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UCC2751DTR

Texas Instruments

UCC2751DTR by Texas Instruments

UCC2751DTR by Texas Instruments is a BICMOS technology telecom IC with 16 terminals in a small outline package. It operates b/w -40 to 85°C, ideal for industrial applications. With a nominal voltage of 12V, it's suitable for telecom circuit interfaces due to its dual terminal position and gull wing form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,017 parts In-Stock

1+ parts

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8,017

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Digiode

USA . 4,078 parts In-Stock

1+ parts

-

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4,078

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 743 parts In-Stock

1+ parts

$7.503

100+ parts

-

1k+ parts

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743

$7.503

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Parana Technologies

USA . 169 parts In-Stock

1+ parts

$8.766

100+ parts

-

1k+ parts

$9.449

10k+ parts

-

169

$8.766

-

$9.449

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DigiPath Technology Company

USA . 2,021 parts In-Stock

1+ parts

$9.653

100+ parts

$8.881

1k+ parts

-

10k+ parts

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2,021

$9.653

$8.881

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ChromeModa Solutions

Germany . 5,045 parts In-Stock

1+ parts

$9.850

100+ parts

$8.077

1k+ parts

-

10k+ parts

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5,045

$9.850

$8.077

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IDEA Electronic Components Group

UK . 225 parts In-Stock

1+ parts

$9.850

100+ parts

$9.358

1k+ parts

$8.865

10k+ parts

-

225

$9.850

$9.358

$8.865

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One Stop Electronics

USA . 1,296 parts In-Stock

1+ parts

$304.000

100+ parts

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1,296

$304.000

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Corphita

USA . 4,396 parts In-Stock

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4,396

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Overview

Elevate your telecom interface designs with the UCC2751DTR by Texas Instruments. Known for their cutting-edge technology and high-quality manufacturing, Texas Instruments delivers superior performance and reliability. This versatile IC is perfect for a wide range of applications in the telecom industry, offering customers exceptional value and benefits. With its compact size, wide operating temperature range, and innovative BICMOS technology, the UCC2751DTR is a game-changer in the world of telecom interface ICs. Elevate your designs today with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the telecom interface IC, ensuring a longer lifespan.

Surface Mount: YES

Being surface mountable makes the IC easier to install and offers more flexibility in placement on the PCB.

No. of Terminals: 16

Having 16 terminals allows for multiple connections and functionalities, making it suitable for complex telecom applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand harsh environmental conditions without any performance issues.

Technology: BICMOS

Utilizing BICMOS technology ensures high performance and power efficiency, making it an ideal choice for telecom interface applications.

Nominal Supply Voltage: 12 V

Operating at a nominal supply voltage of 12V allows for compatibility with standard power sources in telecom systems.

Technical Specifications

Other Function Telecom Interface ICs UCC2751DTR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

UCC2751DTR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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