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UCC2750DWTRG4

Texas Instruments

UCC2750DWTRG4 by Texas Instruments

UCC2750DWTRG4 by Texas Instruments is a BICMOS technology telecom IC with 28 terminals in a small outline package. It operates b/w -40 to 85°C, suitable for industrial applications. With a nominal voltage of 5V, it is ideal for telecom circuit interfaces requiring high performance and reliability.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,958 parts In-Stock

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Digiode

USA . 2,112 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Parana Technologies

USA . 1,427 parts In-Stock

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$5.723

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$6.516

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$5.723

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$6.516

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DigiPath Technology Company

USA . 1,628 parts In-Stock

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$6.301

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ChromeModa Solutions

Germany . 6,378 parts In-Stock

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$6.430

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$5.273

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IDEA Electronic Components Group

UK . 609 parts In-Stock

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$6.430

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$5.787

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609

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$5.787

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AZTECH Wire

Italy . 479 parts In-Stock

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$11.365

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Ampacity Inc.

Singapore . 174 parts In-Stock

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$136.000

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One Stop Electronics

USA . 448 parts In-Stock

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$761.000

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Corphita

USA . 4,940 parts In-Stock

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Aranea Global

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Microchip USA

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Overview

Unlock the potential of your telecom interface applications with the UCC2750DWTRG4 by Texas Instruments. Known for its high-quality manufacturing standards, Texas Instruments delivers reliability and performance in every product. This versatile IC offers seamless integration, enhanced functionality, and increased efficiency, making it a valuable asset for your projects. Trust in Texas Instruments to provide cutting-edge solutions that elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, perfect for telecommunications applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and labor costs.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact design, ideal for space-constrained applications.

No. of Terminals: 28

With 28 terminals, this product provides multiple connection options for various telecom interfaces.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves board space and enables high-density mounting, making it suitable for modern telecommunication systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to operate in extreme cold conditions without performance degradation.

Technology: BICMOS

The BICMOS technology offers a combination of high-speed performance and low power consumption, making it an efficient choice for telecom applications.

Nominal Supply Voltage: 5 V

The 5V supply voltage is a common standard in many telecommunication systems, ensuring compatibility with existing infrastructure.

Technical Specifications

Other Function Telecom Interface ICs UCC2750DWTRG4 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G28

Length:

17.9 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

UCC2750DWTRG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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