1k+ parts

-

10k+ parts

-

2,389

$16.230

-

-

-

DigiKey Marketplace

USA . 2,955 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,955

-

-

-

-

Pegasus Components GmbH

Germany . 5 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 935 parts In-Stock

1+ parts

$7.451

100+ parts

$691.946

1k+ parts

$6.706

10k+ parts

-

935

$7.451

$691.946

$6.706

-

DigiPath Technology Company

USA . 123 parts In-Stock

1+ parts

$8.205

100+ parts

$7.548

1k+ parts

-

10k+ parts

-

123

$8.205

$7.548

-

-

ChromeModa Solutions

Germany . 4,659 parts In-Stock

1+ parts

$8.372

100+ parts

$6.865

1k+ parts

-

10k+ parts

-

4,659

$8.372

$6.865

-

-

IDEA Electronic Components Group

UK . 567 parts In-Stock

1+ parts

$8.372

100+ parts

$7.953

1k+ parts

$7.535

10k+ parts

-

567

$8.372

$7.953

$7.535

-

Corphita

USA . 3,695 parts In-Stock

1+ parts

$14.607

100+ parts

-

1k+ parts

-

10k+ parts

-

3,695

$14.607

-

-

-

Microchip USA

USA . 1,147 parts In-Stock

1+ parts

$27.240

100+ parts

$26.850

1k+ parts

$26.660

10k+ parts

$26.470

1,147

$27.240

$26.850

$26.660

$26.470

Perfect Parts

USA . 185 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

185

-

-

-

-

Overview

Experience the seamless performance and reliability of the UCC2750DW by Texas Instruments, a top-tier manufacturer known for its cutting-edge technology. This telecom interface IC offers unparalleled quality and efficiency in various applications. With a small outline package and dual terminals, this product ensures easy installation and maximum functionality. Trust in Texas Instruments to deliver superior products like the UCC2750DW that provide exceptional value and benefits to our customers. Upgrade your telecommunications systems with this innovative solution today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and protection for the internal components of the IC, making it suitable for various operating environments.

Surface Mount: YES

Being surface mountable, this IC can be easily integrated into circuit boards, saving space and simplifying manufacturing processes.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this IC can withstand demanding thermal conditions without performance degradation.

Nominal Supply Voltage: 5 V

The 5V supply voltage allows for compatibility with standard power sources, making integration into existing systems convenient.

Data Rate: 0.25 Mbps

The data rate of 0.25 Mbps indicates that this IC is capable of handling moderate-speed telecommunications applications efficiently.

Technical Specifications

Other Function Telecom Interface ICs UCC2750DW attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

.25 Mbps

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

UCC2750DW Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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